Assemblies, optical connectors and methods of bonding optical elements to substrates

Patent metadata

Field	Value
Publication number	US-10746937-B2
Application number	US-201916663917-A
Country	US
Kind code	B2
Filing date	Oct 25, 2019
Priority date	Feb 15, 2018
Publication date	Aug 18, 2020
Grant date	Aug 18, 2020

Abstract

Assemblies, optical connectors, and methods for bonding optical elements to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical element to a substrate includes disposing a film layer on a surface of the substrate, disposing the optical element on a surface of the film layer, and directing a laser beam into the optical element. The method further includes melting, using the diameter laser beam, a material of the substrate to create a bond area between the optical element and the surface of the substrate. The film layer is capable of absorbing a wavelength of the laser beam to melt the material of the substrate at the bond area. The bond area includes laser-melted material of the substrate that bonds the optical element to the substrate.

First claim

The invention claimed is:

1. A method of bonding an optical element to a substrate, the method comprising:
disposing a film layer on a surface of the substrate;
disposing the optical element on a surface of the film layer;
directing a laser beam into the optical element; and
melting, using the laser beam that was directed into the optical element, a material of the substrate to create a bond area between the optical element and the surface of the substrate, wherein the film layer is capable of absorbing a wavelength of the laser beam to melt the material of the substrate at the bond area, and the bond area comprises laser-melted material of the substrate that bonds the optical element to the substrate.

2. The method of claim 1 , wherein the optical element is a curved optical element.

3. The method of claim 2 , wherein the curved optical element comprises a curved surface that focuses the laser beam to a focused diameter that is smaller than an initial diameter of the laser beam when the laser beam entered the optical element.

4. The method of claim 1 , wherein the optical element is one of an optical fiber, a gradient-index lens, a cylindrical waveguide, a concave lens, and a convex lens.

5. The method of claim 1 , wherein a displacement of a center of the optical element before bonding the optical element to the substrate and after bonding the optical element to the substrate is less than or equal to about 0.2 μm.

6. The method of claim 1 , further comprising locating a focal point of the laser beam on the surface of the substrate.

7. The method of claim 1 , further comprising:
translating the laser beam or the substrate in a first direction transverse to a longitudinal axis of the optical element such that the laser beam passes over the optical element to form the bond area;
then shifting a position of the laser beam or the substrate in a direction parallel to the longitudinal axis of the optical element; and
then translating the laser beam or the substrate in a second direction transverse to the longitudinal axis of the optical element.

8. The method of claim 7 , further comprising placing one or more additional optical elements on the surface of the substrate.

9. The method of claim 8 , further comprising translating the laser beam or the substrate in the first direction such that the laser beam passes over the one or more additional optical elements.

10. The method of claim 1 , further comprising, prior to directing the laser beam into the optical element, placing a fixture on the surface of the substrate, wherein the fixture comprises a groove and an open region, and wherein the fixture is placed on the surface of the substrate such that the optical element is disposed within the groove.

11. The method of claim 10 , further comprising translating the laser beam or the substrate such that the laser beam enters through the open region and passes over the optical element.

12. The method of claim 1 , further comprising utilizing a single mode laser source to generate the laser beam, wherein the laser beam has an optical power within a range of 2 W to 10 W.

13. The method of claim 1 , wherein a diameter of the laser beam is between 80 μm and 400 μm.

14. The method of claim 1 , further comprising pulsing the laser beam with a pulse duration less than 1 picosecond.

15. The method of claim 1 , wherein the optical element is a planar optical element.

16. The method of claim 15 , wherein the planar optical element is one of a waveguide substrate, an optical filter and an active optical component.

17. The method of claim 15 , wherein the planar optical element is one of a wavelength division multiplexing chip and an optical filter and the substrate is the other of the wavelength division multiplexing chip and the optical filter.

18. The method of claim 15 , wherein:
the substrate is a spacer comprising a first surface and a second surface; the film layer comprises a first film layer on the first surface of the spacer and a second film layer on the second surface of the spacer;
the planar optical element is a first planar optical element that is disposed on the first film layer; and
directing the laser beam into the planar optical element comprises passing the laser beam through the second film layer at a first location such that a beam waist of the laser beam formed at the first film layer creates a first bond area between the first planar optical element and the first surface of the spacer.

19. The method of claim 18 , further comprising:
disposing a second planar optical element on the second film layer; and
directing the laser beam to form a beam waist at the second film layer at a location other than the first location such that the beam waist of the laser beam at the second film layer creates a second bond area between the second planar optical element and the second surface of the spacer.

20. The method of claim 1 , further comprising applying an adhesive to the optical element and the substrate after directing the laser beam into the optical element.

21. A method of bonding a gradient-index (GRIN) lens to a substrate, the method comprising:
disposing a film layer on a surface of the substrate;
disposing the GRIN lens on a surface of the film layer;

directing a laser beam into the GRIN lens, wherein the GRIN lens comprises a curved surface and the curved surface focuses the laser beam to a focused diameter that is smaller than an initial diameter of the laser beam when the laser beam entered the GRIN lens; and
melting, using the focused diameter laser beam, a material of the substrate to create a bond area between the GRIN lens and the surface of the substrate, wherein the film layer is capable of absorbing a wavelength of the laser beam to melt the material of the substrate at the bond area, and the bond area comprises laser-melted material of the substrate that bonds the GRIN lens to the substrate.

22. The method of claim 21 , further comprising utilizing a single mode laser source to generate the laser beam, wherein the laser beam has an optical power within a range of 2 W to 10 W.

Assignees

• Corning Inc

Inventors

• Butler Douglas Llewellyn
• Logunov Stephan Lvovich
• Quesada Mark Alejandro
• Streltsov Alexander Mikhailovich
• Sutherland James Scott

Classifications

• B23K2103/54

  Glass · CPC title

• B23K2103/18

  Dissimilar materials · CPC title

• B23K26/32

  taking account of the properties of the material involved · CPC title

• B23K26/0624

  using ultrashort pulses, i.e. pulses of 1 ns or less · CPC title

• G02B6/30

  for use between fibre and thin-film device · CPC title