Capacitor assembly

Patent metadata

Field	Value
Publication number	US-10748711-B2
Application number	US-201716090200-A
Country	US
Kind code	B2
Filing date	Feb 23, 2017
Priority date	Mar 31, 2016
Publication date	Aug 18, 2020
Grant date	Aug 18, 2020

Abstract

The present invention relates to a capacitor assembly ( 1 ) which comprises at least one ceramic multilayer capacitor ( 2 ) comprising ceramic layers ( 4 ) and first and second electrodes ( 5 a, 5 b ) arranged therebetween, and a base ( 3 ). The base ( 3 ) comprises a substrate ( 9 ) and conductor tracks ( 10 a, 10 b ), wherein the conductor tracks ( 10 a, 10 b ) lead from a top side ( 11 ) of the substrate ( 9 ) said top side facing toward the multilayer capacitor ( 2 ), to an underside ( 12 ) of the substrate ( 9 ), said underside facing away from the multilayer capacitor ( 2 ). The multilayer capacitor ( 2 ) is mechanically secured on the base ( 3 ). The first electrodes ( 5 a ) and the second electrodes ( 5 c ) are electrically contacted with the conductor tracks ( 10 a, 10 b ).

First claim

The invention claimed is:

1. A capacitor assembly comprising
a plurality of multilayer capacitors including a first multilayer capacitor and a second multilayer capacitor, each comprising ceramic layers and first and second electrodes arranged therebetween, and
a base comprising a substrate and conductor tracks wherein the conductor tracks lead from a top side of the substrate, said top side facing toward the plurality of multilayer capacitors, to an underside of the substrate, said underside facing away from the plurality of multilayer capacitors, wherein the base further comprises at least one slot extending between the first and second multilayer capacitors without cutting the base into two separate parts,
wherein each of the plurality of multilayer is capacitors are mechanically secured on the base and wherein the first and second electrodes are electrically contacted with the conductor tracks,
wherein each of the plurality of multilayer capacitors comprise external contacts arranged on an outer surface facing toward the base to provide a single-sided connection.

2. The capacitor assembly according to claim 1 ,
wherein the first and the second electrodes of each of the plurality of multilayer capacitors bear against the outer surface facing toward the base.

3. The capacitor assembly according to claim 1 ,
wherein each of the plurality of multilayer capacitors comprises a first external contact and a second external contact, which are arranged on the outer surface,
wherein the first electrodes are connected to one of the conductor tracks via the first external contact, and
wherein the second electrodes are connected to one of the conductor tracks via the second external contact.

4. The capacitor assembly according to claim 1 ,
wherein each of the plurality of multilayer capacitors bears by at least half of a first outer surface directly on the base.

5. The capacitor assembly according to claim 1 ,
wherein each of the plurality of multilayer capacitors is connected to the base by a layer comprising silver.

6. The capacitor assembly according to claim 1 ,
wherein each of the plurality of multilayer capacitors is connected to the base by a layer formed by applying a paste and subsequent sintering.

7. The capacitor assembly according to claim 1 ,
wherein the first multilayer capacitor and the second multilayer capacitor are connected in parallel with one another.

8. The capacitor assembly according to claim 1 ,
wherein the capacitor assembly is an SMD device.

9. The capacitor assembly according to claim 1 ,
wherein the material and the thickness of the substrate and also the material and the thickness of the conductor tracks are chosen such that the base has a coefficient of thermal expansion that is adapted to a coefficient of thermal expansion of the plurality of multilayer capacitors.

10. The capacitor assembly according to claim 1 ,
wherein the base and the plurality of multilayer capacitors have a same width.

11. The capacitor assembly according to claim 1 ,
wherein the substrate comprises silicon nitride, aluminum oxide or aluminum nitride.

12. The capacitor assembly according to claim 1 ,
wherein the conductor tracks consist of copper.

13. The capacitor assembly according to claim 1 ,
wherein the conductor tracks have a thickness of between 0.05 mm and 1.0 mm.

Assignees

• Epcos Ag
• Tdk Electronics Ag

Inventors

• Konrad Juergen
• Koini Markus
• Rinner Franz

Classifications

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/38

  Multiple capacitors, i.e. structural combinations of fixed capacitors · CPC title

• H01G2/065

  for surface mounting, e.g. chip capacitors · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title