Semiconductor devices and methods of manufacturing
US-12166025-B2 · Dec 10, 2024 · US
US9518205B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9518205-B2 |
| Application number | US-201214358495-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 13, 2012 |
| Priority date | Dec 14, 2011 |
| Publication date | Dec 13, 2016 |
| Grant date | Dec 13, 2016 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
The present invention is an unsaturated polyester resin composition comprising an unsaturated polyester (a), a monomer (b) having one polymerizable carbon-carbon double bond, a monomer (c) having two or more of (meth)acrylate groups, a filler (d) having high thermal conductivity, a glass fiber (e), a low profile additive (f), a curing agent (g), and a polymerization inhibitor (h), wherein the ratio by weight of the ingredient (b) to the ingredient (c) is from 50:50 to 75:25 and the unsaturated polyester resin composition comprises 400 to 1400 parts by weight of the ingredient (d) based on the total 100 parts by weight of the ingredients (a), (b), and (c). This unsaturated polyester resin composition has excellent curing properties without losing storage stability which can be used to provide a cured product having a low mold shrinkage ratio and high thermal conductivity.
Opening claim text (preview).
The invention claimed is: 1. An unsaturated polyester resin composition comprising: an unsaturated polyester (a), styrene (b), one or more monomers (c) selected from the group consisting of ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, PEG #200 dimethacrylate and trimethylolpropane trimethacrylate, aluminum hydroxide and/or aluminum oxide (d), a glass fiber (e), a low profile additive (f), a curing agent (g), and a polymerization inhibitor (h), wherein the ratio by weight of the ingredient (b) to the ingredient (c) is from 50:50 to 73:27 and the unsaturated polyester resin composition comprises 400 to 1350 parts by weight of the ingredient (d) based on the total 100 parts by weight of the ingredients (a), (b), and (c). 2. The unsaturated polyester resin composition according to claim 1 , wherein the ingredient (g) is at least one compound selected from the group consisting of t-butylperoxy-2-ethylhexanoate, t-hexylperoxy-2-ethylhexanoate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, benzoyl peroxide, 1,1-di-t-butylperoxycyclohexane, 1,1-di-t-hexylperoxycyclohexane, 1,1-di-t-butylperoxy-3,3,5-trimethylcyclohexane, t-butylperoxy isopropyl carbonate, t-hexylperoxy isopropyl carbonate, t-butyl peroxybenzoate, t-hexyl peroxybenzoate, 1,6-bis(t-butylperoxycarbonyloxy)hexane, dicumyl peroxide, and di-t-butyl peroxide. 3. An encapsulated motor, produced by encapsulation molding of a motor component with the unsaturated polyester resin composition according to claim 1 . 4. A cured product, obtained by curing the unsaturated polyester resin composition according to claim 1 . 5. The unsaturated polyester resin composition according to claim 1 , wherein the ratio by weight of the ingredient (b) to the ingredient (c) is from 55:45 to 65:35.
containing a filler · CPC title
on to unsaturated polyesters {(C08F283/004 takes precedence)} · CPC title
Insulating casings · CPC title
Windings characterised by the insulating material · CPC title
Solid materials, e.g. powdery or granular · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.