Heat dissipation device and method, and electronic device

Patent metadata

Field	Value
Publication number	US-10772236-B2
Application number	US-201916452886-A
Country	US
Kind code	B2
Filing date	Jun 26, 2019
Priority date	Jun 26, 2018
Publication date	Sep 8, 2020
Grant date	Sep 8, 2020

Abstract

A heat dissipation device for an electronic device is provided. The heat dissipation device comprises a heat conducting cover configured to be disposed on an electronic device, the heat conducting cover forming a closed cavity; and a heat absorbing material filler located within the closed cavity as defined by the heat conducting cover. With a temperature increase of the electronic device, the heat absorbing material filler is configured to deform structurally, to absorb heat generated by the electronic device.

First claim

What is claimed is:

1. A heat dissipation device, comprising:
a heat conducting cover configured to be disposed in an electronic device, the heat conducting cover forming a closed cavity accommodating a heating element of the electronic device, the heat conducting cover comprising a heat conductive shape-memory material, the heat conducting cover configured to deform from a first shape to a second shape after a temperature increases to a first threshold, and configured to restore from the second shape to the first shape after the temperature decreases to a second threshold;
a heat absorbing material filler located within the closed cavity as defined by the heat conducting cover,
wherein, in response to a temperature increase, the heat absorbing material filler is configured to deform structurally, to absorb heat generated by the heating element.

2. The heat dissipation device according to claim 1 , wherein:
in response to the heat conducting cover being in the first shape, the heat absorbing material filler does not a contact the heating element of the electronic device; and
in response to the heat conducting cover being in the second shape, the heat absorbing material filler contacts the heating element.

3. The heat dissipation device according to claim 2 , wherein:
in response to that the heat conducting cover is in the first shape, the heat conducting cover is in contact with a housing of the electronic device, and
in response to that the heat conducting cover is in the second shape, there is a gap between the heat conducting cover and the housing of the electronic device.

4. The heat dissipation device according to claim 3 , wherein: the first shape is a hollow concave shape, and a concave surface of the heat conducting cover faces the housing of the electronic device; the heating element is located at an intermediate position of the closed cavity of the heat conducting cover, and the heat absorbing material filler is located at both ends of the concave cavity of the heat conducting cover; and the second shape is a hollow rectangular shape, and the heat absorbing material filler is able to fill the closed cavity of the heat conducting cover.

5. The heat dissipation device according to claim 3 , wherein: the heat absorbing material filler is a phase-change-energy-storage material filler; both a phase change temperature of the phase-change-energy-storage material filler and a deformation temperature of the heat conducting cover are greater than a high-power housing temperature of the electronic device, and the phase change temperature is not less than the deformation temperature; and the high-power housing temperature is a temperature of the housing of the electronic device when an operating power consumption of the electronic device is greater than a power consumption threshold.

6. The heat dissipation device according to claim 2 , wherein:
in response to that the heat conducting cover is in the first shape, the heat conducting cover is in contact with the heating element, and
in response to that the heat conducting cover is in the second shape, there is a gap between the heat conducting cover and the heating element.

7. An electronic device, comprising:
a housing;
a heating element disposed within the housing; and
a heat dissipation device disposed in the housing, wherein the heat dissipation device comprises:
a heat conducting cover disposed on the heating element, the heat conducting cover forming a closed cavity accommodating the heating element of the electronic device, the heat conducting cover comprising a heat conductive shape-memory material, the heat conducting cover configured to deform from a first shape to a second shape after a temperature of the electronic device increases to a first threshold, and configured to restore from the second shape to the first shape after the temperature of the electronic device decreases to a second threshold; and
a heat absorbing material filler located within the closed cavity as defined by the heat conducting cover,
wherein, in response to an increase in temperature of the heating element, the heat absorbing material filler is configured to deform structurally, to absorb heat generated by the heating element.

8. The electronic device according to claim 7 , wherein:
in response to the heat conducting cover being in the first shape, the heat absorbing material filler does contact to the heating element; and
in response to the heat conducting cover being in the second shape, the heat absorbing material filler contacts the heating element.

9. The electronic device according to claim 8 , wherein:
in response to that the heat conducting cover is in the first shape, the heat conducting cover is in contact with the housing of the electronic device, and
in response to that the heat conducting cover is in the second shape, there is a gap between the heat conducting cover and the housing of the electronic device.

10. The electronic device according to claim 9 , wherein: the first shape is a hollow concave shape, and a concave surface of the heat conducting cover faces the housing of the electronic device; the heating element is located at an intermediate position of the closed cavity of the heat conducting cover, and the heat absorbing material filler are located at both ends of the concave cavity of the heat conducting cover; and the second shape is a hollow rectangular shape, and the heat absorbing material filler is able to fill the closed cavity of the heat conducting cover.

11. The electronic device according to claim 8 , wherein:
in response to that the heat conducting cover is in the first shape, the heat conducting cover is in contact with the heating element, and
in response to that the heat conducting cover is in the second shape, there is a gap between the heat conducting cover and the heating element.

12. The electronic device according to claim 8 , wherein: the heat absorbing material filler is a phase-change-energy-storage material filler; both a phase change temperature of the phase-change-energy-storage material fillers and a deformation temperature of the heat conducting cover are greater than a high-power housing temperature of the electronic device, and the phase change temperature is not less than the deformation temperature; the high-power housing temperature is a temperature of the housing of the electronic device when an operating power consumption of the electronic device is greater than a power consumption threshold.

13. A heat dissipation method for an electronic device, comprising:
disposing a heat dissipating device in the electronic device, the heat dissipation device comprising:
a heat conducting cover disposed on a heating element of the electronic device, the heat conducting cover forming a closed cavity accommodating a heating element of the electronic device, the heat conducting cover comprising a heat conductive shape-memory material, the heat conducting cover configured to deform from a first shape to a second shape after a temperature of the electronic device increases to a first threshold, and configured to restore from the second shape to the first shape after the temperature of the electronic device decreases to a second threshold; and
a heat absorbing material filler located within the closed cavity as defined by the heat conducting cover,
wherein, the heat absorbing material filler deforms structurally, in response to heat generated by the heating element, to absorb the heat generated from the heating element.

14. The method according to claim 13 , wherein:
after a temperature of the electronic device increases, but does not reach

Assignees

• Lenovo Beijing Co Ltd

Inventors

• Zhang Guowen

Classifications

• H10W40/735

  by melting or evaporation of solids · CPC title

• G06F1/203

  for portable computers, e.g. for laptops · CPC title

• H05K7/2029

  using a liquid coolant with phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954) · CPC title

• F28F2255/04

  comprising shape memory alloys or bimetallic elements · CPC title

• F28F2013/005

  Thermal joints · CPC title