Method for manufacturing an optical communication device

Patent metadata

Field	Value
Publication number	US-10735101-B2
Application number	US-201715664981-A
Country	US
Kind code	B2
Filing date	Jul 31, 2017
Priority date	Nov 5, 2013
Publication date	Aug 4, 2020
Grant date	Aug 4, 2020

Abstract

A method of manufacturing an optical communication device includes preparing first and second pre-defined break lines in a carrier wafer. A first sub-mount is positioned near the first break line to accommodate an optical laser and a second sub-mount is positioned near the second break line to accommodate an optical modulator. The first sub-mount is secured to a thermally conductive and electrically nonconductive spacer which is secured to a thermo-electrical cooler that defines a gap between the first submount and the thermo-electrical cooler. A portion of the carrier wafer between the sub-mounts is removed.

First claim

What is claimed:

1. A method of manufacturing an optical communication device, comprising:
preparing a first pre-defined break line in a carrier wafer proximate to a first portion of the carrier wafer;
preparing a second pre-defined break line in the carrier wafer proximate to a second portion of the carrier wafer;
positioning a first thermally conductive sub-mount, having an optical laser on the first thermally conductive sub-mount, the first thermally conductive sub-mount is on the carrier wafer substantially adjacent to the first pre-defined break line in the carrier wafer;
positioning a second sub-mount, having an optical modulator on the second sub-mount, the second sub-mount is on the carrier wafer substantially adjacent to the second pre-defined break line in the carrier wafer;
aligning the first thermally conductive sub-mount and the second sub-mount to respective positions to match a position of an output from the optical laser with an optical height of the optical modulator;
securing the first thermally conductive sub-mount to a thermally conductive and electrically non-conductive spacer;
securing the thermally conductive and electrically non-conductive spacer to a thermoelectric cooler wherein the thermoelectric cooler is in a position that defines a gap between the first thermally conductive sub-mount and the thermo-electrical cooler;
after securing the thermally conductive and electrically non-conductive spacer to the thermoelectric cooler, removing a middle section of the carrier wafer between the first thermally conductive sub-mount and the second sub-mount by breaking the carrier wafer along the first pre-defined break line and the second pre-defined break line.

2. The method of claim 1 , further comprising:
sealing the first thermally conductive sub-mount in a hermetic enclosure; and
providing a connector in communication with the second sub-mount in order to use the optical communication device in an optical network.

3. The method of claim 2 , further comprising:
ensuring proper coupling of laser beams sent from the first thermally conductive sub-mount to the second sub-mount; and
adding an optical flat in order to recover coupling loss between the first thermally conductive sub-mount and the second sub-mount.

4. The method of claim 1 , further comprising filling the gap with a non-conductive epoxy.

5. The method of claim 1 , further comprising adjusting a height of the electrically non-conductive spacer in a z-direction for the aligning of the first thermally conductive sub-mount to the second sub-mount.

6. The method of claim 1 , wherein the aligning comprises an alignment in a z-direction via bond line control between the first thermally conductive sub-mount and the optical laser and the second sub-mount and the optical modulator.

7. The method of claim 1 , further comprising aligning the first thermally conductive sub-mount and the second sub-mount in x and y directions that are horizontal directions relative to the carrier wafer using a jaw tool.

8. The method of claim 1 further comprising aligning the first thermally conductive sub-mount and second sub-mount in x and y directions using an inverted pyramid alignment feature.

9. The method of claim 1 , wherein the first thermally conductive sub-mount is configured to accommodate four lasers.

10. The method of claim 1 , wherein the first thermally conductive sub-mount is further configured to accommodate an isolator.

11. The method of claim 1 , further comprising the step of using a ceramic filled epoxy to attach the portion of the first thermally conductive sub-mount configured to accommodate an optical laser to the thermo-electrical cooler in order to decrease the risk of electrical shortage at the first thermally conductive sub-mount.

Assignees

• Cisco Tech Inc

Inventors

• Pfnuer Stefan
• Kachru Ravi
• Fangman John
• Chakrabarti Utpal

Classifications

• H10W90/00

  Package configurations · CPC title

• H10H20/858

  Means for heat extraction or cooling · CPC title

• H10H20/852

  Encapsulations · CPC title

• G02B6/4251 Primary

  Sealed packages (G02B6/4248 takes precedence) · CPC title

• H01S5/0233

  Mounting configuration of laser chips · CPC title