Low temperature cure silicone elastomer

US10774184B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10774184-B2
Application numberUS-201716078267-A
CountryUS
Kind codeB2
Filing dateFeb 21, 2017
Priority dateFeb 23, 2016
Publication dateSep 15, 2020
Grant dateSep 15, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A liquid curable silicone elastomer composition is disclosed. The liquid curable silicone elastomer composition comprises an organopolysiloxane (A) containing at least two silicon-bonded alkenyl groups per molecule, an organopolysiloxane (B) containing at least two silicon-bonded hydrogen atoms per molecule, a platinum based catalyst (C), an inhibitor (D), and a silica filler (E). The organopolysiloxane (B) is a branched polymer, contains M siloxy units, and the at least two silicon-bonded hydrogen atoms are present on the M siloxy units. The inhibitor (D) is selected from the group consisting of acetylenic alcohols and their derivatives. The inhibitor (D) is present in the liquid curable silicone elastomer composition in an amount to provide a molar ratio of the inhibitor (D) to platinum in the catalyst (C)—of from 150 to 900 (150:1 to 900:1).

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of forming a three-dimensional (3D) article, the method comprising: i) printing a first heat-curable silicone composition with a 3D printer to form a layer; ii) heating the layer to form an at least partially cured layer; iii) printing a second heat-curable silicone composition on the at least partially cured layer with the 3D printer to form a subsequent layer; and iv) heating the subsequent layer to form an at least partially cured subsequent layer; v) optionally, repeating steps iii) and iv) with independently selected heat-curable silicone composition(s) for any additional layer(s) to form the 3D article; wherein the first and second heat-curable silicone compositions are the same as or different from one another; and wherein at least one of the first and second heat-curable silicone compositions comprises a liquid curable silicone elastomer composition comprising: an organopolysiloxane (A) containing at least two silicon-bonded alkenyl groups per molecule; an organopolysiloxane (B) containing M siloxy units and at least two silicon-bonded hydrogen atoms per molecule, wherein the at least two silicon-bonded hydrogen atoms are present on the M siloxy units of the organopolysiloxane (B), and the organopolysiloxane (B) is a branched polymer; a platinum based catalyst (C); an inhibitor (D), wherein the inhibitor (D) is selected from the group consisting of acetylenic alcohols and their derivatives, and is present in the liquid curable silicone elastomer composition in an amount to provide a molar ratio of the inhibitor (D) to platinum in the catalyst (C) of from 150 to 900 (150:1 to 900:1); and a silica filler (E). 2. The method of claim 1 , wherein the inhibitor (D) contains at least one unsaturated bond. 3. The method of claim 2 , wherein the at least one unsaturated bond of the inhibitor (D) is in a terminal position. 4. The method of claim 1 , wherein the inhibitor (D) is selected from the group consisting of 1-ethynyl-1-cyclohexanol, 2-methyl-3-butyn-2-ol, 3-butyn-1-ol, 3-butyn-2-ol, propargylalcohol, 2-phenyl-2-propyn-1-ol, 3,5-dimethyl-1-hexyn-3-ol, 1-ethynylcyclopentanol, 1-phenyl-2-propynol, 3-methyl-1-penten-4-yn-3-ol, and mixtures thereof. 5. The method of claim 1 , wherein the organopolysiloxane (B) is of the general formula (II): (R 2 HSiO 1/2 ) x (R 3 SiO 1/2 ) y (RHSiO 2/2 ) z (R 2 SiO 2/2 ) p (RSiO 3/2 ) q (HSiO 3/2 ) v (SiO 4/2 ) r   (II); where each R is independently selected from an aliphatic hydrocarbyl, aromatic hydrocarbyl, or organyl group, H is a hydrogen atom, x≥2, y≥0, z≥0, p≥0, q≥0, v≥0, and r≥0, provided that; when q=0, r>0, when r=0, q>0, and (p+q+r)≥1. 6. The method of claim 5 , wherein x>2, y>0, r>1, and z, p, q, and v=0. 7. The method of claim 1 , wherein the ratio of silicon-bonded hydrogen atoms in organopolysiloxane (B)/alkenyl groups in organopolysiloxane (A) is from 1.1 to 3.5. 8. The method of claim 1 , wherein the silica filler (E) contains at least one alkenyl group on its surface. 9. The method of claim 1 , wherein the liquid curable silicone elastomer composition further comprises an adhesion promoter. 10. The method of claim 1 , wherein the liquid curable silicone elastomer composition is provided in at least two separate parts. 11. The method of claim 1 , wherein heating is further defined as heating at a temperature of from 80 to 140° C. 12. The method of claim 11 , wherein the heating temperature is from 90 to 130° C. 13. The method of claim 1 , comprising step v) wherein steps iii) and iv) are repeated. 14. The method of claim 1 , wherein the first and second heat-curable silicone compositions are the same. 15. The method of claim 1 , wherein the first and second heat-curable silicone compositions are different from one another.

Assignees

Inventors

Classifications

  • Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials · CPC title

  • containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure · CPC title

  • C08L83/04Primary

    Polysiloxanes · CPC title

  • using layers of liquid which are selectively solidified · CPC title

  • with silicon-containing compounds · CPC title

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What does patent US10774184B2 cover?
A liquid curable silicone elastomer composition is disclosed. The liquid curable silicone elastomer composition comprises an organopolysiloxane (A) containing at least two silicon-bonded alkenyl groups per molecule, an organopolysiloxane (B) containing at least two silicon-bonded hydrogen atoms per molecule, a platinum based catalyst (C), an inhibitor (D), and a silica filler (E). The organopol…
Who is the assignee on this patent?
Dow Silicones Corp, Beyer Patrick, Hankammer Ivonne, and 1 more
What technology area does this patent fall under?
Primary CPC classification C08L83/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 15 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).