Light emitting device package

Patent metadata

Field	Value
Publication number	US-2016013377-A1
Application number	US-201514794476-A
Country	US
Kind code	A1
Filing date	Jul 8, 2015
Priority date	Jul 8, 2014
Publication date	Jan 14, 2016
Grant date	—

Abstract

A light emitting device package may be provided that includes: a lead frame which includes a first frame and a second frame disposed on both sides of the first frame respectively; a light emitting device which is disposed on the first frame and is electrically connected to the second frame; and a resin body which includes a first resin body which is disposed between the first frame and the second frame, and a second resin body which covers an outer surface of the lead frame. An end of the first frame and an end of the second frame are disposed on an outer surface of the second resin body.

First claim

What is claimed is:

1 . A light emitting device package comprising:
a lead frame which comprises a first frame and a second frame disposed on both sides of the first frame respectively; a light emitting device which is disposed on the first frame and is electrically connected to the second frame; and a resin body which comprises a first resin body which is disposed between the first frame and the second frame, and a second resin body which covers an outer surface of the lead frame,
wherein an end of the first frame and an end of the second frame are disposed on an outer surface of the second resin body.

2 . The light emitting device package of claim 1 , wherein the end of the first frame and the end of the second frame protrude more than the outer surface of the second resin body.

3 . The light emitting device package of claim 1 , wherein the end of the first frame is a thermal calculator (TC) terminal which measures a temperature of the light emitting device.

4 . The light emitting device package of claim 1 , wherein the end of the first frame radiates heat generated from the light emitting device.

5 . The light emitting device package of claim 1 ,
wherein the first resin body comprises a top surface and a bottom surface, and wherein the width of the top surface is less than that of the bottom surface.

6 . The light emitting device package of claim 1 ,
wherein the first resin body comprises a top surface and a bottom surface, wherein the bottom surface of the first resin body comprises a straight portion and a curved portion, wherein the width of the straight portion is larger than that of the top surface, and wherein the width of the curved portion is larger than that of the straight portion.

7 . The light emitting device package of claim 1 , wherein the width of the top surface of the first resin body is from 0.3 mm to 0.5 mm.

8 . The light emitting device package of claim 1 ,
wherein the second resin body comprises a concave portion which is disposed on an outer surface of the second resin body and is coupled to a lead frame prototype, and wherein a catching protrusion is disposed on an upper portion of the concave portion.

9 . The light emitting device package of claim 1 , further comprising a reflector which is disposed on the lead frame and has a hollow portion in which the light emitting device is disposed, wherein the second resin body further comprises a wall which covers an outer surface of the reflector.

10 . The light emitting device package of claim 9 , wherein the wall has a recess into which a portion of the reflector is inserted.

11 . The light emitting device package of claim 9 , wherein the wall comprises an insulation layer disposed between the bottom surface of the reflector and the top surface of the second frame, and a protrusion disposed on the top surface of the reflector.

12 . The light emitting device package of claim 11 , wherein a thickness of the insulation layer is from 0.1 mm to 0.15 mm.

13 . The light emitting device package of claim 9 , wherein the wall comprises a guide protrusion which protrudes upward from the top surface of the wall.

14 . The light emitting device package of claim 1 , wherein a black resin is used as the resin body.

15 . A light emitting apparatus comprising a substrate and a light emitting device package disposed on the substrate,
wherein the substrate comprises a first terminal and a second terminal disposed on both sides of the first terminal respectively, wherein the light emitting device package comprises:
a first frame which is electrically connected to the first terminal, and a second frame which is disposed on both sides of the first frame respectively and is electrically connected to the second terminal;
a light emitting device which is disposed on the first frame and is electrically connected to the second frame; and
a resin body which comprises a first resin body which is disposed between the first frame and the second frame, and a second resin body which covers the lead frame,
and wherein an end of the first frame and an end of the second frame are disposed on an outer surface of the second resin body.

16 . The light emitting apparatus of claim 15 , wherein the end of the first frame and the end of the second frame protrude more than the outer surface of the second resin body.

17 . The light emitting apparatus of claim 15 , wherein the end of the first frame is a thermal calculator (TC) terminal which measures a temperature of the light emitting device.

18 . The light emitting apparatus of claim 15 , wherein the end of the first frame radiates heat generated from the light emitting device.

19 . The light emitting apparatus of claim 15 ,
wherein the first resin body comprises a top surface and a bottom surface, wherein the bottom surface of the first resin body comprises a straight portion and a curved portion, wherein the width of the straight portion is larger than that of the top surface, and wherein the width of the curved portion is larger than that of the straight portion.

20 . The light emitting apparatus of claim 15 ,
wherein the second resin body comprises a concave portion which is disposed on an outer surface of the second resin body and is coupled to a lead frame prototype, and wherein a catching protrusion is disposed on an upper portion of the concave portion.

Assignees

• Lg Innotek Co Ltd

Inventors

• Ozeki Satoshi
• Tanda Yuichiro

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/0198

  batch processes · CPC title

• H10H20/8582

  characterised by their shape · CPC title

• H10H20/856

  Reflecting means · CPC title

• H10H20/8585

  being an interconnection · CPC title