Adhesive bonding composition and electronic components prepared from the same

Patent metadata

Field	Value
Publication number	US-10748868-B2
Application number	US-201816103355-A
Country	US
Kind code	B2
Filing date	Aug 14, 2018
Priority date	May 6, 2010
Publication date	Aug 18, 2020
Grant date	Aug 18, 2020

Abstract

A polymerizable composition includes at least one monomer, a photoinitiator capable of initiating polymerization of the monomer when exposed to light, and a phosphor capable of producing light when exposed to radiation (typically X-rays). The material is particularly suitable for bonding components at ambient temperature in situations where the bond joint is not accessible to an external light source. An associated method includes: placing a polymerizable adhesive composition, including a photoinitiator and energy converting material, such as a down-converting phosphor, in contact with at least two components to be bonded to form an assembly; and, irradiating the assembly with radiation at a first wavelength, capable of conversion (down-conversion by the phosphor) to a second wavelength capable of activating the photoinitiator, to prepare items such as inkjet cartridges, wafer-to-wafer assemblies, semiconductors, integrated circuits, and the like.

First claim

The invention claimed is:

1. An electronic component, comprising: a substrate and one or more electronic elements, and having a lid covering at least a portion of the substrate or a portion of the one or more electronic elements, wherein the lid is attached and sealed with a cured adhesive formed from a curable adhesive composition,
wherein the curable adhesive composition comprises:
an organic vehicle comprising at least one polymerizable monomer,
at least one photo-initiator responsive to a selected wavelength of light; and
at least one energy converting material selected to emit said wavelength of light when exposed to a selected imparted radiation, wherein the at least one energy converting material is a downconverting material.

2. The electronic component of claim 1 , wherein the adhesive is an electrically conductive adhesive.

3. The electronic component of claim 1 , wherein the adhesive is a thermally conductive adhesive.

4. The electronic component of claim 2 , wherein the adhesive is a thermally conductive adhesive.

5. The electronic component of claim 3 , wherein the thermally conductive adhesive is electrically insulating.

6. The electronic component of claim 2 , wherein the electrically conductive adhesive comprises an electrically conductive filler.

7. The electronic component of claim 6 , wherein the electrically conductive filler is an organic filler.

8. The electronic component of claim 6 , wherein the electrically conductive filler is an inorganic filler.

9. The electronic component of claim 7 , wherein the organic filler is carbon.

10. The electronic component of claim 8 , wherein the inorganic filler is finely divided metal particles.

11. The electronic component of claim 10 , wherein the finely divided metal particles are formed of a metal or a metal oxide.

12. The electronic component of claim 11 , wherein the finely divided metal particles are formed of a metal selected from the group consisting of gold, silver, nickel, copper, and alloys containing at least these metals.

13. The electronic component of claim 7 , wherein the organic filler comprises small polymer beads or spheres having a conductive coating thereon.

14. The electronic component of claim 13 , wherein the conductive coating is a thin gold film.

15. The electronic component of claim 1 , wherein the curable adhesive composition further comprises a dielectric material.

16. The electronic component of claim 15 , wherein the dielectric material is a member selected from the group consisting of metal titanates and metal zirconates.

17. The electronic component of claim 1 , wherein the electronic component is a semiconductor component.

18. The electronic component of claim 17 , wherein the cured adhesive is an anisotropically conductive adhesive.

19. The electronic component of claim 1 , wherein the electronic component is an optoelectronic component.

20. The electronic component of claim 1 , wherein the electronic component is a multichip module.

21. The electronic component of claim 1 , wherein the electronic component is an integrated circuit device.

22. The electronic component of claim 21 , wherein the integrated circuit device is an integrated circuit wafer stack.

23. The electronic component of claim 1 , wherein the electronic component is a high density circuit.

24. The electronic component of claim 21 , wherein the integrated circuit device is a flip chip.

25. The electronic component of claim 24 , wherein the at least one energy converting material is a phosphor having absorption characteristics in an X-ray regime, such that inspection of the resulting flip chip can be performed using X-rays.

26. The electronic component of claim 7 , wherein the organic filler comprises anisotropic conductive polymer spheres.

27. The electronic component of claim 21 , wherein the cured adhesive further comprises anisotropic conductive polymer spheres.

28. The electronic component of claim 1 , wherein the at least one energy converting material comprises anisotropic conductive UV emitting polymer spheres.

29. The electronic component of claim 21 , wherein the at least one energy converting material comprises anisotropic conductive UV emitting polymer spheres.

30. The electronic component of claim 1 , wherein the imparted radiation is an ionizing radiation.

31. The electronic component of claim 30 , wherein the ionizing radiation is X-rays.

32. The electronic component of claim 1 wherein said organic vehicle comprises a monomer forming a thermoset resin.

33. The electronic component of claim 32 , wherein said thermoset resin is selected from the group consisting of: acrylics, phenolics, urethanes, epoxies, styrenes, and silicones.

34. The electronic component of claim 1 , wherein said at least one photoinitiator is selected from the group consisting of: benzoin ethers, benzil ketals, α-dialkoxyacetophenones, α-aminoalkylphenones, acylphosphine oxides, benzophenones/amines, thioxanthones/amines, and titanocenes.

35. The electronic component of claim 1 , wherein said wavelength of light is in the UV range and said ionizing radiation comprises X-rays.

36. The electronic component of claim 1 , wherein said downconverting material comprises dispersed inorganic particulates selected from the group consisting of: metal oxides; metal sulfides; doped metal oxides; and mixed metal chalcogenides.

37. The electronic component of claim 1 , wherein said curable adhesive composition further comprises inorganic particulates selected from the group consisting of: metals and metal alloys, ceramics and dielectrics, and metal-coated polymers.

38. The electronic component of claim 1 , wherein said curable adhesive composition further comprises an organic component selected from the group consisting of: solvents, viscosity modifiers, surfactants, dispersants, and plasticizers.

39. The electronic component of claim 1 , wherein the at least one photo-initiator and the at least one energy converting material are chemically tethered to one another.

40. The electronic component of claim 1 , wherein the cured adhesive is in the form of a film.

41. The electronic component of claim 40 , wherein the cured adhesive in the form of a film is partially cured.

42. The cured adhesive of claim 40 , wherein the film has anisotropic properties.

43. The electronic component of claim 17 , wherein the cured adhesive is an isotropically conductive adhesive.

44. A phosphor composition, comprising:
one or more phosphors having on a surface thereof a coating selected from the group consisting of silica, diamond, and diamond-like carbon, said one or more phosphors configured to emit radiation upon interaction with an initiation energy.

45. The phosphor composition of claim 44 , wherein the one or more phosphors comprises one or more of visible emitting phosphors and ultraviolet emitting phosphors.

46. The phosphor composition of claim 44 , wherein the one or more of phosphors comprises a mixture of the phosphors.

47. The phosphor composition of claim

Assignees

• Immunolight Llc

Inventors

• Fathi Zakaryae
• Clayton James
• Walder Harold
• Bourke Jr Frederic A

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/288

  characterised by arrangements for thermal management of the stacked chips · CPC title

• H10W90/20

  Configurations of stacked chips · CPC title