Substrate processing method and substrate processing system
US-2024173742-A1 · May 30, 2024 · US
US10781530B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10781530-B2 |
| Application number | US-201715636041-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 28, 2017 |
| Priority date | Jun 28, 2016 |
| Publication date | Sep 22, 2020 |
| Grant date | Sep 22, 2020 |
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Official abstract text for this publication.
A cleaning apparatus is provided. This cleaning apparatus includes an inlet, an outlet, a first conveyance path, a second conveyance path, a cleaning unit disposed on the first conveyance path and configured to clean the target object in a non-contacting manner, and a drying unit disposed on the first conveyance path and configured to dry the target object in a non-contacting manner. The first conveyance path and the second conveyance path are vertically arranged side by side. The second conveyance path is positioned above the first conveyance path and connected with the outlet at an end point. The second conveyance path functions as a stocker configured to temporarily store the target object.
Opening claim text (preview).
The invention claimed is: 1. A cleaning apparatus comprising: an inlet for a target object; an outlet for the target object; a first conveyance path on which the target object input through the inlet is conveyed; a second conveyance path on which the target object is conveyed in a direction opposite to a direction of conveyance of the target object on the first conveyance path and that is connected with the first conveyance path and the outlet; a cleaning unit disposed on the first conveyance path and configured to clean the target object in a non-contacting manner; and a drying unit disposed on the first conveyance path and configured to dry the target object in a non-contacting manner, wherein: the second conveyance path is positioned above the first conveyance path and connected with the outlet at an end point, and the second conveyance path functions as a stocker configured to temporarily store the target object. 2. The cleaning apparatus according to claim 1 , further comprising a blowing unit disposed on the second conveyance path and configured to send gas downward from above. 3. The cleaning apparatus according to claim 1 , further comprising: a vertical conveyance path connecting the first conveyance path and the second conveyance path; and a vertical conveyance mechanism configured to convey the target object in a vertical direction through the vertical conveyance path from the first conveyance path to the second conveyance path. 4. The cleaning apparatus according to claim 1 , further comprising: an inlet shutter configured to open and close the inlet; and an outlet shutter configured to open and close the outlet. 5. The cleaning apparatus according to claim 1 , wherein the cleaning unit includes: a first cleaning unit configured to spray cleaning liquid onto the target object; and a second cleaning unit configured to spray cleaning liquid and gas simultaneously onto the target object. 6. A cleaning apparatus comprising: an inlet for a target object; an outlet for the target object; a first conveyance path on which the target object input through the inlet is conveyed; a second conveyance path on which the target object is conveyed in a direction opposite to a direction of conveyance of the target object on the first conveyance path and that is connected with the first conveyance path and the outlet; a cleaning unit disposed on the first conveyance path and configured to clean the target object in a non-contacting manner; and a drying unit disposed on the first conveyance path and configured to dry the target object in a non-contacting manner, the cleaning apparatus further comprising: an outlet shutter configured to open and close the outlet; and a blowing unit disposed at an end point of the second conveyance path and configured to send gas downward from above, wherein the second conveyance path functions as a stocker configured to temporarily store the target object. 7. The cleaning apparatus according to claim 6 , further comprising: a vertical conveyance path connecting the first conveyance path and the second conveyance path; and a vertical conveyance mechanism configured to convey the target object in a vertical direction through the vertical conveyance path from the first conveyance path to the second conveyance path. 8. The cleaning apparatus according to claim 6 , further comprising an inlet shutter configured to open and close the inlet. 9. The cleaning apparatus according to claim 6 , wherein the cleaning unit includes: a first cleaning unit configured to spray cleaning liquid onto the target object; and a second cleaning unit configured to spray cleaning liquid and gas simultaneously onto the target object. 10. A plating apparatus comprising the cleaning apparatus according to claim 1 , further comprising: a processing unit; and a substrate conveying unit, wherein the substrate conveying unit is configured to input the target object that has been subjected to plating processing by the processing unit to the inlet of the cleaning apparatus and take the target object processed by the cleaning apparatus out of the outlet. 11. A cleaning apparatus comprising: an inlet for a target object; an outlet for the target object; a first conveyance path on which the target object input through the inlet is conveyed; a second conveyance path on which the target object is conveyed in a direction opposite to a direction of conveyance of the target object on the first conveyance path and that is connected with the first conveyance path and the outlet; a cleaning unit disposed on the first conveyance path and configured to clean the target object in a non-contacting manner; and a drying unit disposed on the first conveyance path and configured to dry the target object in a non-contacting manner, wherein: the second conveyance path is positioned above the first conveyance path and connected with the outlet at an end point, the cleaning apparatus further comprising: an outlet shutter configured to open and close the outlet; and a blowing unit disposed at the end point of the second conveyance path and configured to send gas downward from above. 12. The cleaning apparatus according to claim 11 , wherein the second conveyance path functions as a stocker configured to temporarily store the target object. 13. The cleaning apparatus according to claim 11 further comprising: a vertical conveyance path connecting the first conveyance path and the second conveyance path; and a vertical conveyance mechanism configured to convey the target object in a vertical direction through the vertical conveyance path from the first conveyance path to the second conveyance path. 14. The cleaning apparatus according to claim 11 , further comprising an inlet shutter configured to open and close the inlet. 15. The cleaning apparatus according to claim 11 , wherein the cleaning unit includes: a first cleaning unit configured to spray cleaning liquid onto the target object; and a second cleaning unit configured to spray cleaning liquid and gas simultaneously onto the target object. 16. A plating apparatus comprising the cleaning apparatus according to claim 11 , further comprising: a processing unit; and a substrate conveying unit, wherein the substrate conveying unit is configured to input the target object that has been subjected to plating processing by the processing unit to the inlet of the cleaning apparatus and take the target object processed by the cleaning apparatus out of the outlet. 17. A method of cleaning a target object in a cleaning apparatus, the cleaning apparatus including an inlet for the target object, an outlet for the target object, a first conveyance path on which the target object input through the inlet is conveyed, a second conveyance path on which the target object is conveyed in a direction opposite to a direction of conveyance of the target object on the first conveyance path and that is connected with the first conveyance path and the outlet, a cleaning unit disposed on the first conveyance path and configured to clean the target object in a non-contacting manner, a drying unit disposed on the first conveyance path and configured to dry the target object in a non-contacting manner, an outlet shutter configured to open and close the outlet, and a blowing unit disposed at the end point of the second conveyance path and configured to send gas downward from above, the method comprising: a process of inputting the target object into the cleaning apparatus through the inlet; a process of conveyin
Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title
during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers · CPC title
characterised by the layout of the process chambers · CPC title
using mainly spraying means, e.g. nozzles · CPC title
Cleaning during device manufacture · CPC title
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