Vacuum impregnation seal in an electronic device

Patent metadata

Field	Value
Publication number	US-10754205-B2
Application number	US-201816041591-A
Country	US
Kind code	B2
Filing date	Jul 20, 2018
Priority date	Jul 20, 2018
Publication date	Aug 25, 2020
Grant date	Aug 25, 2020

Abstract

An electronic device is disclosed. The electronic device may include an enclosure that includes a metal band and a wall. The electronic device may further include a filler compound positioned in an opening of the metal band, where a split between two sidewall components defines the opening. The filler compound provides an RF communication path through the enclosure. In order to reduce or prevent liquid ingress into the enclosure, the electronic device may include a sealing compound that infused into the opening between the filler compound and the sidewall components, thereby providing a seal. The infusion process including placing the metal band (with the filler compound) in a chamber, providing a vacuum to remove air between the metal band and the filler compound, and subsequently providing a positive pressure to force the sealing compound between the metal band and the filler compound. The sealing compound may include an adhesive.

First claim

What is claimed is:

1. A portable electronic device, comprising:
a wall;
a set of metal sidewall components defining an opening, the set of metal sidewall components and the wall surrounding and defining an internal volume;
a filler compound positioned in the opening, the filler compound comprising a non-metal material, the filler compound and the set of metal sidewall components defining a gap; and
a sealing compound infused into the gap, the sealing compound forming a barrier that prevents a liquid from entering the internal volume through the gap from an external environment.

2. The portable electronic device of claim 1 , further comprising a coating that covers the set of metal sidewall components, the filler compound, and the wall.

3. The portable electronic device of claim 1 , wherein the wall comprises a transparent protective layer.

4. The portable electronic device of claim 1 , further comprising a transparent protective layer that is coupled with the set of metal sidewall components, wherein:
the set of metal sidewall components and the filler compound define a platform, and
the transparent protective layer is seated over the platform.

5. The portable electronic device of claim 1 , further comprising a wireless component positioned in the internal volume, wherein the wireless component is configured to transmit and receive radio frequency communication through the filler compound.

6. The portable electronic device of claim 1 , wherein the sealing compound comprises an adhesive suspension.

7. The portable electronic device of claim 1 , further comprising a display assembly coupled to the set of metal sidewall components.

8. A portable electronic device, comprising:
a metal band comprising a first surface and a second surface opposite the first surface, the metal band surrounding and defining an opening;
a transparent protective layer coupled to the metal band to define an internal volume;
a filler compound positioned in the opening, the filler compound and the metal band defining a gap; and
a sealing compound disposed within the gap, the sealing compound extending from the first surface to the second surface, the sealing compound forming a barrier that prevents a liquid from entering the internal volume through the gap from an external environment.

9. The portable electronic device of claim 8 , wherein the metal band comprises:
a first sidewall component; and
a second sidewall component separated from the first sidewall component by the opening.

10. The portable electronic device of claim 8 , wherein;
the metal band forms a recess,
the filler compound is interlocked with the metal band at the recess, and
the sealing compound is positioned in the recess.

11. The portable electronic device of claim 8 , further comprising a coating that covers the metal band, the transparent protective layer, the filler compound, and the sealing compound.

12. The portable electronic device of claim 11 , wherein the coating comprises-a polyurethane.

13. The portable electronic device of claim 8 , wherein the sealing compound comprises an adhesive suspension that bonds to the metal band and the filler compound.

14. A method for assembling a portable electronic device, the portable electronic device comprising a metal band and a filler compound, the method comprising:
immersing the metal band and the filler compound in a sealing compound disposed in a chamber, the metal band surrounding and defining an opening and the filler compound positioned at the opening, the metal band and the filler compound defining a gap;
reducing air pressure in the chamber from a first pressure to a second pressure less than the first pressure by removing air, wherein reducing the air pressure to the second pressure expels air from the gap;
increasing the air pressure in the chamber from the second pressure to a third pressure greater than the second pressure by providing air, wherein increasing the air pressure to the third pressure causes the sealing compound to infuse into the gap to define a barrier that prevents liquid from passing through the gap from an external environment.

15. The method of claim 14 , further comprising curing the sealing compound by providing heat.

16. The method of claim 14 , wherein the sealing compound comprises an adhesive suspension.

17. The method of claim 14 , further comprising removing the sealing compound from an outer surface of the metal band.

18. The method of claim 14 , further comprising molding the filler compound to the metal band.

19. The method of claim 18 , further comprising molding the filler compound into a recess of the metal band to interlock the filler compound with the metal band.

Assignees

• Apple Inc

Inventors

• Metin Burak
• Ames Logan M
• Wang Hailong
• Lee Ricky C
• Le Duy P

Classifications

• G06F1/1684

  Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 · CPC title

• B29C45/14311

  using means for bonding the coating to the articles (B29C45/14795 takes precedence) · CPC title

• G02F1/1341 Primary

  Filling or closing of cells · CPC title

• B29C37/0082 Primary

  Mechanical anchoring (B29C66/303 takes precedence) · CPC title

• C09J5/00

  Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers · CPC title