Image module package with transparent sub-assembly
US-10211191-B2 · Feb 19, 2019 · US
US10760951B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10760951-B2 |
| Application number | US-201816478040-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 18, 2018 |
| Priority date | Jan 26, 2017 |
| Publication date | Sep 1, 2020 |
| Grant date | Sep 1, 2020 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
The proposed technology relates to a window cover for a sensor package, in which a partition wall is provided between a light emitting device and a light receiving device to improve sensing accuracy and reliability of the sensor package. The proposed window cover includes: a base disposed in a direction in which light is emitted from a light source; a light emitting device cover extending from a first surface of the base and disposed at an upper portion of a light emitting device of the sensor package; and a light receiving device cover having the first surface of the base as a bottom surface thereof, and disposed at an upper portion of a light receiving device of the sensor package, wherein an outer circumference of the light emitting device cover extends in a direction opposite to the direction in which the light is emitted to form a partition wall.
Opening claim text (preview).
What is claimed is: 1. A window cover installed on a sensor package, the window cover comprising: a base disposed by facing a direction in which light is emitted from a light emitting device of the sensor package; a light emitting device cover extending from a first surface of the base in a direction toward the sensor package and disposed at an upper portion of a light emitting device of the sensor package; and a light receiving device cover having the first surface of the base as a bottom surface thereof and disposed at an upper portion of a light receiving device of the sensor package, wherein an outer circumference of the light emitting device cover extends toward a printed circuit board of the sensor package to form a partition wall, wherein the partition wall is disposed to be spaced apart from the printed circuit board, wherein the base, the light emitting device cover and the light receiving device cover are formed integrally, wherein the base has fine unevenness on a second surface thereof. 2. The window cover of claim 1 , wherein the base has an infrared filter on the second surface thereof to transmit infrared light. 3. The window cover of claim 1 , wherein the light emitting device cover has a receiving recess on the first surface thereof adjacent to the light emitting device. 4. The window cover of claim 3 , wherein the bottom surface of the receiving recess is formed in a concave shape. 5. The window cover of claim 3 , wherein the bottom surface of the receiving recess is paced apart from the light emitting device at a distance of 500 um or less. 6. The window cover of claim 1 , wherein the partition wall has a reflective coating layer on an inner surface thereof. 7. The window cover of claim 1 , wherein the partition wall extends further downward than a lower end of a lens of the light receiving device. 8. The window cover of claim 1 , wherein a plurality of light emitting device covers comprising the light emitting device cover is provided, and outside surfaces of one of the light emitting device covers and of another light emitting device cover form side surfaces of the light receiving device cover. 9. The window cover of claim 1 , wherein a thickness from the bottom surface of the light receiving device cover to a second surface of the base is 1 mm or less. 10. The window cover of claim 1 , wherein a thickness from a bottom surface of the light emitting device cover to a second surface of the base is formed thicker than a thickness from the bottom surface of the light receiving device cover to the second surface of the base. 11. The window cover of claim 1 , wherein a separation distance between a bottom surface of the light emitting device cover and the light emitting device is formed closer than a separation distance between the bottom surface of the light receiving device cover and the light receiving device. 12. The window cover of claim 1 , wherein the base, the light emitting device cover, and the light receiving device cover are formed of one selected from polycarbonate and polymethyl methacrylate.
Housings; Attachments or accessories for photometers · CPC title
Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows · CPC title
comprising a transparent member, e.g. window, protective plate · CPC title
Mixed reality (object pose determination, tracking or camera calibration for mixed reality G06T7/00) · CPC title
Field-of-view determination; Aiming or pointing of a spectrometer; Adjusting alignment; Encoding angular position; Size of measurement area; Position tracking · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.