Projection exposure method and projection exposure apparatus for microlithography

US10761429B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10761429-B2
Application numberUS-201916688158-A
CountryUS
Kind codeB2
Filing dateNov 19, 2019
Priority dateJun 2, 2017
Publication dateSep 1, 2020
Grant dateSep 1, 2020

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  1. Title

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Abstract

Official abstract text for this publication.

A projection exposure method and apparatus are disclosed for exposing a radiation-sensitive substrate with at least one image of a pattern of a mask under the control of an operating control system of a projection exposure apparatus, part of the pattern lying in an illumination region is imaged onto the image field on the substrate with the aid of a projection lens, wherein all rays of the projection radiation contributing to the image generation in the image field form a projection beam path.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of using a projection exposure apparatus comprising an illumination system and a projection lens, the method comprising: using the illumination system to illuminate a region of a pattern of a mask with illumination radiation, wherein the mask is in a region of an object plane of the projection lens; using the projection lens to project part of the pattern of the mask in the region onto a substrate in an image field of the projection lens with projection radiation, wherein all rays of the projection radiation contributing to image generation in the image field form a projection beam path; and actuating a manipulator to influence a wavefront of the projection radiation, wherein the manipulator comprises a manipulator surface arranged in the projection beam path and an actuating device for reversibly changing an optical effect of the manipulator surface, wherein: manipulated value changes of the actuating device are determined by an operating control system on the basis of a control program with a correction algorithm which optimizes a target function; and the target function for at least one manipulator comprises a telecentricity sensitivity describing a relationship between a defined manipulated value change at the manipulator and an effect achievable thereby on the telecentricity of the projection radiation in the image field. 2. The method of claim 1 , further comprising determining a Z 1 sensitivity for a manipulator, wherein the Z 1 sensitivity describes a relationship between a defined manipulated value change at the manipulator and an effect achieved thereby on a field profile of the Zernike coefficient Z 1 or a variable mathematically equivalent thereto. 3. The method of claim 1 , further comprising: storing telecentricity sensitivities of manipulators for varying the telecentricity in a memory of an operating control system; and controlling operation of the projection exposure apparatus taking account of the telecentricity sensitivities. 4. The method of claim 3 , wherein manipulated value changes of a manipulator are limited to magnitudes below a manipulated value limit value taking account of the telecentricity sensitivities. 5. The method of claim 1 , further comprising, during the optimization of the target function, calculating an OPL surface conjugate to the object surface, wherein the OPL surface is defined by a totality of image points which are at an optical distance of constant optical path length from conjugate object points. 6. The method of claim 5 , further comprising calculating a profile of a constant displacement of the wavefront of the projection radiation over the image field for the determination of the OPL surface. 7. The method of claim 1 , further comprising: determining a start value for the telecentricity at a start time; calculating telecentricity changes caused by adjustment of manipulators using values for manipulated value changes of the manipulators and assigned telecentricity sensitivities; and determining a telecentricity value for a determination time from the start value and the telecentricity changes effected between the start time and the determination time. 8. The method of claim 7 , further comprising measuring the telecentricity upon start-up or after a readjustment to determine the start value. 9. The method of claim 1 , further comprising using a dedicated telecentricity manipulator to varying the telecentricity of the projection lens. 10. A projection exposure apparatus for exposing a radiation-sensitive substrate with at least one image of a pattern of a mask, comprising: an illumination system configured to receive primary radiation of a primary radiation source and to generate an illumination radiation directed onto a pattern of an object in an illumination region; a projection lens configured to project a part of the pattern that lies in the illumination region onto an image field at a substrate with projection radiation; an operating control system configured to control the operation of the projection exposure apparatus; and a wavefront manipulation system configured to dynamically influence the wavefront of the projection radiation travelling from the object plane to the image plane, wherein: the wavefront manipulation system comprises a manipulator which is actuatable via control signals of the operating control system; the manipulator comprises a manipulator surface in the projection beam path and an actuating device configured to reversibly change an optical effect of the manipulator surface; telecentricity sensitivities of manipulators for varying the telecentricity are storable in a memory of the operating control system; a telecentricity sensitivity describes a relationship between a defined manipulated value change at a manipulator and an effect achieved thereby on the telecentricity of the projection lens; and the operating control system is configured so that operation of the projection exposure apparatus is controllable taking account of the telecentricity sensitivities. 11. The projection exposure apparatus of claim 10 , wherein the operating control system is configured to control the projection exposure apparatus to perform a method comprising: using the illumination system to illuminate a region of the pattern of the object with illumination radiation; using the projection lens to use projection radiation to project part of the pattern of the object in the region onto a substrate in the image field of the projection lens, wherein all rays of the projection radiation contributing to image generation in the image field form a projection beam path; and actuating a manipulator to influence a wavefront of the projection radiation, wherein the manipulator comprises a manipulator surface arranged in the projection beam path and an actuating device for reversibly changing an optical effect of the manipulator surface, wherein: manipulated value changes of the actuating device are determined by an operating control system on the basis of a control program with a correction algorithm which optimizes a target function; and the target function for at least one manipulator comprises a telecentricity sensitivity describing a relationship between a defined manipulated value change at the manipulator and an effect achievable thereby on the telecentricity of the projection radiation in the image field. 12. The projection exposure of apparatus claim 10 , wherein the projection lens comprises a dedicated telecentricity manipulator. 13. The projection exposure of apparatus claim 12 , wherein: the dedicated telecentricity manipulator comprises a first manipulator element and a second manipulator element separate from the first manipulator element; the first manipulator element is arranged in the projection beam path in or optically near a first field plane; the second manipulator element is arranged in the projection beam path in or optically near a second field plane optically conjugate to the first field plane; the projection exposure apparatus comprises an imaging lens part having a magnifying or reducing imaging scale is arranged between the first and second field planes; and the projection exposure apparatus comprises an actuating device assigned to the first and second manipulator elements; the actuating device is configured to bring about a relative change of the first and second manipulator elements with respect to each other so that one of the manipulator elements brings about a change in telecentricity, distortion and defocus and the other manipulator element partly or completely compensates for the caused change in distortion

Assignees

Inventors

Classifications

  • Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift · CPC title

  • Adaptive optics, e.g. deformable optical elements for wavefront control, e.g. for aberration adjustment or correction · CPC title

  • having a field corrector only · CPC title

  • Telecentric objectives or lens systems · CPC title

  • for use with ultraviolet radiation · CPC title

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What does patent US10761429B2 cover?
A projection exposure method and apparatus are disclosed for exposing a radiation-sensitive substrate with at least one image of a pattern of a mask under the control of an operating control system of a projection exposure apparatus, part of the pattern lying in an illumination region is imaged onto the image field on the substrate with the aid of a projection lens, wherein all rays of the proj…
Who is the assignee on this patent?
Zeiss Carl Smt Gmbh
What technology area does this patent fall under?
Primary CPC classification G03F7/70308. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Sep 01 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).