Electronic component

Patent metadata

Field	Value
Publication number	US-9899152-B2
Application number	US-201615276831-A
Country	US
Kind code	B2
Filing date	Sep 27, 2016
Priority date	Mar 27, 2014
Publication date	Feb 20, 2018
Grant date	Feb 20, 2018

Abstract

An electronic component capable of suppressing variations in dimension of plating growth of a plating film serving as an external electrode. The external electrodes include plating films formed so as to extend from each of end surfaces to side surfaces of an electronic component body by electrolytic plating. Underlying main electrodes in which the degree of plating growth is relatively high, and underlying sub-electrodes in which the degree of plating growth is relatively low, are formed as a seed electrode serving as a starting point of plating growth for forming a plating film.

First claim

The invention claimed is:

1. An electronic component comprising:
an electronic component body;
underlying electrodes formed so as to be exposed at a plurality of points of an outer surface of the electronic component body;
and external electrodes including plating films formed on the outer surface of the electronic component body by electrolytic plating using the underlying electrodes as a seed electrode serving as a starting point of plating growth,
wherein the underlying electrodes include underlying main electrodes and underlying sub-electrodes, the underlying sub-electrodes are located along specific end edges of the plating films, the underlying main electrodes are located away from the specific end edges of the plating films at a greater distance than the underlying sub-electrodes,
in a stage prior to formation of the plating film, the underlying main electrodes are commonly electrically connected to one another, and the underlying main electrodes are not electrically connected to the underlying sub-electrode, and
an exposed area of the underlying sub-electrode which is exposed to the outer surface of the electronic component body is made smaller than an exposed area of the underlying main electrodes commonly electrically connected to one another which are exposed to the outer surface of the electronic component body.

2. The electronic component according to claim 1 ,
wherein the electronic component body has a rectangular parallelepiped shape in which the outer surface is defined by four side surfaces and two end surfaces orthogonal to each of the four side surfaces,
the underlying electrode includes end surface underlying electrodes formed so as to be exposed to the two end surfaces, respectively, of the electronic component body, and a plurality of side surface underlying electrodes formed so as to be exposed to at least one side surface of the electronic component body,
the plating films are formed so as to extend on the two end surfaces of the electronic component body and from each of the two end surfaces to at least one side surface using the end surface underlying electrodes and a plurality of the side surface underlying electrodes serving as a seed electrode which is a starting point of plating growth,
the underlying main electrodes are provided by first side surface underlying electrodes and the end surface underlying electrodes, the first side surface underlying electrodes being located away from the specific end edges of the plating films at a greater distance than the underlying sub-electrodes, among the side surface underlying electrodes, and
the underlying sub-electrodes are provided by second side surface underlying electrodes, among the side surface underlying electrodes, located along the specific end edges of the plating films.

3. The electronic component according to claim 2 , wherein the first and the second side surface underlying electrodes are formed so as to go around four side surfaces.

4. The electronic component according to claim 2 , wherein the first and the second side surface underlying electrodes are formed so as to extend in parallel with the end surfaces.

5. The electronic component according to claim 4 , wherein a plurality of the first side surface underlying electrodes extend in parallel with one another.

6. The electronic component according to claim 2 , wherein the first side surface underlying electrodes are electrically connected to the end surface underlying electrode via the inside of the electronic component body interposed.

7. The electronic component according to claim 2 , wherein the first side surface underlying electrodes are electrically connected to the end surface underlying electrode via the outer surface of the electronic component body interposed.

8. The electronic component according to claim 2 , wherein the first side surface underlying electrodes are formed on the side surfaces so as to extend integrally from the end surface underlying electrodes on the outer surface of the electronic component body.

9. The electronic component according to claim 1 ,
wherein the electronic component body has a rectangular parallelepiped shape in which the outer surface is defined by four side surfaces and two end surfaces orthogonal to each of the four side surfaces,
the underlying electrode includes a plurality of side surface underlying electrodes formed so as to be exposed to at least one side surface of the electronic component body,
the plating film is formed on at least one side surface of the electronic component body using a plurality of the side surface underlying electrodes serving as a seed electrode which is a starting point of plating growth,
the underlying main electrodes are provided by first side surface underlying electrodes, among the side surface underlying electrodes, located away from the specific end edges of the plating films at a greater distance than the underlying sub-electrodes, and
the underlying sub-electrodes are provided by second side surface underlying electrodes, among the side surface underlying electrodes, located along the specific end edges of the plating films.

10. The electronic component according to claim 9 , wherein the first and the second side surface underlying electrodes are formed so as to be exposed to only one side surface.

11. The electronic component according to claim 10 , wherein an exposed portion of the side surface underlying electrode exposed to the side surface is provided by a plurality of line segment-like exposed portions extending in parallel with one another along the specific end edge, and a longitudinal dimension of the line segment-like exposed portion of the second side surface underlying electrode is made larger than a longitudinal dimension of the line segment-like exposed portion of the first side surface underlying electrode.

12. The electronic component according to claim 9 , wherein the first and the second side surface underlying electrodes are formed so as to be exposed to both of neighboring two side surfaces.

13. The electronic component according to claim 1 , further comprising an internal conductor disposed inside the electronic component body and electrically connected to the external electrodes.

Assignees

• Murata Manufacturing Co

Inventors

• Osada Takanori
• Takahashi Atsushi

Classifications

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01F17/04 Primary

  with magnetic core · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/005

  Electrodes · CPC title

• H01G4/248 Primary

  the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) · CPC title