LED package structure

Patent metadata

Field	Value
Publication number	US-10756244-B2
Application number	US-201815964785-A
Country	US
Kind code	B2
Filing date	Apr 27, 2018
Priority date	Mar 14, 2016
Publication date	Aug 25, 2020
Grant date	Aug 25, 2020

Abstract

An LED package structure includes a ceramic substrate, a ceramic board, a light-emitting unit, a first adhesive layer, a second adhesive layer, and a cover. The ceramic board having a thru-hole is disposed on the ceramic substrate. The light-emitting unit is disposed on the ceramic substrate and is arranged in the thru-hole of the ceramic board. The first and second adhesive layers are disposed on the ceramic board, and the second adhesive layer covers the first adhesive layer. The cover is fixed on the ceramic board by the first and second adhesive layers. Thus, the shearing force of the LED package structure of the instant disclosure is increased by having the first and second adhesive layers, which are connected to each other.

First claim

What is claimed is:

1. An LED package structure, comprising:
a substrate;
a positive electrode pad and a negative electrode pad disposed on the substrate;
a light-emitting unit disposed on the substrate, wherein the light-emitting unit is electrically connected to the positive electrode pad and the negative electrode pad via a submount thereof;
a frame disposed on the substrate and receiving the light-emitting unit;
a covering plate disposed on the frame and arranged over the light-emitting unit;
a first adhesive resin layer disposed on one of an interface between the frame and the substrate and an interface between the frame and the covering plate; and
a second adhesive resin layer stacked on the first adhesive resin layer, wherein the first adhesive resin layer is embedded in the second adhesive resin layer.

2. The LED package structure as claimed in claim 1 , wherein the first adhesive layer has a ripple surface connected to the second adhesive layer.

3. The LED package structure as claimed in claim 1 , wherein the light-emitting unit further includes and an LED chip and a lens, and the lens is disposed on a light-emitting surface of the LED chip.

4. The LED package structure as claimed in claim 1 , wherein the submount further includes two electrodes that are electrically connected to the positive electrode pad and the negative electrode pad by wire-bonding.

5. The LED package structure as claimed in claim 1 , wherein the light-emitting unit has an LED chip and a lens, and the lens is disposed on the submount to encapsulate the LED chip.

6. The LED package structure as claimed in claim 1 , wherein the first adhesive layer has a plurality of first adhesive portions, and the first adhesive portions are individually distributed at corners of one of the substrate and the frame.

7. The LED package structure as claimed in claim 6 , further comprising a second adhesive layer having a plurality of second adhesive portions respectively covering the first adhesive portions.

8. The LED package structure as claimed in claim 1 , wherein the first adhesive layer and the second adhesive layer each have a ring shape, and are formed between one of the interface between the frame and the substrate and the interface between the frame and the covering plate, and wherein an inner space of the LED package structure jointly defined by the substrate, the frame, and the covering plate is isolated from an outer space so as formed a sealed type LED.

9. The LED package structure as claimed in claim 8 , further comprising an encapsulation body arranged in the inner space.

Assignees

• Lite-On Opto Tech (Changzhou) Co Ltd
• Lite On Technology Corp

Inventors

• Chiu Kuo-Ming
• Chou Meng-Sung
• Chen Hung-Jui
• Peng Han-Hsing

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10H20/856

  Reflecting means · CPC title

• H10H20/8506 Primary

  Containers · CPC title

• H10H20/855

  Optical field-shaping means, e.g. lenses · CPC title

• H10H20/857 Primary

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title