Composite electronic component and manufacturing method for same

Patent metadata

Field	Value
Publication number	US-10763036-B2
Application number	US-201715730963-A
Country	US
Kind code	B2
Filing date	Oct 12, 2017
Priority date	Oct 21, 2016
Publication date	Sep 1, 2020
Grant date	Sep 1, 2020

Abstract

A composite electronic component that includes a first electronic component that includes a first element body, a first functional element that is provided inside the first element body, and first outer electrodes that are provided on one surface of the first element body and are electrically connected to the first functional element. A second electronic component includes a second element body, a second functional element that is provided inside the second element body, and second outer electrodes that are provided on one surface of the second element body and are electrically connected to the second functional element. A resin body, in which the first electronic component and the second electronic component are buried, exposes the first outer electrodes and the second outer electrodes from the resin body.

First claim

What is claimed is:

1. A composite electronic component comprising:
a first electronic component including a first element body, a first functional element that is provided inside the first element body, and first outer electrodes provided on one surface of the first element body and electrically connected to the first functional element;
a second electronic component including a second element body, a second functional element provided inside the second element body, and second outer electrodes provided on one surface of the second element body and electrically connected to the second functional element;
a third electronic component that is electrically connected to the first electronic component and the second electronic component; and
a resin body in which the first electronic component and the second electronic component are buried so as to be integrated with each other such that the first outer electrodes and the second outer electrodes are exposed from the resin body, wherein
the first outer electrodes and the second outer electrodes are exposed from one surface of the resin body, and
the third electronic component is arranged on another surface of the first element body that is on the opposite side from the one surface of the first element body, and on another surface of the second element body that is on the opposite side from the one surface of the second element body.

2. The composite electronic component according to claim 1 , wherein
a spacer is provided between the first electronic component and the second electronic component.

3. The composite electronic component according to claim 1 , wherein
the first electronic component and the second electronic component contact each other.

4. The composite electronic component according to claim 3 , wherein
the one surface of the first element body and the one surface of the second element body are located in the same plane, and
a shortest distance between the first outer electrodes and the second outer electrodes is around 50-80 μm.

5. The composite electronic component according to claim 1 , wherein
the first functional element and the second functional element each include at least any one of an inductor element, an impedance element, a capacitor element, a resistor element and an ESD element.

6. The composite electronic component according to claim 1 , wherein
the first electronic component and the second electronic component are each any one of a multilayer-type capacitor component, a multilayer-type inductor component and a winding-type inductor component.

7. The composite electronic component according to claim 1 , wherein
the first element body and the second element body are each a dielectric body or a magnetic body.

8. The composite electronic component according to claim 1 , wherein
the resin body includes a magnetic powder.

9. A composite electronic component manufacturing method for manufacturing a composite electronic component including a first electronic component having a first element body, a first functional element that is provided inside the first element body, and first outer electrodes provided on one surface of the first element body and electrically connected to the first functional element;
a second electronic component including a second element body, a second functional element provided inside the second element body, and second outer electrodes provided on one surface of the second element body and electrically connected to the second functional element; and
a resin body in which the first electronic component and the second electronic component are buried so as to be integrated with each other such that the first outer electrodes and the second outer electrodes are exposed from the resin body, said composite electronic component manufacturing method comprising:
aligning the first electronic component and the second electronic component such that the one surface of the first element body and the one surface of the second element body are located in the same plane and face a base,
arranging a first resin sheet on another surface of the first element body that is on the opposite side from the one surface of the first element body and on another surface of the second element body that is on the opposite side from the one surface of the second element body, heating and pressurizing the first resin sheet, and thereby burying in the first resin sheet a portion of the first element body up to a point partway between the other surface and the one surface of the first element body in the height direction and a portion of the second element body up to a point partway between the other surface and the one surface of the second element body in the height direction,
arranging a second resin sheet on the one surface of the first element body and on the one surface of the second element body, heating and pressurizing the second resin sheet, and thereby burying in the second resin sheet a portion of the first element body up to a point partway between the one surface and the other surface of the first element body in the height direction and a portion of the second element body up to a point partway between the one surface and the other surface of the second element body in the height direction.

10. The composite electronic component manufacturing method according to claim 9 , further comprising:
arranging a resin sheet on another surface of the first element body that is on the opposite side from the one surface of the first element body and on another surface of the second element body that is on the opposite side from the one surface of the second element body, heating and pressurizing the resin sheet, and thereby burying in the resin sheet the entirety of the first element body in a height direction from the other surface of the first element body to the one surface of the first element body and the entirety of the second element body in the height direction from the other surface of the second element body to the one surface of the second element body.

11. The composite electronic component manufacturing method according to claim 9 , further comprising:
aligning and burying inside a resin sheet a plurality of the first electronic components and a plurality of the second electronic components; and
cutting and dividing the resin sheet into pieces that each correspond to a set of the first electronic component and the second electronic component constituting a single composite electronic component.

12. The composite electronic component manufacturing method according to claim 9 , further comprising:
providing a spacer between the first electronic component and the second electronic component, and fixing the first electronic component and the second electronic component to the spacer.

13. The composite electronic component manufacturing method according to claim 12 , wherein
the spacer is substantially belt shaped, and a plurality of the first electronic components and a plurality of the second electronic components are fixed to the belt-shaped spacer.

14. A composite electronic component manufacturing method for manufacturing a composite electronic component including a first electronic component having a first element body, a first functional element that is provided inside the first element body, and first outer electrodes provided on one surface of the first element body and electrically connected to the first functional element;
a second electronic component including a second element body, a second functional element provided inside the second element body, and second outer electrodes provided on one surface of the second element bod

Assignees

• Murata Manufacturing Co

Inventors

• Ishida Daisuke
• Kudo Kazuhide

Classifications

• H01G4/228 Primary

  Terminals · CPC title

• H01G4/224

  Housing; Encapsulation · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/40

  Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations · CPC title

• H01G4/005

  Electrodes · CPC title