Adhesive bonding composition and electronic components prepared from the same

Patent metadata

Field	Value
Publication number	US-10074627-B2
Application number	US-201715455573-A
Country	US
Kind code	B2
Filing date	Mar 10, 2017
Priority date	May 6, 2010
Publication date	Sep 11, 2018
Grant date	Sep 11, 2018

Abstract

A polymerizable composition includes at least one monomer, a photoinitiator capable of initiating polymerization of the monomer when exposed to light, and a phosphor capable of producing light when exposed to radiation (typically X-rays). The material is particularly suitable for bonding components at ambient temperature in situations where the bond joint is not accessible to an external light source. An associated method includes: placing a polymerizable adhesive composition, including a photoinitiator and energy converting material, such as a down-converting phosphor, in contact with at least two components to be bonded to form an assembly; and, irradiating the assembly with radiation at a first wavelength, capable of conversion (down-conversion by the phosphor) to a second wavelength capable of activating the photoinitiator, to prepare items such as inkjet cartridges, wafer-to-wafer assemblies, semiconductors, integrated circuits, and the like.

First claim

The invention claimed is:

1. An electronic component, comprising: a substrate and one or more electronic elements, wherein the electronic component contains a cured adhesive formed from a curable adhesive composition,
wherein the curable adhesive composition comprises:
an organic vehicle comprising at least one polymerizable monomer,
at least one photo-initiator responsive to a selected wavelength of light; and
at least one energy converting material selected to emit said wavelength of light when exposed to a selected imparted radiation, wherein the at least one energy converting material is a downconverting material,
wherein the electronic component is a semiconductor component.

2. The electronic component of claim 1 , wherein the adhesive is an electrically conductive adhesive.

3. The electronic component of claim 1 , wherein the adhesive is a thermally conductive adhesive.

4. The electronic component of claim 2 , wherein the adhesive is a thermally conductive adhesive.

5. The electronic component of claim 3 , wherein the thermally conductive adhesive is electrically insulating.

6. The electronic component of claim 2 , wherein the electrically conductive adhesive comprises an electrically conductive filler.

7. The electronic component of claim 6 , wherein the electrically conductive filler is an organic filler.

8. The electronic component of claim 6 , wherein the electrically conductive filler is an inorganic filler.

9. The electronic component of claim 7 , wherein the organic filler is carbon.

10. The electronic component of claim 8 , wherein the inorganic filler is finely divided metal particles.

11. The electronic component of claim 10 , wherein the finely divided metal particles are formed of a metal or a metal oxide.

12. The electronic component of claim 11 , wherein the finely divided metal particles are formed of a metal selected from the group consisting of gold, silver, nickel, copper, and alloys containing at least these metals.

13. The electronic component of claim 7 , wherein the organic filler comprises small polymer beads or spheres having a conductive coating thereon.

14. The electronic component of claim 13 , wherein therein the conductive coating is a thin gold film.

15. The electronic component of claim 1 , wherein the curable adhesive composition further comprises a dielectric material.

16. The electronic component of claim 15 , wherein the dielectric material is a member selected from the group consisting of metal titanates and metal zirconates.

17. The electronic component of claim 1 , wherein the cured adhesive is present in a form selected from the group consisting of glob-top structures, dam-and-fill structures, underfill structures, die-underfill structures, and lid sealing structures.

18. The electronic component of claim 1 , wherein the semiconductor component contains a wafer bonding connection and the wafer bonding is provided by the cured adhesive.

19. The electronic component of claim 1 , wherein the semiconductor component contains a die to wafer connection and the die to wafer bonding is provided by the cured adhesive.

20. The electronic component of claim 1 , wherein the semiconductor component contains a die to die connection and the die to die bonding is provided by the cured adhesive.

21. The electronic component of claim 1 wherein the semiconductor component contains a package on package assembly and package on package assembly is bonded with the cured adhesive.

22. The electronic component of claim 1 , wherein the cured adhesive is an anisotropically conductive adhesive.

23. The electronic component of claim 18 , wherein the cured adhesive is an anisotropically conductive adhesive.

24. The electronic component of claim 19 , wherein the cured adhesive is an anisotropically conductive adhesive.

25. The electronic component of claim 20 , wherein the cured adhesive is an anisotropically conductive adhesive.

26. The electronic component of claim 21 , wherein the cured adhesive is an anisotropically conductive adhesive.

27. The electronic component of claim 1 , wherein the semiconductor component is a front end semiconductor and the cured adhesive is present as a pattern gate structure.

28. The electronic component of claim 1 , wherein the electronic component is an optoelectronic component.

29. The electronic component of claim 1 , wherein the electronic component is a multichip module having a die on KOVAR substrate.

30. The electronic component of claim 1 , wherein the electronic component is a multichip module, and the cured adhesive is present as a lid sealer on the multichip module.

31. The electronic component of claim 1 , wherein the electronic component is an integrated circuit device.

32. The electronic component of claim 31 , wherein the integrated circuit device is an integrated circuit wafer stack.

33. The electronic component of claim 32 , wherein the integrated circuit wafer stack comprises at least two integrated circuit wafers which are electrically connected to one another, and having Through Silicon Via (TSV) contacts, and the cured adhesive is present between the integrated circuit wafers, adhering the integrated circuit wafers one to another.

34. The electronic component of claim 33 , wherein the cured adhesive provides the electrical connection between the integrated circuit wafers.

35. The electronic component of claim 1 , wherein the electronic component is a high density circuit.

36. The electronic component of claim 31 , wherein the integrated circuit device is a flip chip.

37. The electronic component of claim 36 , wherein the cured adhesive is present as a flip chip underfill.

38. The electronic component of claim 37 , wherein the at least one energy converting material is a phosphor having absorption characteristics in an X-ray regime, such that inspection of the resulting flip chip can be performed using X-rays.

39. The electronic component of claim 1 , wherein the electronic component further comprises a micro-ball-grid-array encapsulated by the cured adhesive.

40. The electronic component of claim 1 , wherein the electronic component comprises a flexible circuit electrically connected with a semiconductor integrated circuit by tape automatic bonding (TAB) technique, wherein the TAB area is encapsulated by the cured adhesive.

41. The electronic component of claim 7 , wherein the organic filler comprises anisotropic conductive polymer spheres.

42. The electronic component of claim 31 , wherein the cured adhesive further comprises anisotropic conductive polymer spheres.

43. The electronic component of claim 1 , wherein the at least one energy converting material comprises anisotropic conductive UV emitting polymer spheres.

44. The electronic component of claim 31 , wherein the at least one energy converting material comprises anisotropic conductive UV emitting polymer spheres.

45. The electronic component of claim 1 , wherein the imparted radiation is an ionizing radiation.

46. The electronic component of claim 45 , wherein the ioniz

Assignees

• Immunolight Llc

Inventors

• Fathi Zakaryae
• Clayton James
• Walder Harold
• Bourke Jr Frederic A

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/288

  characterised by arrangements for thermal management of the stacked chips · CPC title

• H10W90/20

  Configurations of stacked chips · CPC title