LED module and method for fabricating the same

Patent metadata

Field	Value
Publication number	US-10756070-B2
Application number	US-201916576263-A
Country	US
Kind code	B2
Filing date	Sep 19, 2019
Priority date	Aug 11, 2016
Publication date	Aug 25, 2020
Grant date	Aug 25, 2020

Abstract

Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

First claim

What is claimed is:

1. A micro LED display module comprising;
a substrate;
a plurality of electrode patterns formed on the substrate, each of which includes a first individual electrode pad, a second individual electrode pad, a third individual electrode pad and a common electrode pad; and
a plurality of groups of LED chips arranged in a matrix on the substrate and each of the groups of LED chips comprise a first LED chip, a second LED chip and a third LED chip arrayed in a line, and the first LED chip bonded the first individual electrode pad and the common electrode pad, the second LED chip bonded the second individual electrode pad and the common electrode pad, and the third LED chip bonded the third individual electrode pad and the common electrode pad,
wherein the plurality of groups of LED chips included a first interval formed between the first LED chip and the second LED chip and a second interval formed between the second LED chip and the third LED chip,
wherein the first interval and the second interval is same in the lengthwise direction.

2. The micro LED display module according to claim 1 , wherein distances of the LED chip groups in the widthwise direction are identical to those of the LED chip groups in the lengthwise direction.

3. The micro LED display module according to claim 1 , wherein the plurality of electrode patterns are disposed in a matrix on the substrate and have the same height as a whole.

4. The micro LED display module according to claim 1 , wherein the common electrode pad comprises recesses depressed inwardly from the first end line and a first branch, a second branch, and a third branch, whose shapes are defined by the recesses.

5. A micro LED display module comprising;
a substrate;
a plurality of electrode patterns formed on the substrate, each of which includes a first individual electrode pad, a second individual electrode pad, a third individual electrode pad, a first branch, a second branch and a third branch; and
a plurality of groups of LED chips arranged in a matrix on the substrate and each of the groups of LED chips comprise a first LED chip, a second LED chip and a third LED chip arrayed in a line,
wherein the first LED chip bonded the first individual electrode pad and the first branch through a first bump, the second LED chip bonded the second individual electrode pad and the second branch through a second bump and the third LED chip bonded the third individual electrode pad and the third branch through a third bump,
wherein the first bump, the second bump and the third bump having bonding areas corresponding to 50-80% of the upper surface areas of the first individual electrode pad, the second individual electrode pad and the third individual electrode pad respectively.

6. The micro LED display module according to claim 5 , wherein the first individual electrode pad, the second individual electrode pad and the third individual electrode pad includes a narrow portion and a wide portion having larger width than that of the narrow portion, and the position where a bump are formed are limited to the wide portion.

7. The micro LED display module according to claim 5 , wherein the first branch, the second branch, and the third branch are disposed in parallel at uniform intervals.

8. The micro LED display module according to claim 5 , wherein the first bump is bonded to the upper surface of the first branch and has a smaller bonding area than the upper surface area of the first branch, the second bump is bonded to the upper surface of the second branch and has a smaller bonding area than the upper surface area of the second branch and the third bump is bonded to the upper surface of the third branch and has a smaller bonding area than the upper surface area of the third branch.

9. A micro LED display module comprising;
a substrate;
a barrier formed on the substrate;
a plurality of electrode patterns formed on the substrate, each of which includes a first individual electrode pad, a second individual electrode pad, a third individual electrode pad, a first branch, a second branch and a third branch; and
a plurality of groups of LED chips arranged in a matrix on the substrate and each of the groups of LED chips comprise a first LED chip, a second LED chip, and a third LED chip arrayed in a line, and the first LED chip bonded the first individual electrode pad and the first branch through a first bump, the second LED chip bonded the second individual electrode pad and the second branch through a second bump, the third LED chip bonded the third individual electrode pad and the third branch through a third bump,
wherein the barrier includes first light reflective walls and second light reflective walls,
wherein the first light reflective walls formed between the first LED chips and the second LED chips and between the second LED chips and the third LED chips, and second light reflective walls formed between the LED chips groups adjacent to each other in the widthwise direction.

10. The micro LED display module according to claim 9 , wherein each of the first branch, the second branch, and the third branch defines an area where a bonding bump formed at one side of an LED chip of the LED chips is bonded.

11. The micro LED display module according to claim 9 , wherein a first individual electrode pad, a second individual electrode pad and a third individual electrode pad comprise a end adjacent to a first end line respectively.

12. The micro LED display module according to claim 9 , wherein the first bump is bonded to the upper surface of the first branch and has a smaller bonding area than the upper surface area of the first branch, the second bump is bonded to the upper surface of the second branch and has a smaller bonding area than the upper surface area of the second branch and the third bump is bonded to the upper surface of the third branch and has a smaller bonding area than the upper surface area of the third branch.

13. A micro LED display module comprising;
a substrate;
a plurality of electrode patterns formed on the substrate, each of which includes a first individual electrode pad, a second individual electrode pad, a third individual electrode pad, a first branch, a second branch and a third branch; and
a plurality of groups of LED chips arranged in a matrix on the substrate and each of the groups of LED chips comprise a first LED chip, a second LED chip and a third LED chip arrayed in a line, and the first LED chip bonded the first individual electrode pad and the first branch through a first bump, the second LED chip bonded the second individual electrode pad and the second branch through a second bump and the third LED chip bonded the third individual electrode pad and the third branch through a third bump,
wherein the plurality of groups of LED chips included a first interval formed between the first LED chip and the second LED chip and a second interval formed between the second LED chip and the third LED chip, and the first interval and the second interval is same in the lengthwise direction.

14. The micro LED display module according to claim 13 , wherein the LED chip groups are arranged in a matrix on the substrate with the same widthwise direction intervals and the same lengthwise direction intervals, and a distance between a first LED chip and a second LED chip is identical to a distance between the second LED chip and a third LED chip.

15. The micro LED display module according to claim 13 , wherein the first bump, the second bump and the third bump have bonding areas corresponding to 50-80% of the upper surface areas of the first branch, the second

Assignees

• Lumens Co Ltd

Inventors

• Yoo Taekyung
• Kim Daewon
• Kim Jinmo
• Choi Jinwon
• Her Jimin
• Shin Younghwan
• Han Sol
• Lee Kyujin

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W72/07236

  Soldering or alloying · CPC title

• H10W72/07234

  Using a reflow oven · CPC title