Multilayer ceramic electronic component

US10770231B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10770231-B2
Application numberUS-201715836730-A
CountryUS
Kind codeB2
Filing dateDec 8, 2017
Priority dateDec 16, 2016
Publication dateSep 8, 2020
Grant dateSep 8, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In an embodiment, a multilayer ceramic capacitor 10 includes external electrodes 12 on both of first-direction ends of a capacitor body 11 . Also, groups of metal grains 13 are provided on one third-direction face and another third-direction face of the capacitor body 11 . Both of the first-direction ends of the groups of metal grains 13 provided on the other third-direction face of the capacitor body 11 are covered by second parts 12 c of the respective external electrodes 12 , while both of the first-direction ends of the groups of metal grains 13 provided on the one third-direction face of the capacitor body 11 are covered by first parts 12 b of the respective external electrodes 12 . The multilayer ceramic electronic component can offer excellent heat dissipation property.

First claim

Opening claim text (preview).

We claim: 1. A multilayer ceramic electronic component comprising: a component body of roughly rectangular solid shape having a dielectric body in which internal conductor layers are embedded, and a pair of external electrodes provided on the component body and also connected to the internal conductor layers, wherein: when, of the six faces of the component body, a direction in which a first pair of faces are opposing each other is given as a first direction, a direction in which a second pair of faces are opposing each other is given as a second direction, and a direction in which a third pair of faces are opposing each other is given as a third direction, each of the external electrodes is constituted by a base part present on one first-direction face of the component body, and a first part, continuously from the base part, present at least on one third-direction face, among the one third-direction face, the other third-direction face, one second-direction face, and the other second-direction face, of the component body; and a group of metal protrusions is provided along the first direction of the component body only over the one third-direction face and/or the other third-direction face, both of which are dielectric, of the component body, in a manner separating the respective metal protrusions from each other on a dielectric surface of the other third-direction face so that no electrical current flows through the group of metal protrusions, whereby dispersing heat through the protrusions. 2. The multilayer ceramic electronic component according to claim 1 , wherein a first-direction reference dimension of an area in which the group of metal protrusions is provided is the same as a first-direction reference dimension of the component body, and a second-direction reference dimension of the area is the same as a second-direction reference dimension of the component body. 3. A multilayer ceramic electronic component comprising: a component body of roughly rectangular solid shape having internal conductor layers and a pair of external electrodes provided on the component body and also connected to the internal conductor layers, wherein: when, of the six faces of the component body, a direction in which a first pair of faces are opposing each other is given as a first direction, a direction in which a second pair of faces are opposing each other is given as a second direction, and a direction in which a third pair of faces are opposing each other is given as a third direction, each of the external electrodes is constituted by a base part present on one first-direction face of the component body, and a first part, continuously from the base part, present at least on one third-direction face, among the one third-direction face, the other third-direction face, one second-direction face, and the other second-direction face, of the component body; and a group of metal grains is provided along the first direction of the component body over at least the other third-direction face, among the one third-direction face and the other third-direction face, of the component body, wherein a first-direction reference dimension of an area in which the group of metal grains is provided is the same as a first-direction reference dimension of the component body, and a second-direction reference dimension of the area is smaller than a second-direction reference dimension of the component body. 4. The multilayer ceramic electronic component according to claim 1 , wherein the group of metal protrusions is constituted by multiple metal grains that are arranged regularly. 5. The multilayer ceramic electronic component according to claim 1 , wherein the group of metal protrusions is constituted by multiple metal grains that are arranged irregularly or randomly. 6. The multilayer ceramic electronic component according to claim 1 , wherein the group of metal protrusions is provided on both of the other third-direction face and the one third-direction face of the component body. 7. The multilayer ceramic electronic component according to claim 1 , wherein the group of metal protrusions is provided only on the other third-direction face of the component body. 8. The multilayer ceramic electronic component according to claim 1 , wherein each of the external electrodes is constituted continuously by the base part present on the one first-direction face of the component body, the first part present on the one third-direction face of the component body, a second part present on the other third-direction face of the component body, a third part present on one second-direction face of the component body, and a fourth part present on the other second-direction face of the component body. 9. The multilayer ceramic electronic component according to claim 1 , wherein each of the external electrodes is constituted continuously by the base part present on the one first-direction face of the component body, the first part present on the one third-direction face of the component body, and a second part present on the other third-direction face of the component body. 10. The multilayer ceramic electronic component according to claim 8 , wherein the group of metal protrusions provided at least on the other third-direction face of the component body is covered by the second parts of the respective external electrodes at both of the first-direction ends, and the group of metal protrusions in an area other than both of the first-direction ends is exposed. 11. The multilayer ceramic electronic component according to claim 1 , wherein each of the external electrodes is constituted continuously by the base part present on the one first-direction face of the component body and the first part present on the one third-direction face of the component body. 12. The multilayer ceramic electronic component according to claim 11 , wherein the group of metal protrusions provided at least on the other third-direction face of the component body is entirely exposed, except for an area in contact with the other third-direction face. 13. The multilayer ceramic electronic component according to claim 1 , wherein the multilayer ceramic electronic component is a multilayer ceramic capacitor, and the multilayer ceramic capacitor comprises a capacitor body of roughly rectangular solid shape, as the component body, which has a capacitive part constituted by multiple internal electrode layers, as the internal conductor layers, stacked together with dielectric layers in between, and the pair of external electrodes which are provided on the capacitor body and to which the multiple internal electrode layers are connected. 14. A multilayer ceramic electronic component comprising: a component body of roughly rectangular solid shape having internal conductor layers and a pair of external electrodes provided on the component body and also connected to the internal conductor layers, wherein: when, of the six faces of the component body, a direction in which a first pair of faces are opposing each other is given as a first direction, a direction in which a second pair of faces are opposing each other is given as a second direction, and a direction in which a third pair of faces are opposing each other is given as a third direction, each of the external electrodes is constituted by a base part present on one first-direction face of the component body, and a first part, continuously from the base part, present at least on one third-direction face, among the one third-direction face, the other third-direction face, one second-direction face, and the other second-direction face, of the component body; and a group of metal grains

Assignees

Inventors

Classifications

  • Electrodes · CPC title

  • H01G4/30Primary

    Stacked capacitors (H01G4/33 takes precedence) · CPC title

  • H01G2/08Primary

    Cooling arrangements; Heating arrangements; Ventilating arrangements · CPC title

  • electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

  • Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

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What does patent US10770231B2 cover?
In an embodiment, a multilayer ceramic capacitor 10 includes external electrodes 12 on both of first-direction ends of a capacitor body 11 . Also, groups of metal grains 13 are provided on one third-direction face and another third-direction face of the capacitor body 11 . Both of the first-direction ends of the groups of metal grains 13 provided on the other third-direction face of t…
Who is the assignee on this patent?
Taiyo Yuden Kk
What technology area does this patent fall under?
Primary CPC classification H01G4/30. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 08 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).