Electrical devices and methods for forming electrical devices

Patent metadata

Field	Value
Publication number	US-10763218-B2
Application number	US-201616079105-A
Country	US
Kind code	B2
Filing date	Mar 24, 2016
Priority date	Mar 24, 2016
Publication date	Sep 1, 2020
Grant date	Sep 1, 2020

Abstract

An electrical device includes at least one electrical component arranged on a carrier substrate and sidewalls of an electromagnetic shielding encapsulation arranged on the carrier substrate. The sidewalls of the electromagnetic shielding encapsulation laterally surround the at least one electrical component. Further, the electrical device includes a heat sink mounted to the sidewalls of the electromagnetic shielding encapsulation. The heat sink forms a cap of the electromagnetic shielding encapsulation and the heat sink includes surface-enlarging structures at a front side of the heat sink.

First claim

The invention claimed is:

1. An electrical device comprising:
at least one electrical component arranged on a carrier substrate;
sidewalls of an electromagnetic shielding encapsulation arranged on the carrier substrate, wherein the sidewalls of the electromagnetic shielding encapsulation laterally surround the at least one electrical component; and
a heat sink mounted to the sidewalls of the electromagnetic shielding encapsulation, wherein the heat sink forms a cap of the electromagnetic shielding encapsulation, wherein the heat sink comprises surface-enlarging structures at a front side of the heat sink, and
wherein the heat sink is fixed on the sidewalls of an electromagnetic shielding encapsulation by a gasket material,
wherein the gasket material has a thermal conductivity of more than 3 W/(m*K), and
wherein the gasket material has an electrical resistivity of less than 1*10 −3 Ωm.

2. The electrical device according to claim 1 , wherein the gasket material is a conductive carbon rubber material or a carbon filled silicon rubber material.

3. The electrical device according to claim 1 , wherein the gasket material seals a gap between the heat sink and the sidewalls of the electromagnetic shielding encapsulation.

4. The electrical device according to claim 1 , wherein the heat sink comprises at least one of aluminum and copper.

5. The electrical device according to claim 1 , wherein the surface-enlarging structures of the heat sink are a plurality of fin-shaped structures or pin-shaped structures.

6. The electrical device according to claim 1 , wherein a body portion of the heat sink and the surface-enlarging structures of the heat sink are one-pieced, wherein a surface of the body portion forms a back side of the heat sink.

7. The electrical device according to claim 1 , wherein the sidewalls of the electromagnetic shielding encapsulation have an electrical resistivity of less than 1*10-3 Ωm.

8. The electrical device according to claim 1 , wherein the sidewalls of the electromagnetic shielding encapsulation comprise a stamped sheet metal or tin-plated stainless steel.

9. The electrical device according to claim 1 , wherein a height of the sidewalls of the electromagnetic shielding encapsulation is larger than a height of the electrical component.

10. The electrical device according to claim 1 , wherein the carrier substrate is at least one of a printed circuit board, a module board and a semiconductor package substrate.

11. The electrical device according to claim 1 , wherein the at least one electrical component is a semiconductor device.

12. The electrical device according to claim 11 , wherein the semiconductor device is a transceiver device electrically coupled to at least one antenna located outside the electro-magnetic shielding encapsulation.

13. The electrical device according to claim 1 , further comprising at least a second electrical component arranged on the carrier substrate and within the electromagnetic shielding encapsulation.

14. The electrical device according to claim 1 , further comprising a gap filler structure located between the at least one electrical component and a back side of the heat sink, wherein the gap filler structure is in contact with the at least one electrical component and the back side of the heat sink.

15. The electrical device according to claim 14 , wherein the gap filler structure comprises a thermal conductivity of more than 3 W/(m*K).

16. The electrical device according to claim 1 , further comprising at least one internal sidewall of the electromagnetic shielding encapsulation, wherein the at least one internal sidewall of the electromagnetic shielding encapsulation separates at least two encapsulation chambers of the electromagnetic shielding encapsulation from each other, wherein at least one electrical component is arranged within each of the at least two encapsulation chambers of the electromagnetic shielding encapsulation.

17. A method for forming an electrical device, the method comprising:
attaching at least one electrical component on a carrier substrate;
forming or attaching side walls of an electromagnetic shielding encapsulation on the carrier substrate before or after attaching the at least one electrical component, wherein the sidewalls of the electromagnetic shielding encapsulation laterally surround the at least one electrical component; and
mounting a heat sink to the sidewalls of the electromagnetic shielding encapsulation,
wherein the heat sink forms a cap of the electromagnetic shielding encapsulation,
wherein the heat sink comprises surface-enlarging structures at a front side of the heat sink, and
wherein mounting the heat sink comprises fixing the heat sink on the sidewalls of an electromagnetic shielding encapsulation by a gasket material,
wherein the gasket material has a thermal conductivity of more than 3 W/(m*K), and
wherein the gasket material has an electrical resistivity of less than 1*10 −3 Ωm.

18. The method according to claim 17 , wherein forming or attaching the side walls comprises attaching stamped metal sheet side walls or tin-plated stainless steel side walls on the carrier substrate.

19. The method according to claim 17 , further comprising forming or attaching a gap filler structure on the at least one electrical component, wherein the heat sink is mounted so that the gap filler structure is in contact with the back side of the heat sink.

Assignees

• Intel Corp

Inventors

• Chigullapalli Sruti
• Fitch Leslie
• Wu Boping

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W40/70

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title

• H10W90/00

  Package configurations · CPC title