Acrylic-modified alkyd resin and coating material for priming for thin inorganic film

US10781316B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10781316-B2
Application numberUS-201716081556-A
CountryUS
Kind codeB2
Filing dateFeb 23, 2017
Priority dateMar 10, 2016
Publication dateSep 22, 2020
Grant dateSep 22, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided are a coating material that is for undercoating for a thin inorganic film, has excellent adhesiveness to various base materials, and produces no appearance change or no peeling off even under high-temperature conditions, and an acrylic-modified alkyd resin as a raw material for such a coating material. The acrylic-modified alkyd resin includes a copolymer including as essential components: an alkyd resin (A) having an unsaturated bond in a molecular structure; and a polymerizable monomer (B) having an unsaturated bond in a molecular structure. Also provided are a curable composition, a coating material for undercoating for a thin inorganic film, and a molded body including an undercoat layer including the coating material for undercoating for a thin inorganic film.

First claim

Opening claim text (preview).

The invention claimed is: 1. An acrylic-modified alkyd resin comprising a copolymer comprising: an alkyd resin (A) having an unsaturated bond in a molecular structure; and a polymerizable monomer (B) having an unsaturated bond in a molecular structure, wherein the mass ratio [(A)/(B)] of the alkyd resin (A) having an unsaturated bond in a molecular structure to the polymerizable monomer (B) having an unsaturated bond in a molecular structure is 5/95 to 95/5. 2. The acrylic-modified alkyd resin according to claim 1 , wherein the mass ratio [(A)/(B)] of the alkyd resin (A) having an unsaturated bond in a molecular structure to the polymerizable monomer (B) having an unsaturated bond in a molecular structure is 50/50 to 90/10. 3. The acrylic-modified alkyd resin according to claim 1 , wherein the polymerizable monomer (B) having an unsaturated bond in a molecular structure comprises a hydroxyl group-containing (meth)acrylate monomer. 4. The acrylic-modified alkyd resin according to claim 1 , wherein the polymerizable monomer (B) having an unsaturated bond in a molecular structure comprises an aromatic vinyl monomer. 5. A curable composition comprising: the acrylic-modified alkyd resin according to claim 1 ; and a (meth)acrylate compound (X). 6. A cured material obtained by curing the curable composition according to claim 5 . 7. A coating material for undercoating for a thin inorganic film, the coating material comprising the curable composition according to claim 5 . 8. A molded body comprising: an undercoat layer made from the coating material according to claim 7 for undercoating for a thin inorganic film. 9. A curable composition comprising: the acrylic-modified alkyd resin according to claim 2 ; and a (meth)acrylate compound (X). 10. A curable composition comprising: the acrylic-modified alkyd resin according to claim 3 ; and a (meth)acrylate compound (X). 11. A curable composition comprising: the acrylic-modified alkyd resin according to claim 4 ; and a (meth)acrylate compound (X). 12. A cured material obtained by curing the curable composition according to claim 9 . 13. A cured material obtained by curing the curable composition according to claim 10 . 14. A cured material obtained by curing the curable composition according to claim 11 . 15. A coating material for undercoating for a thin inorganic film, the coating material comprising the curable composition according to claim 9 . 16. A coating material for undercoating for a thin inorganic film, the coating material comprising the curable composition according to claim 10 . 17. A coating material for undercoating for a thin inorganic film, the coating material comprising the curable composition according to claim 11 . 18. A molded body comprising: an undercoat layer made from the coating material according to claim 15 for undercoating for a thin inorganic film. 19. A molded body comprising: an undercoat layer made from the coating material according to claim 16 for undercoating for a thin inorganic film. 20. A molded body comprising: an undercoat layer made from the coating material according to claim 17 for undercoating for a thin inorganic film.

Assignees

Inventors

Classifications

  • C08F283/01Primary

    on to unsaturated polyesters {(C08F283/004 takes precedence)} · CPC title

  • {Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond} in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00 · CPC title

  • Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers · CPC title

  • grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds · CPC title

  • Polyesters modified with higher fatty oils or their acids, or with natural resins or resin acids · CPC title

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What does patent US10781316B2 cover?
Provided are a coating material that is for undercoating for a thin inorganic film, has excellent adhesiveness to various base materials, and produces no appearance change or no peeling off even under high-temperature conditions, and an acrylic-modified alkyd resin as a raw material for such a coating material. The acrylic-modified alkyd resin includes a copolymer including as essential compone…
Who is the assignee on this patent?
Dainippon Ink & Chemicals
What technology area does this patent fall under?
Primary CPC classification C08F283/01. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 22 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).