Injection-molded solder (IMS) tool assembly and method of use thereof

US10766086B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10766086-B2
Application numberUS-201715825654-A
CountryUS
Kind codeB2
Filing dateNov 29, 2017
Priority dateNov 29, 2017
Publication dateSep 8, 2020
Grant dateSep 8, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An injection-molded solder (IMS) tool assembly apparatus, the apparatus including an IMS tool for dispensing a molten material via a round extrusion part to coat an inside or an outside wall of a pipe (and a chiller for providing cooling water to flow through an inside of the pipe.)

First claim

Opening claim text (preview).

What is claimed is: 1. An injection-molded solder (IMS) tool assembly apparatus, the apparatus comprising: an IMS tool including a round extrusion part that has an outlet to dispense a molten material to coat an outside wall of a pipe; and a chiller comprising an opening that connects to the pipe and dispenses cooling water to flow through an inside of the pipe, wherein the IMS tool comprises: a tungsten head that dispenses the molten material into the round extrusion part; a heater that maintains a molten state of the molten material in the tungsten head; and a pressure source that supplies pressure to the molten material thereby causing the molten material to dispense from the tungsten head into the round extrusion part, wherein the IMS tool interfaces with a tungsten box and wherein the pipe is drawn through the tungsten box. 2. The injection-molded solder (IMS) tool assembly apparatus of claim 1 , wherein an inner diameter of the round extrusion part is greater than an outer diameter of the pipe. 3. The injection-molded solder (IMS) tool assembly apparatus of claim 1 , wherein the pipe comprises a carbon steel pipe. 4. The injection molded solder (IMS) tool assembly apparatus of claim 1 , wherein a temperature of the cooling water is set such that the pipe is cooled to avoid melting of a material of the pipe while the molten material touches the outside wall of the pipe. 5. The injection-molded solder (IMS) tool assembly apparatus of claim 1 , wherein a melting temperature of the molten material is greater than a melting temperature of the pipe. 6. The injection-molded solder (IMS) tool assembly apparatus of claim 3 , wherein the molten material includes a material to coat the pipe such that the pipe has a stainless steel property. 7. The injection-molded solder (IMS) tool assembly apparatus of claim 1 , wherein a melting temperature of the molten material is less than a melting temperature of the pipe. 8. The injection-molded solder (IMS) tool assembly apparatus of claim 6 , wherein the molten material is selected from a group consisting of: a steel coating including Cr; a steel coating including Mo; a steel coating including Nb; and a steel coating including Ti. 9. The injection-molded solder (IMS) tool assembly apparatus of claim 3 , wherein the molten material includes a material to coat the pipe such that the pipe has a stainless steel property. 10. An injection-molded solder (IMS) tool assembly apparatus, the apparatus comprising: an IMS tool including a round extrusion part that has an outlet to dispense a molten material to coat an inside wall of a pipe; and a chiller con an opening that provides cooling water to flow through an outside of the pipe, wherein the IMS tool comprises: a tungsten head that dispenses the molten material into the round extrusion part, wherein the tungsten head is incorporated into a piston that pushes a rod into the pipe; a heater that maintains a molten state of the molten material in the tungsten head; and a pressure source that supplies pressure to the molten material thereby causing the molten material to dispense from the tungsten head into the round extrusion part. 11. The injection-molded solder (IMS) tool assembly apparatus of claim 10 , wherein an outer diameter of the round extrusion part is less than an inner diameter of the pipe. 12. The injection-molded solder (IMS) tool assembly apparatus of claim 11 , wherein the pipe comprises a carbon steel pipe. 13. The injection-molded solder (IMS) tool assembly apparatus of claim 11 , wherein a temperature of the cooling water is set such that the pipe is cooled to avoid melting of a material of the pipe while the molten material touches the inside wall of the pipe. 14. The injection-molded solder (IMS) tool assembly apparatus of claim 10 , wherein a melting temperature of the molten material is greater than a melting temperature of the pipe. 15. The injection-molded solder (IMS) tool assembly apparatus of claim 10 , wherein the IMS tool dispenses the molten material via the round extrusion part to coat an outside wall of a pipe, and wherein the chiller provides cooling water to flow around an outside of the pipe. 16. The injection-molded solder (IMS) tool assembly apparatus of claim 1 , wherein the round extrusion part fits over the outside wall of the pipe.

Assignees

Inventors

Classifications

  • B23K35/00Primary

    Rods, electrodes, materials, or media, for use in soldering, welding, or cutting · CPC title

  • with Cr as next major constituent · CPC title

  • Fe as the principal constituent · CPC title

  • containing chromium · CPC title

  • Ferrous alloys, e.g. steel alloys (cast-iron alloys C22C37/00) · CPC title

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Frequently asked questions

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What does patent US10766086B2 cover?
An injection-molded solder (IMS) tool assembly apparatus, the apparatus including an IMS tool for dispensing a molten material via a round extrusion part to coat an inside or an outside wall of a pipe (and a chiller for providing cooling water to flow through an inside of the pipe.)
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification B23K35/00. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 08 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).