Image based substrate mapper

Patent metadata

Field	Value
Publication number	US-10784134-B2
Application number	US-201815958327-A
Country	US
Kind code	B2
Filing date	Apr 20, 2018
Priority date	May 3, 2017
Publication date	Sep 22, 2020
Grant date	Sep 22, 2020

Abstract

Methods and apparatus for detecting warpage in a substrate are provided herein. In some embodiments, a warpage detector for detecting warpage in substrates includes: one or more light sources to illuminate one or more substrates when present; a camera for capturing images of exposed portions of one or more substrates when present; a motion assembly having a mounting stage for supporting the camera; and a data acquisition interface (DAI) coupled to the camera to process substrate images and detect warpage of substrates based upon the processed substrate images.

First claim

The invention claimed is:

1. A warpage detector for detecting warpage in substrates, the warpage detector comprising:
one or more light sources disposed in a front opening of a substrate storage cassette;
a camera for capturing images of exposed portions of one or more substrates when present;
a motion assembly having a mounting stage for supporting the camera; and
a data acquisition interface (DAI) coupled to the camera to process substrate images and detect warpage of substrates based upon the processed substrate images,
wherein the camera includes a focus lens configured to resolve and capture an edge of a substrate having a thickness between about 300 micrometers and about 3000 micrometers.

2. The warpage detector of claim 1 , wherein the mounting stage is coupled to a vertical support, wherein the mounting stage is configured to rotate laterally about the vertical support, and wherein the mounting stage is configured to move vertically along the vertical support.

3. The warpage detector of claim 1 , wherein the one or more light sources are disposed above a viewfinder of the camera.

4. The warpage detector of claim 1 , wherein the one or more light sources comprise diffusive light.

5. The warpage detector of claim 1 , wherein the one or more light sources comprise light emitting diodes (LEDs).

6. The warpage detector of claim 1 , wherein the camera has a mass of less than about 300 grams.

7. The warpage detector of claim 1 , wherein the DAI further comprises a user input shell.

8. The warpage detector of claim 1 , wherein the DAI further comprises a data storage device.

9. The warpage detector of claim 1 , wherein the motion assembly further comprises a robotic arm.

10. A substrate processing system, comprising:
one or more process chambers;
a transfer chamber;
a pair of load lock chambers;
a plurality of substrate storage cassettes each having a front opening and configured to receive and hold a plurality of substrates;
a substrate storage cassette loader to shuttle cassettes of substrates between the pair of load lock chambers and the plurality of substrate storage cassettes; and
a warpage detector for detecting warpage of substrates in the plurality of substrate storage cassettes, the warpage detector comprising:
one or more light sources disposed in the front opening of each substrate storage cassette of the plurality of substrate storage cassettes to illuminate one or more substrates when present;
a camera for capturing images of exposed portions of one or more substrates when present, wherein the camera includes a focus lens configured to resolve and capture an edge of a substrate having a thickness between about 300 micrometers and about 3000 micrometers;
a motion assembly having a mounting stage for supporting the camera; and
a data acquisition interface (DAI) coupled to the camera to process substrate images and detect warpage of substrates based upon the processed substrate images.

11. The substrate processing system of claim 10 , further comprising a microprocessor for providing communication between the DAI and the substrate storage cassette loader.

12. The substrate processing system of claim 10 , wherein the substrate storage cassette loader comprises a robotic arm having a rear end disposed proximate a central pivot and a blade having an edge gripper or vacuum gripper for securing substrates during transfer.

13. The substrate processing system of claim 12 , wherein the camera is mounted on the rear end.

14. A method for detecting warpage in a substrate for processing, comprising:
(a) capturing an image of an edge of the substrate having a thickness between about 300 micrometers and about 3000 micrometers;
(b) processing the image of the edge of the substrate;
(c) determining an extent of warpage in the substrate from the processed image; and
(d) communicating results including accepted substrates to one or more microprocessors so that only the accepted substrates are processed.

15. The method of claim 14 , wherein during the capturing of the image of the edge of the substrate, the substrate is illuminated with diffusive light.

16. The method of claim 14 , wherein the processing of the image of the edge of the substrate includes image noise filtering.

17. The method of claim 14 , wherein determining the extent of warpage in the substrate comprises comparing image data of the substrate edge image to a warpage threshold standard.

18. The method of claim 14 , wherein (a) to (c) are sequentially performed on a plurality of substrates contained in a substrate storage cassette.

Assignees

• Applied Materials Inc

Inventors

• Peh Eng Sheng
• Balakrishnan Karthik
• Thirunavukarasu Sriskantharajah

Classifications

• H10P72/3218

  Conveying cassettes, containers or carriers · CPC title

• H10P72/0608

  of substrates stored in a container, a magazine, a carrier, a boat or the like · CPC title

• H10P72/0451

  Apparatus for manufacturing or treating in a plurality of work-stations · CPC title

• H10P72/53

  using optical controlling means · CPC title

• H10P72/0616 Primary

  Monitoring of warpages, curvatures, damages, defects or the like · CPC title