Dual-column-parallel CCD sensor and inspection systems using a sensor

Patent metadata

Field	Value
Publication number	US-10764527-B2
Application number	US-201916397072-A
Country	US
Kind code	B2
Filing date	Apr 29, 2019
Priority date	Apr 6, 2016
Publication date	Sep 1, 2020
Grant date	Sep 1, 2020

Abstract

A dual-column-parallel image CCD sensor utilizes a dual-column-parallel readout circuit including two pairs of cross-connected transfer gates to alternately transfer pixel data (charges) from a pair of adjacent pixel columns to a shared output circuit at high speed with low noise. Charges transferred along the two adjacent pixel columns at a line clock rate are alternately passed by the transfer gates to a summing gate that is operated at twice the line clock rate to pass the image charges to the shared output circuit. A symmetrical Y-shaped diffusion is utilized in one embodiment to merge the image charges from the two pixel columns. A method of driving the dual-column-parallel CCD sensor with line clock synchronization is also described. A method of inspecting a sample using the dual-column-parallel CCD sensor is also described.

First claim

The invention claimed is:

1. An image sensor including:
first and second pixels respectively configured to generate first and second image charges according to one or more pixel control signals; and
a readout circuit comprising:
first and second transfer gates configured to receive the first and second image charges from the first and second pixels, respectively;
third and fourth transfer gates configured to receive the first and second image charges from the first and second transfer gates, respectively;
a summing gate coupled to the third and fourth transfer gates; and
an output circuit coupled to the summing gate,
wherein the first and fourth transfer gates are coupled and the second and third transfer gates are coupled such that a first transfer gate control signal applied to the first transfer gate is substantially simultaneously applied to the fourth transfer gate, and such that a second transfer gate control signal applied to the second transfer gate is substantially simultaneously applied to the third transfer gate, and
wherein the summing gate is configured to receive the first image charge from the third transfer gate during a first time period and to subsequently transfer the first image charge to the output circuit in accordance with a summing gate control signal, and the summing gate is further configured to receive the second image charge from the fourth transfer gate during ad second time period and to subsequently transfer the second image charge to the output circuit in accordance with the summing gate control signal.

2. The sensor of claim 1 , wherein the output circuit comprises a floating diffusion configured to receive and store said first and second image charges, and an amplifier coupled to the floating diffusion and configured to generate a first output voltage signal when the first image charge is stored on the floating diffusion, and to generate a second output voltage signal when the second image charge is stored on the floating diffusion.

3. The sensor of claim 1 , further comprising an array of pixels arranged in an even number of columns,
wherein the readout circuit includes a plurality of readout structures, each said readout structure connected to an associated pair of said columns and including four transfer gates, a summing gate, and an amplifier.

4. The sensor of claim 3 , wherein said amplifier of each said readout structure comprises a metal interconnect, wherein capacitances of the metal interconnects of different amplifiers are substantially similar.

5. The sensor of claim 3 , wherein each said amplifier comprises a metal interconnect, wherein areas of the metal interconnects of different amplifiers are substantially similar.

6. The sensor of claim 3 , wherein the array of pixels consists of one or more rows of pixels.

7. An image sensor comprising:
a semiconductor substrate;
a Y-shaped buried diffusion formed in the substrate and including parallel first and second elongated portions connected to a third elongated portion by way of a V-shaped merge section;
a plurality of pixel gate structures respectively formed over the first and second elongated portions;
first and second transfer gate structures respectively formed over the first and second elongated portions and disposed between the pixel gate structures and the V-shaped merge section;
third and fourth transfer gate structures respectively formed over the first and second elongated portions and respectively disposed between the first and second transfer gate structures and the V-shaped merge section;
a summing gate structure formed over the V-shaped merge section; and
an output circuit coupled to the third elongated portion,
wherein the first and fourth transfer gate structures are coupled such that a first control signal applied to the first transfer gate structure is substantially simultaneously applied to the fourth transfer gate structure, and
wherein the second and third transfer gate structures are coupled such that a second control signal applied to the second transfer gate structure is substantially simultaneously applied to the third transfer gate structure.

8. The image sensor of claim 7 , wherein the first and fourth transfer gate structures are connected by a first conductive linking structure such that said first control signal applied to the first transfer gate structure is transmitted by said first conductive linking structure to said fourth transfer gate structure.

9. The image sensor of claim 8 , wherein the first conductive linking structure comprises one of metal and polycrystalline silicon.

10. The image sensor of claim 8 , wherein the first transfer gate structure, the fourth transfer gate structure, and the first conductive linking structure comprise an integral composite polycrystalline silicon structure.

11. The image sensor of claim 7 , wherein the summing gate summing gate structure is configured to receive a first image charge from the first elongated portion during a first time period and to subsequently transfer the first image charge to the third elongated portion in accordance with a summing gate control signal, and the summing gate is further configured to receive a second image charge from the second elongated portion during a second time period and to subsequently transfer the second image charge to the third elongated portion in accordance with a summing gate control signal.

12. The image sensor of claim 7 , wherein the summing gate summing gate structure comprises a tapered polycrystalline silicon structure having an upstream edge facing the first and second elongated portions and a downstream edge facing the third elongated portion, and wherein a length of the upstream edge is greater than a length of the downstream edge.

13. The image sensor of claim 7 , further comprising a tapered output gate structure disposed between the summing gate structure and the third elongated portion.

14. The image sensor of claim 7 , wherein the output circuit comprises:
a floating diffusion formed in the third elongated portion; and
an amplifier disposed on the substrate and operably coupled to the floating diffusion by a conductive structure.

15. The image sensor of claim 14 ,
wherein the amplifier comprises a first-stage gain transistor, and
wherein the conductive structure comprises a polycrystalline silicon structure including a lower poly portion extending through a contact hole to the floating diffusion, and a horizontal poly portion extending from the lower poly portion, wherein a portion of said horizontal poly portion forms a gate structure for the first-stage gain transistor.

Assignees

• Kla Tencor Corp

Inventors

• Chuang Yung-Ho Alex
• Zhang Jingjing
• Zamek Sharon
• Fielden John
• Contarato Devis
• Brown David L

Classifications

• G06T7/0008 Primary

  checking presence/absence · CPC title

• H04N25/72

  using frame transfer [FT] · CPC title

• H04N25/715

  using frame interline transfer [FIT] · CPC title

• G01N21/956 Primary

  Inspecting patterns on the surface of objects {(contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20)} · CPC title

• H04N25/71

  Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors · CPC title