Light emitting device

Patent metadata

Field	Value
Publication number	US-10738987-B2
Application number	US-201816046681-A
Country	US
Kind code	B2
Filing date	Jul 26, 2018
Priority date	Jul 28, 2017
Publication date	Aug 11, 2020
Grant date	Aug 11, 2020

Abstract

A light emitting device includes a semiconductor light emitting element to emit an excitation light, a wavelength converting member to emit fluorescent light upon being irradiated with the excitation light, a package supporting the semiconductor light emitting element and the wavelength converting member, and a first photodetector configured to detect the excitation light and a second photodetector to detect the fluorescent light, located in the package.

First claim

What is claimed is:

1. A light emitting device comprising:
a semiconductor light emitting element to emit an excitation light;
a wavelength converting member to emit fluorescent light upon being irradiated with the excitation light;
a package supporting the semiconductor light emitting element and the wavelength converting member; and
a first photodetector configured to detect the excitation light and a second photodetector configured to detect the fluorescent light, located in the package.

2. The light emitting device according to claim 1 , further comprising a controller configured to stop light emission of the semiconductor light emitting element based on a ratio between a detected value of the excitation light from the first photodetector and a detected value of the fluorescent light from the second photodetector.

3. The light emitting device according to claim 2 , wherein the first photodetector to detect the excitation light comprises a band pass filter configured to pass the excitation light, and the second photodetector to detect the fluorescent light comprises a band pass filter configured to pass the fluorescent light.

4. The light emitting device according to claim 3 , wherein the first photodetector and the second photodetector are disposed close to each other.

5. The light emitting device according to claim 2 , wherein the first photodetector and the second photodetector are disposed close to each other.

6. The light emitting device according to claim 1 , wherein the first photodetector to detect the excitation light comprises a band pass filter configured to pass the excitation light, and the second photodetector to detect the fluorescent light comprises a band pass filter configured to pass the fluorescent light.

7. The light emitting device according to claim 6 , wherein the first photodetector and the second photodetector are disposed close to each other.

8. The light emitting device according to claim 1 , wherein the first photodetector and the second photodetector are disposed close to each other.

9. The light emitting device according to claim 1 , wherein the wavelength converting member is a light transmissive member.

10. The light emitting device according to claim 1 , wherein the wavelength converting member has a layered structure of a light-transmissive layer and a light-reflecting layer.

11. The light emitting device according to claim 1 , wherein the light emitting element is a semiconductor laser element.

12. The light emitting device according to claim 11 , wherein the first photodetector and the second photodetector are disposed such that a laser light from an end surface opposite side of a main emission end surface of the semiconductor laser element does not enter the first photodetector and the second photodetector laser.

13. The light emitting device according to claim 1 , wherein the second photodetector is configured to photoelectrically convert and detect the fluorescent light, and is not sensitive to the excitation light.

14. The light emitting device according to claim 1 , wherein the package includes a stem having a base part and a block part, a cap, and a support.

15. The light emitting device according to claim 14 , wherein the semiconductor light emitting element is fixed via a sub-mount on a lateral surface of the block part of the stem.

16. The light emitting device according to claim 14 , wherein the cap is bonded on an upper surface of the base part near outer periphery of the base part of the stem.

17. The light emitting device according to claim 14 , wherein the semiconductor light emitting element, the first photodetector and the second photodetector are covered by the cap.

18. The light emitting device according to claim 1 , wherein the package includes
a housing,
a cover covering an upper surface of the housing and having a window for extracting light, and
a light-transmissive cap hermetically sealing and protecting the window.

19. The light emitting device according to claim 18 , wherein the semiconductor light emitting element, the first photodetector and the second photodetector are covered by the cover and the light transmissive cap.

Assignees

• Nichia Corp

Inventors

• Kuribayashi Wataru
• Miyoshi Takashi
• Morizumi Naoto

Classifications

• H10F55/15

  wherein the radiation-sensitive devices and the electric light source are all semiconductor devices · CPC title

• F21V29/10 Primary

  Arrangement of heat-generating components to reduce thermal damage, e.g. by distancing heat-generating components from other components to be protected · CPC title

• H01S5/0087 Primary

  for illuminating phosphorescent or fluorescent materials, e.g. using optical arrangements specifically adapted for guiding or shaping laser beams illuminating these materials · CPC title

• H01S5/02325

  Mechanically integrated components on mount members or optical micro-benches · CPC title

• H01S5/02257

  using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing · CPC title