Resin composition, method for producing resin composition, film formation method, and cured product

Patent metadata

Field	Value
Publication number	US-10767017-B2
Application number	US-201715855291-A
Country	US
Kind code	B2
Filing date	Dec 27, 2017
Priority date	Dec 28, 2016
Publication date	Sep 8, 2020
Grant date	Sep 8, 2020

Abstract

A resin composition including a silicon-containing resin component and a solvent, the silicon-containing resin component including at least one of (I) and (II) mentioned below, the solvent including at least one of a terpene compound having at least one of a hydroxy group and an acetoxy group, and a cyclic skeleton-containing acetate compound (excluding the terpene compound):
(I) a polysilane-polysiloxane resin having a polysilane structure and a polysiloxane structure, and (II) a mixture of a resin having a polysilane structure and a resin having a polysiloxane structure.

First claim

What is claimed is:

1. A resin composition comprising a silicon-containing resin component and a solvent, wherein
the silicon-containing resin component comprises (II) a mixture of a resin having a polysilane structure (II-1) and a resin having a polysiloxane structure (II-2), and
the solvent comprises a terpene compound having at least one group selected from the group consisting of a hydroxy group and an acetoxy group,
wherein the polysiloxane structures (II-2) comprises a hydrolyzed and condensed structure of at least one silicon compound selected from the group consisting of silicon compounds represented by the following general formulas (A-1-1) to (A-1-4):
R 1 R 2 R 3 SiX 1   (A-1-1)

R 4 R 5 SiX 2 2   (A-1-2)

R 6 SiX 3 3   (A-1-3)

SiX 4 4   (A-1-4)

wherein X 1 to X 4 are each independently a hydrolyzable group, and wherein R 1 , R 2 , R 3 , R 4 , R 5 , and R 6 are each independently a hydrogen atom or an organic group, and hydrogen atoms in the organic group may be substituted with a halogen atom, and
wherein the polysilane structure (II-1) comprises a structure corresponding to at least one selected from the group consisting of polysilane compounds represented by the following general formulas (A-2-1) and (A-2-2):
(R 7 R 8 R 9 Si) a1 (R 10 R 11 Si) a2 (R 12 Si) a3 (Si) a4   (A-2-1)

wherein R 7 , R 8 , R 9 , R 10 , R 11 , and R 12 are each independently a hydrogen atom, a hydroxyl group, or a monovalent organic group, Si atoms do not bond to each other via R 7 , R 8 , R 9 , R 10 , R 11 or R 12 , but form an Si—Si bond, and a1, a2, a3, and a4 are each independently a molar fraction, a1+a2+a3+a4=1, 0≤a1≤1, 0≤a2≤1, 0≤a3≤1, and 0≤a4≤1,

wherein R a1 and R a2 each independently represents a hydrogen atom, a hydroxyl group, or an organic group, and n represents an integer of 5 to 20.

2. A method for producing the composition according to claim 1 , the method comprising mixing a resin having a polysilane structure with a resin having a polysiloxane structure.

3. A film formation method using the composition according to claim 1 .

4. A cured product of the composition according to claim 1 .

5. The resin composition according to claim 1 , wherein the polysilane structure (II-1) consists essentially of a structures corresponding to at least one type selected from the group consisting of polysilane compounds represented by the general formula (A-2-1) and (A-2-2).

6. The resin composition according to claim 1 , wherein the polysilane structure (II-1) consists essentially of at least one type of polysilane structure represented by the following general formula (B1):

wherein, R 10 , R 11 , and R 12 each independently represents a hydrogen atom, a hydroxyl group, or a monovalent organic group, * represents a bond, and Si atoms form an Si—Si bond.

7. The resin composition according to claim 1 , wherein
in the general formula (A-2-1), at least one selected from the group consisting of R 7 , R 8 and R 9 is an aryl group, at least one selected from the group consisting of R 10 and R 11 is an aryl group, or R12 is an aryl group, and
in the general formula (A-2-2), at least one selected from the group consisting of R a1 and R a2 is an aryl group.

8. The cured product according to claim 4 , the cured product being formed in a film having a thickness of 10 nm to 1500 nm.

9. A resin composition comprising a silicon-containing resin component and a solvent, wherein
the silicon-containing resin component comprises (II) a mixture of a resin having a polysilane structure (II-1) and a resin having a polysiloxane structure (II-2), and
the solvent comprises at least one solvent selected from the group consisting of a terpene compound having at least one group selected from the group consisting of a hydroxy group and an acetoxy group, and a cyclic skeleton-containing acetate compound (excluding the terpene compound),
wherein the polysiloxane structure (II-2) comprises a hydrolyzed and condensed structure of at least one silicon compound selected from the group consisting of silicon compounds represented by the following general formulas (A-1-1) to (A-1-4):
R 1 R 2 R 3 SiX 1   (A-1-1)

R 4 R 5 SiX 2 2   (A-1-2)

R 6 SiX 3 3   (A-1-3)

SiX 4 4   (A-1-4)

wherein X 1 to X 4 are each independently a hydrolyzable group, and wherein R 1 , R 2 , R 3 , R 4 , R 5 , and R 6 are each independently a hydrogen atom or an organic group, and hydrogen atoms in the organic group may be substituted with a halogen atom, and
wherein the polysilane structure (II-1) comprises a structure corresponding to a polysilane compound represented by the following general formula (A-2-2):

wherein R a1 and R a2 each independently represents a hydrogen atom, a hydroxyl group, or an organic group, and n represents an integer of 5 to 20.

10. The resin composition according to claim 9 , wherein the cyclic skeleton-containing acetate compound is cycloalkyl acetate represented by the following formula (S1):

in the formula (S1), R s1 is an alkyl group, p is an integer of 1 to 6, and q is an integer of 0 to (p+1).

Assignees

• Tokyo Ohka Kogyo Co Ltd

Inventors

• Noda Kunihiro
• Chisaka Hiroki
• Someya Kazuya
• Shiota Dai

Classifications

• C09D183/10

  Block or graft copolymers containing polysiloxane sequences (obtained by polymerising a compound having a carbon-to-carbon double bond on to a polysiloxane C09D151/08, C09D153/00) · CPC title

• C09D183/04

  Polysiloxanes · CPC title

• C08G77/06

  Preparatory processes · CPC title

• C08G77/04

  Polysiloxanes · CPC title

• Y02E10/50

  Photovoltaic [PV] energy · CPC title