Thermal model obfuscation

Patent metadata

Field	Value
Publication number	US-10783303-B2
Application number	US-201816000888-A
Country	US
Kind code	B2
Filing date	Jun 6, 2018
Priority date	Jun 6, 2017
Publication date	Sep 22, 2020
Grant date	Sep 22, 2020

Abstract

Various aspects of a technology disclosed herein relate to thermal model obfuscation. A thermal model for a first assembly is received. An obfuscated thermal model is then generated from the thermal model. The generation comprises replacing name or names associated with one or more objects in the first assembly with obfuscated names. The obfuscated thermal model can be used in a thermal simulation of a second assembly, of which the first assembly is a component.

First claim

What is claimed is:

1. A method, executed by at least one processor of a computer, comprising:
receiving a thermal model for a first assembly;
generating an obfuscated thermal model from the thermal model, wherein the generating comprises: replacing name or names associated with one or more objects in the first assembly with obfuscated names, and removing annotations in the thermal model; and
storing the obfuscated thermal model for being used in a thermal simulation of a second assembly, of which the first assembly is a component.

2. The method recited in claim 1 , further comprising:
performing the thermal simulation on the second assembly based on the obfuscated thermal model.

3. The method recited in claim 1 , further comprising:
storing information of the thermal model and information of the obfuscated thermal model in a cross-referenced way.

4. The method recited in claim 1 , wherein the generating further comprises:
varying one or more parameters in the thermal model within a predetermined range.

5. The method recited in claim 1 , wherein the generating further comprises:
varying two or more parameters in the thermal model such that effects on thermal properties are cancelled out.

6. The method recited in claim 1 , wherein the first assembly is a chip package.

7. One or more non-transitory computer-readable media storing computer-executable instructions for causing one or more processors to perform a method, the method comprising:
receiving a thermal model for a first assembly;
generating an obfuscated thermal model from the thermal model, wherein the generating comprises: replacing name or names associated with one or more objects in the first assembly with obfuscated names, removing annotations in the thermal model; and
storing the obfuscated thermal model for being used in a thermal simulation of a second assembly, of which the first assembly is a component.

8. The one or more non-transitory computer-readable media recited in claim 7 , wherein the method further comprises:
performing the thermal simulation on the second assembly based on the obfuscated thermal model.

9. The one or more non-transitory computer-readable media recited in claim 7 , wherein the method further comprises:
storing information of the thermal model and information of the obfuscated thermal model in a cross-referenced way.

10. The one or more non-transitory computer-readable media recited in claim 7 , wherein the generating further comprises:
varying one or more parameters in the thermal model within a predetermined range.

11. The one or more non-transitory computer-readable media recited in claim 7 , wherein the generating further comprises:
varying two or more parameters in the thermal model such that effects on thermal properties are cancelled out.

12. The one or more non-transitory computer-readable media recited in claim 7 , wherein the first assembly is a chip package.

13. A system, comprising:
one or more processors, the one or more processors programmed to perform a method, the method comprising:
receiving a thermal model for a first assembly;
generating an obfuscated thermal model from the thermal model, wherein the generating comprises: replacing name or names associated with one or more objects in the first assembly with obfuscated names, removing annotations in the thermal model; and
storing the obfuscated thermal model for being used in a thermal simulation of a second assembly, of which the first assembly is a component.

14. The system recited in claim 13 , wherein the method further comprises:
performing the thermal simulation on the second assembly based on the obfuscated thermal model.

15. The system recited in claim 14 , wherein the method further comprises:
storing information of the thermal model and information of the obfuscated thermal model in a cross-referenced way.

16. The system recited in claim 14 , wherein the generating further comprises:
varying one or more parameters in the thermal model within a predetermined range.

17. The system recited in claim 14 , wherein the generating further comprises:
varying two or more parameters in the thermal model such that effects on thermal properties are cancelled out.

Assignees

• Mentor Graphics Corp

Inventors

• Parry John
• Bornoff Robin
• Wilson John Richard

Classifications

• G06F30/367

  Design verification, e.g. using simulation, simulation program with integrated circuit emphasis [SPICE], direct methods or relaxation methods · CPC title

• G06F30/3323 Primary

  using formal methods, e.g. equivalence checking or property checking · CPC title