Anhydrous substrate cleaning composition, substrate treating method, and substrate treating apparatus

US10773281B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10773281-B2
Application numberUS-201715721188-A
CountryUS
Kind codeB2
Filing dateSep 29, 2017
Priority dateSep 30, 2016
Publication dateSep 15, 2020
Grant dateSep 15, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Disclosed are an anhydrous substrate cleaning composition, a substrate treating method, and a substrate treating apparatus. The substrate cleaning composite includes an etching compound that provides a component for treating a substrate, and a solvent that dissolves the etching compound, wherein the substrate cleaning composite is an anhydrous composite that does not include water.

First claim

Opening claim text (preview).

What is claimed is: 1. A substrate cleaning composite comprising: an etching compound that provides a component for treating a substrate; a binder that prevents particles separated from the substrate from being attached to the substrate again, wherein the binder is isopropoxy ethanol; and a solvent that dissolves the etching compound, wherein the substrate cleaning composite is an anhydrous composite that does not include water. 2. The substrate cleaning composite of claim 1 , wherein the etching compound includes fluorine. 3. The substrate cleaning composite of claim 1 , wherein the etching compound is ammonium fluoride. 4. The substrate cleaning composite of claim 1 , wherein the etching compound is hydrogen fluoride. 5. The substrate cleaning composite of claim 1 , wherein the solvent is acetic anhydride. 6. The substrate cleaning composite of claim 1 , wherein the solvent is acetic acid. 7. The substrate cleaning composite of claim 1 , wherein the solvent is propylene carbonate. 8. The substrate cleaning composite of claim 1 , further comprising: a phase change assistant material that improves a solubility of a supercritical fluid. 9. The substrate cleaning composite of claim 8 , wherein the phase change assistant material is alcohol. 10. The substrate cleaning composite of claim 8 , wherein the phase change assistant material is isopropyl alcohol. 11. The substrate cleaning composite of claim 8 , wherein the phase change assistant material is methanol. 12. The substrate cleaning composite of claim 8 , wherein the phase change assistant material is ethanol. 13. A substrate cleaning composite comprising: an etching compound that provides a component for treating a substrate; a binder that prevents particles separated from the substrate from being attached to the substrate again, wherein the binder is isopropoxy ethanol; a solvent that dissolves the etching compound; and a phase change assistant material that improves a solubility for a supercritical fluid. 14. The substrate cleaning composite of claim 13 , wherein the etching compound is ammonium fluoride, and wherein the solvent is acetic anhydride. 15. The substrate cleaning composite of claim 14 , wherein the phase change assistant material is isopropyl alcohol.

Assignees

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Classifications

  • characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

  • mainly by convection · CPC title

  • using mainly spraying means, e.g. nozzles · CPC title

  • using mainly spraying means, e.g. nozzles · CPC title

  • by chemical means · CPC title

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What does patent US10773281B2 cover?
Disclosed are an anhydrous substrate cleaning composition, a substrate treating method, and a substrate treating apparatus. The substrate cleaning composite includes an etching compound that provides a component for treating a substrate, and a solvent that dissolves the etching compound, wherein the substrate cleaning composite is an anhydrous composite that does not include water.
Who is the assignee on this patent?
Semes Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10P72/0434. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 15 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).