Curable silicone composition, cured product thereof, and optical semiconductor device

Patent metadata

Field	Value
Publication number	US-9902811-B2
Application number	US-201414769131-A
Country	US
Kind code	B2
Filing date	Feb 21, 2014
Priority date	Feb 22, 2013
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

This invention relates to a curable silicone composition comprising: (A) a straight-chain organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by the following average unit formula: (R 1 SiO 3/2 ) a (R 1 2 SiO 2/2 ) b (R 1 3 SiO 1/2 ) c (SiO 4/2 ) d (XO 1/2 ) e wherein, R 1 each independently represent an alkyl group having from 1 to 12 carbons, an alkenyl group having from 2 to 12 carbons, an aryl group having from 6 to 20 carbons, an aralkyl group having from 7 to 20 carbons, or a group in which some or all of the hydrogen atoms of these groups are substituted with halogen atoms, with the proviso that at least two R 1 in a molecule are the alkenyl groups, X is a hydrogen atom or an alkyl group, a is a number from 0 to 0.3, b is 0 or a positive number, c is a positive number, d is a positive number, e is a number from 0 to 0.4, a+b+c+d=1, c/d is a number from 0 to 10, and b/d is a number from 0 to 0.5; (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (D) a cerium-containing organopolysiloxane; and (E) a hydrosilylation reaction catalyst. The curable silicone composition does not develop cracks due to thermal aging and can form a cured product having little yellow discoloration.

First claim

The invention claimed is:

1. A curable silicone composition comprising:
(A) a straight-chain organopolysiloxane having at least two alkenyl groups in a molecule;
(B) an organopolysiloxane represented by the following average unit formula:
(R 1 SiO 3/2 ) a (R 1 2 SiO 2/2 ) b (R 1 3 SiO 1/2 ) c (SiO 4/2 ) d (XO 1/2 ) e

 wherein, R 1 each independently represent an alkyl group having from 1 to 12 carbon atoms, an alkenyl group having from 2 to 12 carbon atoms, an aryl group having from 6 to 20 carbon atoms, an aralkyl group having from 7 to 20 carbon atoms, or a group in which some or all of hydrogen atoms of these groups are substituted with halogen atoms, with the proviso that at least two R 1 in a molecule are the alkenyl groups, X is a hydrogen atom or an alkyl group, a is a number from 0 to 0.3, b is 0 or a positive number, c is a positive number, d is a positive number, e is a number from 0 to 0.4, a+b+c+d=1, c/d is a number from 0 to 10, and b/d is a number from 0 to 0.5, in an amount such that the mass ratio of component (A) to component (B) is from 1/99 to 99/1;
(C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, in an amount such that the amount of silicon-bonded hydrogen atoms in this component is from 0.1 to 10 moles per 1 mol of the total alkenyl groups in components (A) and (B);
(D) a cerium-containing organopolysiloxane, in an amount such that the amount of cerium atoms in component (D) is from 25 to 67 ppm in terms of mass units with respect to the total mass of the composition; and
(E) a catalytic quantity of a hydrosilylation reaction catalyst.

2. The curable silicone composition according to claim 1 , wherein, in component (B), 0.1 to 40 mol % of all R 1 are alkenyl groups having from 2 to 12 carbon atoms, and at least 10 mol % of all R 1 are alkyl groups having from 1 to 12 carbon atoms.

3. The curable silicone composition according to claim 1 , wherein component (B) is an organopolysiloxane comprising: R 1 (CH 3 ) 2 SiO 1/2 units (wherein, R 1 is an alkyl group having from 1 to 12 carbon atoms, an alkenyl group having from 2 to 12 carbon atoms, an aryl group having from 6 to 20 carbon atoms, an aralkyl group having from 7 to 20 carbon atoms, or a group in which some or all of the hydrogen atoms of these groups are replaced with halogen atoms, with the provision that at least two R 1 in a molecule are the alkenyl groups) and SiO 4/2 units.

4. The curable silicone composition according to claim 1 , further comprising (F) a hydrosilylation reaction inhibitor in an amount equal to 0.01 to 3 parts by mass per 100 parts by mass of the total mass of components (A) to (D).

5. The curable silicone composition according to claim 1 , further comprising (G) an adhesion promoter in an amount equal to 0.1 to 3 parts by mass per 100 parts by mass of the total mass of components (A) to (D).

6. The curable silicone composition according to claim 1 , further comprising (H) a phosphor in an amount equal to 0.1 to 70% by mass with respect to the total mass of the composition.

7. The curable silicone composition according to claim 1 , the curable silicone composition forming a cured product with an optical transmittance at 450 nm of at least 90%.

8. The curable silicone composition according to claim 1 , the curable silicone composition forming a cured product with a value of b* of not more than 2.0 in the CIE L*a*b* color system prescribed by JIS Z8730 before or after heating for 500 hours at 240° C.

9. The curable silicone composition according to claim 1 , for sealing, covering, or adhering an optical semiconductor element in an optical semiconductor device.

10. A cured product, obtained by curing the curable silicone composition according to claim 1 .

11. The cured product according to claim 10 , wherein the cured product is in the form of a lens, a light pipe, a light guide, or a remote phosphor component.

12. An optical semiconductor device, formed by sealing, covering, or adhering an optical semiconductor element in the semiconductor device with the curable silicone composition according to claim 1 .

13. The optical semiconductor device according to claim 12 , wherein the optical semiconductor device is a light emitting diode.

14. The optical semiconductor device according to claim 12 , wherein the curable silicone composition contains at least one phosphor.

15. The optical semiconductor device according to claim 12 , wherein the color shift over time is reduced.

16. The optical semiconductor device according to claim 12 , wherein the luminous flux maintenance over time is improved.

17. The cured product according to claim 10 , wherein the flammability of the cured product is reduced.

Assignees

• Dow Corning Toray Co Ltd
• Dow Corning
• Dow Corning Toray Co Ltd

Inventors

• Dent Stanton James
• Iimura Tomohiro
• Miyamoto Yusuke
• Morita Yoshitsugu
• Nishida Fumito
• Radkov Emil
• Steinbrecher Jacob William
• Yoshida Hiroaki
• Yoshitake Makoto

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• C08G77/58

  Metal-containing linkages · CPC title

• C08K5/56

  Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond · CPC title