Thermally releasable adhesive member and display apparatus including the same

Patent metadata

Field	Value
Publication number	US-10745592-B2
Application number	US-201815971453-A
Country	US
Kind code	B2
Filing date	May 4, 2018
Priority date	Jun 13, 2017
Publication date	Aug 18, 2020
Grant date	Aug 18, 2020

Abstract

A thermally releasable adhesive member includes a base resin and microcapsules dispersed in the base resin. At least one of the microcapsules includes a shell part which comprises a hydrophobic polymer material, and a hollow part which is defined by the shell part and contains an organic solvent.

First claim

What is claimed is:

1. A thermally releasable adhesive member, comprising:
a base resin and
microcapsules dispersed in the base resin,
wherein at least one of the microcapsules comprises:
a shell part which comprises a hydrophobic polymer material; and
a hollow part which is defined by the shell part and contains an organic solvent,

wherein a particle size of the at least one of the microcapsules is from 50 nanometers to 450 nanometers.

2. The thermally releasable adhesive member of claim 1 , wherein the hydrophobic polymer material has solubility in water of 1.0 or less at room temperature.

3. The thermally releasable adhesive member of claim 1 , wherein the hydrophobic polymer material comprises any one of polymethylmethacrylate, polymethylacrylate, polystyrene, polyvinyl acetate, polyvinyl benzoate, polyacrylonitrile, and polymethacrylonitrile, or a copolymer formed of or including a combination thereof.

4. The thermally releasable adhesive member of claim 1 , wherein the hydrophobic polymer material comprises a copolymer of polyacrylonitrile and polymethylmethacrylate.

5. The thermally releasable adhesive member of claim 1 , wherein a vaporization temperature of the organic solvent is from 50° C. to 150° C.

6. The thermally releasable adhesive member of claim 1 , wherein the organic solvent has solubility in water of 1.0 or less at room temperature.

7. The thermally releasable adhesive member of claim 1 , wherein the organic solvent comprises at least one of methylcyclohexane, cyclohexane, cyclopentane, isooctane, tert-butylacetate, heptene, and heptane.

8. The thermally releasable adhesive member of claim 5 , wherein the at least one of the microcapsules has a first volume at room temperature and a second volume greater than the first volume at the vaporization temperature or higher.

9. The thermally releasable adhesive member of claim 5 , wherein the thermally releasable adhesive member has a first adhesive force at room temperature and a second adhesive force at the vaporization temperature, and
the second adhesive force is equal to or less than 90 percentages (%) of the first adhesive force.

10. The thermally releasable adhesive member of claim 1 , wherein an optical transmittance of the thermally releasable adhesive member in a wavelength region of 400 nanometers to 800 nanometers is 90% or more.

11. The thermally releasable adhesive member of claim 1 , wherein a haze value of the thermally releasable adhesive member is 0.1% or less.

12. The thermally releasable adhesive member of claim 1 , wherein an amount ratio of the microcapsules dispersed in the base resin is from 0.05 weight percentages (wt %) to 40 wt % of a total amount of the base resin and the microcapsules.

13. The thermally releasable adhesive member of claim 1 , wherein the thermally releasable adhesive member is a double-sided adhesive sheet which comprises a first side and a second side opposite to the second side, and
a dispersion density of the microcapsules decreases from the first side to the second side.

14. The thermally releasable adhesive member of claim 1 , wherein the thermally releasable adhesive member comprises:
a first adhesive part in which the microcapsules are dispersed with a first density;
a second adhesive part in which the microcapsules are dispersed with a second density; and
a third adhesive part disposed between the first adhesive part and the second adhesive part, microcapsules in the third adhesive part being dispersed with a third density,
wherein the third density is smaller than or equal to a lower density of the first density and the second density.

15. The thermally releasable adhesive member of claim 1 , wherein the base resin comprises at least one of an acrylate-based resin, a silicone-based resin, a urethane-based resin, an epoxy-based resin, a rubber-based resin, and a polyester-based resin.

16. A thermally releasable adhesive member comprising:
an optically clear base resin; and
microcapsules, at least one of the microcapsules comprises
a hydrophobic shell part,
a hollow part which is defined by the hydrophobic shell part, and
an organic solvent contained in the hollow part,

wherein a particle size of the at least one of the microcapsules is from 50 nanometers to 450 nanometers.

17. The thermally releasable adhesive member of claim 16 , wherein the optically clear base resin comprises an acrylate-based adhesive resin, and the hydrophobic shell part comprises an acrylate-based polymer.

Assignees

• Samsung Display Co Ltd
• Myongji Univ Industry And Academia Cooperation Foundation

Inventors

• Ahn Byungwook
• Park Jongdeok
• Hwang Jeongho
• Lee Junhyup
• Son Intae
• Lee Byungsun

Classifications

• C09J2301/312

  parameters being the characterizing feature · CPC title

• C09J2301/124

  the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape · CPC title

• C09J183/04

  Polysiloxanes · CPC title

• C09J167/00

  Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain (based on polyester-amides C09J177/12; based on polyester-imides C09J179/08); Adhesives based on derivatives of such polymers · CPC title

• C09J163/00

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title