Method for forming fine patterns
US-2017348729-A1 · Dec 7, 2017 · US
US10732503B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10732503-B2 |
| Application number | US-201816039341-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 19, 2018 |
| Priority date | Sep 30, 2015 |
| Publication date | Aug 4, 2020 |
| Grant date | Aug 4, 2020 |
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A method of manufacturing a wire grid pattern includes providing a laminate having a base member, a metal layer disposed on the base member, a mask layer disposed on the metal layer and containing a metal oxide, an adhesive layer disposed on the mask layer, and a patterned resin layer disposed on the adhesive layer and formed by irradiation of first light; and irradiating the laminate with second light. The adhesive layer may comprise a silane coupling agent.
Opening claim text (preview).
What is claimed is: 1. A silane coupling agent, represented by Chemical Formula 2-1 or Chemical Formula 3-1 below: in the formula 2-1, R 1 and R 2 are each independently any one of —CH 3 , —OCH 2 CH 3 , —OCH 3 , and a functional group represented by Chemical Formula 2-2 below; and in the formula 3-1, R 1 and R 2 are each independently any one of —CH 3 , —OCH 2 CH 3 , —OCH 3 , and a functional group represented by Chemical Formula 3-2 below, and wherein in the formulae 2-1, 2-2, 3-1, and 3-2, R 3 is any one of an acrylate group and a methacrylate group, and n is an integer of 1 to 10. 2. The silane coupling agent of claim 1 , wherein, in the formulae 2-1 and 3-1, R 1 and R 2 are each independently any one of functional groups represented by —CH 3 , —OCH 2 CH 3 , and —OCH 3 .
comprising electrically conductive elements, e.g. wire grids, conductive particles · CPC title
Compounds having Si-O-C linkages (Si-O-acyl linkages C07F7/1896) · CPC title
Recycling of unreacted starting or intermediate materials · CPC title
Etching metallic material by chemical means (manufacture of printing surfaces B41C; manufacture of printed circuits H05K) · CPC title
Preparation; Treatments not provided for in C07F7/20 · CPC title
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