Optical communication device, reception apparatus, transmission apparatus, and transmission and reception system
US-2015145086-A1 · May 28, 2015 · US
US2016154195A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016154195-A1 |
| Application number | US-201514952805-A |
| Country | US |
| Kind code | A1 |
| Filing date | Nov 25, 2015 |
| Priority date | Nov 27, 2014 |
| Publication date | Jun 2, 2016 |
| Grant date | — |
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Provided herein is an optical module including: an optical receptacle including a first lens and a second lens; a lens module including a lens unit facing the second lens of the optical receptacle; and an optical element configured to receive a beam emitted from the lens module or form a beam to be emitted to the lens module. A horizontal length and a vertical length of a cross-section of the first lens may differ from each other, and a horizontal length and a vertical length of a cross-section of the second lens may differ from each other.
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1 . An optical module comprising: an optical receptacle including a first lens and a second lens; a lens module including a lens unit facing the second lens of the optical receptacle; and an optical element configured to receive a beam emitted from the lens module or form a beam to be emitted to the lens module, wherein a horizontal length and a vertical length of a cross-section of the first lens differ from each other, and a horizontal length and a vertical length of a cross-section of the second lens differ from each other. 2 . The optical module according to claim 1 , further comprising: an alignment board provided to align the lens module. 3 . The optical module of claim 2 , wherein the lens module includes a guide column, and wherein the alignment board includes a guide column alignment hole into which the guide column is inserted. 4 . The optical module of claim 2 , wherein the alignment board includes an alignment mark for mounting of the optical element, and wherein the optical element is mounted on the alignment mark. 5 . The optical module of claim 1 , wherein the lens module comprises a lens module body in which the lens unit is included, wherein the lens unit is formed on a surface of the lens module body that faces the second lens, and a surface of the lens module body that faces the surface formed with the lens unit comprises an inclined reflective surface. 6 . The optical module of claim 5 , wherein the lens module comprise a lower lens unit formed on a lower surface of the lens module body, wherein the optical element is disposed below the lower lens unit, and wherein the lens module comprises a protrusion provided on the lower surface of the lens module body and configured to maintain a distance between the optical element and the lower lens unit. 7 . The optical module of claim 3 , further comprising: a printed circuit board mounted with the lens module and the alignment board, wherein the printed circuit board includes a filter module alignment hole into which the guide column is inserted. 8 . The optical module of claim 2 , further comprising: a drive integrated circuit disposed on the alignment board. 9 . The optical module of claim 7 , further comprising: a package mounted with the printed circuit board, the package comprising a package guide column configured to mount the printed circuit board in the package, wherein the printed circuit board includes a package alignment hole into which the package guide column is inserted. 10 . The optical module according to claim 1 , wherein the lens module further comprises a block filter provided in the lens unit. 11 . The optical module according to claim 1 , wherein at least one of the first lens, the second lens, and the lens unit comprises a spherical lens or an aspherical lens. 12 . The optical module according to claim 1 , wherein the optical element comprises an array-type optical element. 13 . A method of manufacturing an optical module, comprising: forming an optical receptacle including a first lens formed such that a horizontal length and a vertical length of a cross-section thereof differ from each other, and a second lens formed such that a horizontal length and a vertical length of a cross-section thereof differ from each other; forming a lens module including a lens unit and a guide column; aligning the lens module by inserting the guide column of the lens module into a guide column alignment hole of an alignment board; and aligning the optical receptacle such that the lens unit faces the second lens of the optical receptacle. 14 . The method of claim 13 , further comprising: aligning the lens module and the alignment board on a printed circuit board by inserting the guide column into a filter module alignment hole of the printed circuit board. 15 . The method according to claim 13 , wherein the aligning of the lens module comprises: mounting an optical element on an alignment mark of the alignment board. 16 . The method of claim 14 , further comprising: aligning the printed circuit board in a package by inserting a package guide column of the package into a package alignment hole of the printed circuit board. 17 . The method according to claim 16 , wherein the aligning of the optical receptacle comprises: sealing the optical receptacle with the package. 18 . The method according to claim 13 , wherein the forming of the optical receptacle comprises: forming the optical receptacle using a plastic injection molding method, and wherein the forming of the lens module comprises: forming the lens module using a plastic injection molding method. 19 . (canceled) 20 . The method according to claim 13 , wherein at least one of the first lens, the second lens, and the lens unit is formed in a spherical or aspherical shape. 21 . The optical module according to claim 1 , wherein the lens unit comprises a plurality of lenses.
the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device (G02B6/4246 takes precedence) · CPC title
Optical features (semiconductor laser arrays H01S5/40; hybrid LED arrays H10W90/00) · CPC title
containing printed circuit boards [PCB] · CPC title
Sealed packages (G02B6/4248 takes precedence) · CPC title
Active alignment methods, e.g. procedures and algorithms · CPC title
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