Control device with semiconductor module having bent latch, control, power supply and motor control terminals

Patent metadata

Field	Value
Publication number	US-10734869-B2
Application number	US-201515569115-A
Country	US
Kind code	B2
Filing date	Apr 27, 2015
Priority date	Apr 27, 2015
Publication date	Aug 4, 2020
Grant date	Aug 4, 2020

Abstract

The present invention is concerning the control device equipped with a motor 2 and a control unit 1 which is coaxial to the motor 2 . An upper frame 40 is arranged at a boundary between the motor 2 and the control unit 1 . A semiconductor module 35 , an intermediate member 50 , and a control board 3 are provided in the control unit 1 . For assembly of the semiconductor module 35 and the intermediate member 50 , a latch portion 35 f is provided on one of the semiconductor module 35 and the intermediate member 50 , and an engaged portion into which the latch portion 35 f locks is provided on the other of the semiconductor module 35 and the intermediate member 50 , whereby positioning of the semiconductor module 35 and the intermediate member 50 is achieved.

First claim

The invention claimed is:

1. A control device comprising:
a housing;
a motor provided in the housing;
a control unit provided in the housing and used for controlling the motor; and
a frame arranged in the housing and constituting a boundary plate between the motor and the control unit, wherein
a semiconductor module, an intermediate member, and a control board are stacked sequentially in the control unit,
the semiconductor module is disposed between the frame and the intermediate member so as to be in contact with the frame and the intermediate member,
the semiconductor module is provided with connection terminals and a latch portion,
an engagement portion is provided on the intermediate member,
at least one of the latch portion and the engagement portion is formed from an insulator,
the semiconductor module and the intermediate member are engaged with each other by engaging the latch portion with the engagement portion,
recessed portions for positioning a plurality of semiconductor modules are provided in a lower surface of the intermediate member,
the recessed portions are arranged sequentially counter clockwise around the shaft, and
terminal holes are formed adjacent to the recessed portions.

2. The control device according to claim 1 , wherein
the latch portion is formed by elongating a portion of a lead frame provided in the semiconductor module.

3. The control device according to claim 1 , wherein at least one other recessed portion is provided in an upper surface of the intermediate member so as to hug an outer shape of at least one capacitor.

4. The control device according to claim 1 , wherein the intermediate member comprises at least two different types of holes including a first type of hole corresponding to a hole that allows a terminal to pass through, and a second type of hole having a conical shape in which a terminal is not allowed to pass through.

5. The control device according to claim 1 , wherein the intermediate member is formed from an insulating resin.

6. The control device according to claim 1 , wherein
a plurality of terminals, which include a motor control terminal connected to a coil winding terminal of the motor, a control terminal to which a control command signal is input from the control board, and a power supply system terminal, are disposed on at least one side of the semiconductor module, and
the latch portion is disposed on another side of the semiconductor module at which the plurality of terminals are not disposed.

7. The control device according to claim 6 , wherein
the latch portion provided on the semiconductor module, the motor control terminal, the control terminal, and the power supply system terminal are all folded so as to extend in the same direction.

8. A control device comprising:
a housing;
a motor provided in the housing;
a control unit provided in the housing and used for controlling the motor; and
a frame arranged in the housing and constituting a boundary plate between the motor and the control unit, wherein
a semiconductor module, an intermediate member, and a control board are stacked sequentially in the control unit,
the semiconductor module is disposed between the frame and the intermediate member so as to be in contact with the frame and the intermediate member,
the semiconductor module is provided with connection terminals and a latch portion,
an engagement portion is provided on the intermediate member,
at least one of the latch portion and the engagement portion is formed from an insulator,
the semiconductor module and the intermediate member are engaged with each other by engaging the latch portion with the engagement portion, and
the intermediate member comprises at least two different types of holes including a first type of hole corresponding to a hole that allows a terminal to pass through, and a second type of hole having a conical shape in which a terminal is not allowed to pass through.

9. The control device according to claim 8 , wherein the latch portion is formed by elongating a portion of a lead frame provided in the semiconductor module.

10. The control device according to claim 8 , wherein recessed portions for positioning a plurality of semiconductor modules are provided in a lower surface of the intermediate member, the recessed portions are arranged sequentially counter clockwise around a shaft, and terminal holes are formed around the recessed portions.

11. The control device according to claim 8 , wherein recessed portions are provided in an upper surface of the intermediate member so as to hug an outer shape of capacitors.

12. The control device according to claim 8 , wherein the intermediate member is formed from an insulating resin.

13. The control device according to claim 8 , wherein
a plurality of terminals, which include a motor control terminal connected to a coil winding terminal of the motor, a control terminal to which a control command signal is input from the control board, and a power supply system terminal, are disposed on at least one side of the semiconductor module, and
the latch portion is disposed on another side of the semiconductor module at which the plurality of terminals are not disposed.

14. The control device according to claim 13 , wherein the latch portion provided on the semiconductor module, the motor control terminal, the control terminal, and the power supply system terminal are all folded so as to extend in the same direction.

Assignees

• Mitsubishi Electric Corp

Inventors

• Kawaguchi Takahisa
• Takashima Kazuhisa

Classifications

• H10W90/766

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/07651

  characterised by changes in properties of the strap connectors during connecting · CPC title

• H10W72/926

  Multiple bond pads having different sizes · CPC title

• H10W72/871

  Bond wires and strap connectors · CPC title