Image module package with transparent sub-assembly

Patent metadata

Field	Value
Publication number	US-10211191-B2
Application number	US-201414453199-A
Country	US
Kind code	B2
Filing date	Aug 6, 2014
Priority date	Aug 6, 2014
Publication date	Feb 19, 2019
Grant date	Feb 19, 2019

Abstract

There is provided an image module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle.

First claim

What is claimed is:

1. An image module package, comprising:
a substrate comprising an upper surface;
a photo sensor chip disposed on the upper surface of the substrate and electrically connected to the substrate;
a first molded transparent layer covering the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the first molded transparent layer is formed with a receptacle opposite to the photo sensor chip;
an opaque layer covering the first molded transparent layer and having a through hole opposite to the receptacle; and
a glass filter accommodated in the receptacle,
wherein the through hole is smaller than a size of the glass filter such that a part of a surface of the glass filter is directly contacted with and covered by the opaque layer in a thickness direction of the substrate.

2. The image module package as claimed in claim 1 , further comprising a light emitting die disposed on the upper surface of the substrate and electrically connected to the substrate.

3. The image module package as claimed in claim 2 , further comprising a second molded transparent layer covering the light emitting die and a part of the upper surface of the substrate.

4. The image module package as claimed in claim 3 , wherein the first molded transparent layer and the second molded transparent layer are separated from each other.

5. The image module package as claimed in claim 3 , wherein a top surface of the second molded transparent layer is formed with a light guiding structure opposite to the light emitting die.

6. The image module package as claimed in claim 5 , wherein the opaque layer covers the first molded transparent layer and the second molded transparent layer, and the opaque layer has another through hole opposite to the light guiding structure.

7. The image module package as claimed in claim 6 , wherein the opaque layer is a cover or a molded light blocking layer.

8. The image module package as claimed in claim 1 , wherein the opaque layer is a cover or a molded light blocking layer.

9. The image module package as claimed in claim 1 , wherein
a shape of the receptacle is a circular shape or a rectangular shape,
a top surface of the glass filter is a flat surface, and
a transmitting spectrum of the glass filter is between 920 nm and 960 nm.

10. The image module package as claimed in claim 1 , wherein the photo sensor chip comprises a pixel array arranged under the glass filter.

11. The image module package as claimed in claim 5 , wherein the light guiding structure is integrally formed with the second molded transparent layer.

12. The image module package as claimed in claim 6 , wherein the light guiding structure is a convex dome and accommodated in the another through hole.

13. An image module package, comprising:
a substrate comprising an upper surface;
a photo sensor chip disposed on the upper surface of the substrate and electrically connected to the substrate;
a first molded transparent layer covering the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the first molded transparent layer is formed with a receptacle opposite to the photo sensor chip;
a light emitting die disposed on the upper surface of the substrate and electrically connected to the substrate;
a second molded transparent layer covering the light emitting die and a part of the upper surface of the substrate, wherein a top surface of the second molded transparent layer is formed with a light guiding structure opposite to the light emitting die;
an opaque layer covering the first molded transparent layer and the second molded transparent layer; and
a glass filter accommodated in the receptacle,
wherein a part of a surface of the glass filter is overlapped and directly contacted with the opaque layer in a thickness direction of the substrate.

14. The image module package as claimed in claim 13 , wherein the first molded transparent layer and the second molded transparent layer are separated from each other.

15. The image module package as claimed in claim 13 , wherein the opaque layer has two through holes respectively opposite to the receptacle and the light guiding structure, and the opaque layer separates the first molded transparent layer and the second molded transparent layer from each other.

16. The image module package as claimed in claim 15 , wherein the opaque layer is a cover or a molded light blocking layer.

17. The image module package as claimed in claim 15 , wherein the light guiding structure is a convex dome and accommodated in the through hole opposite thereto.

18. The image module package as claimed in claim 13 , wherein
a shape of the receptacle is a circular shape or a rectangular shape,
a top surface of the glass filter is a flat surface, and
a transmitting spectrum of the glass filter is between 920 nm and 960 nm.

19. The image module package as claimed in claim 13 , wherein the photo sensor chip comprises a pixel array arranged under the glass filter.

20. The image module package as claimed in claim 13 , wherein the light guiding structure is integrally formed with the second molded transparent layer.

21. An image module package, comprising:
a substrate comprising an upper surface;
a photo sensor chip disposed on the upper surface of the substrate and electrically connected to the substrate;
a molded transparent layer covering the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip;
an opaque layer covering the molded transparent layer and having a through hole opposite to the receptacle; and
a glass filter accommodated in the receptacle, wherein
a depth of the receptacle is identical to a thickness of the glass filter, and the glass filter fully fits in the receptacle, and
the through hole is smaller than a size of the receptacle such that a part of the opaque layer is overlapped with the receptacle in a thickness direction of the substrate and directly contacted with the glass filter.

Assignees

• Pixart Imaging Penang Sdn Bhd
• Pixart Imaging Inc

Inventors

• T'Ng Chee-Pin
• Lee Sai-Mun

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• G01J3/0256

  Compact construction · CPC title

• G01J3/0262

  Constructional arrangements for removing stray light · CPC title

• G01S7/4813

  Housing arrangements · CPC title

• G01J3/108

  for measurement in the infrared range · CPC title