Curable resin composition

US10774166B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10774166-B2
Application numberUS-201515513594-A
CountryUS
Kind codeB2
Filing dateJul 10, 2015
Priority dateSep 29, 2014
Publication dateSep 15, 2020
Grant dateSep 15, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An object of the present invention is to provide a curable resin composition having low viscosity and being capable of forming a cured product which is excellent in the flexibility and the heat resistance. The present invention is a curable resin composition including: a (meth)acrylic group-containing vinyl-based polymer (A), a monomer (B) represented by the following Chemical formula (1), and a radical initiator (C).

First claim

Opening claim text (preview).

The invention claimed is: 1. A curable resin composition comprising: a (meth)acrylic group-containing vinyl-based polymer (A), a monomer (B) represented by the following Chemical formula (1), and a radical initiator (C) wherein the component (A) has a (meth)acrylic group where at least one (meth)acrylic group is at an end of the molecule, and the component (A) is a polymer having a main chain skeleton derived from a (meth)acrylic monomer, wherein the component (B) is contained in an amount of 30 to 90 parts by mass based on 100 parts by mass of the total amount of the components (A) and (B), wherein the component (C) is contained in an amount of 0.5 to 5 parts by mass based on 100 parts by mass of the total amount of the components (A) and (B), wherein the curable resin composition does not comprise a compound having a (meth)acryloyl group, other than component (A) and component (B), and wherein change rate of the tensile strength of a cured product thereof after heat-resistance test for 168 hours at 120° C. is less than ±25%. 2. The curable resin composition according to claim 1 , wherein the radical initiator (C) is a photoradical polymerization initiator or an organic peroxide. 3. The curable resin composition according to claim 1 , wherein the curable resin composition is a curable resin composition for a sealing agent or a potting agent. 4. The curable resin composition according to claim 1 , wherein the curable resin composition is a curable resin composition for a sealing agent for an in-vehicle control device case or an in-vehicle motor case. 5. The curable resin composition according to claim 1 , wherein the curable resin composition is a curable resin composition for potting for an in-vehicle electrical and electronic part. 6. The curable resin composition according to claim 1 , wherein said composition further comprising saccharine. 7. The curable resin composition according to claim 1 , wherein a change rate of the hardness or tensile strength of a cured product thereof after said heat-resistance test of 168 at 120° C. is 10% or less. 8. The curable resin composition according to claim 1 , wherein said component (A) has a viscosity of 100 to 1000 Pa-s at a temperature of 23° C. 9. The curable resin composition according to claim 1 , wherein the component (C) is contained in an amount of 3 to 5 parts by mass based on 100 parts by mass of the total amount of the components (A) and (B). 10. The curable resin composition according to claim 1 , wherein the component (B) is contained in an amount of 50 to 90 parts by mass based on 100 parts by mass of the total amount of the components (A) and (B). 11. The curable resin composition according to claim 1 , wherein the component (B) is contained in an amount of 30 to 50 parts by mass based on 100 parts by mass of the total amount of the components (A) and (B).

Assignees

Inventors

Classifications

  • C10or C11-(Meth)acrylate, e.g. isodecyl (meth)acrylate, isobornyl (meth)acrylate or 2-naphthyl (meth)acrylate · CPC title

  • Polymers of unsaturated carboxylic acids or derivatives thereof · CPC title

  • Homopolymers or copolymers of amides or imides · CPC title

  • Stabilised against heat, light or radiation or oxydation · CPC title

  • {Materials in mouldable or extrudable form} for sealing or packing joints or covers (filling pastes C09D5/34) · CPC title

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What does patent US10774166B2 cover?
An object of the present invention is to provide a curable resin composition having low viscosity and being capable of forming a cured product which is excellent in the flexibility and the heat resistance. The present invention is a curable resin composition including: a (meth)acrylic group-containing vinyl-based polymer (A), a monomer (B) represented by the following Chemical fo…
Who is the assignee on this patent?
Three Bond Co Ltd
What technology area does this patent fall under?
Primary CPC classification C08F220/1811. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 15 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).