Photoresist composition, method of forming a pattern and method of manufacturing a thin film transistor substrate

Patent metadata

Field	Value
Publication number	US-9343553-B2
Application number	US-201414522713-A
Country	US
Kind code	B2
Filing date	Oct 24, 2014
Priority date	Jan 22, 2014
Publication date	May 17, 2016
Grant date	May 17, 2016

Abstract

A photoresist composition, a method of forming a pattern, and a method of manufacturing a thin film transistor substrate, the composition including a solvent, a novolak resin, a diazide-based photo-sensitizer, an acryl compound represented by the following Chemical Formula 1:

First claim

What is claimed is:

1. A photoresist composition, comprising:
a solvent;
a novolak resin;
a diazide-based photo-sensitizer; and
an acryl compound represented by the following Chemical Formula 1, wherein:
R1 is a hydrogen atom or a methyl group,
R2 is an aromatic group or an alkyl group, the alkyl group having 1 to about 1,000 carbon atoms and having a linear shape or a branched shape,
R3, R4 and R5 are each independently an alkoxyl group, the alkoxy group having 1 to about 1,000 carbon atoms and having a linear shape or a branched shape, and
X, Y and Z are each independently an integer of 1 to about 100,

2. The photoresist composition as claimed in claim 1 , wherein the composition includes:
about 5 to about 30% by weight of the novolak resin,
about 2 to about 10% by weight of the diazide-based photo-sensitizer,
about 0.03 to about 2% by weight of the acryl compound, and
a balance of the solvent.

3. The photoresist composition as claimed in claim 2 , wherein a weight average molecular weight of the acryl compound is about 5,000 to about 30,000.

4. The photoresist composition as claimed in claim 3 , wherein the acryl compound represented by Chemical Formula 1 is represented by the following Chemical Formula 2, in which:
R6 is an alkyl group, the alkyl group having about 10 to about 70 carbon atoms and having a linear shape, and
n is an integer of about 10 to about 40,

5. The photoresist composition as claimed in claim 2 , wherein the diazide-based photo-sensitizer includes a product of reaction of a naphthoquinone diazide sulfonate halogen compound with a phenol compound.

6. The photoresist composition as claimed in claim 5 , wherein the diazide-based photo-sensitizer includes at least one selected from the group of 2,3,4-trihydroxybenzophenone-1,2-naphthoquinonediazide-5-sulfonate, and 2,3,4,4-tetrahydroxybenzophenone-1,2-naphthoquinonediazide-5-sulfonate.

7. The photoresist composition as claimed in claim 2 , wherein a weight average molecular weight of the novolak resin is about 4,000 to about 30,000.

8. The photoresist composition as claimed in claim 2 , wherein the solvent includes at least one selected from the group of a glycol ether, an ethylene glycol alkyl ether acetate, and a diethylene glycol.

9. A method of forming a pattern, the method comprising:
forming an object layer on a base substrate;
coating a photoresist composition on the object layer to form a photoresist layer, the photoresist composition including a novolak resin, a photo-sensitizer, an acryl compound, and a solvent, the acryl compound being represented by the following Chemical Formula 1, wherein:
R1 is a hydrogen atom or a methyl group,
R2 is an aromatic group or an alkyl group, the alkyl group having 1 to about 1,000 carbon atoms and having a linear shape or a branched shape,
R3, R4, and R5 are each independently an alkoxyl group, the alkoxy group having 1 to about 1,000 carbon atoms and having a linear shape or a branched shape, and
X, Y and Z are each independently an integer of 1 to about 100;

exposing the photoresist layer to a light;
partially removing the photoresist layer to form a photoresist pattern; and
patterning the object layer by using the photoresist pattern as a mask.

10. The method as claimed in claim 9 , wherein the photoresist composition includes:
about 5 to about 30% by weight of the novolak resin,
about 2 to about 10% by weight of the diazide-based photo-sensitizer,
about 0.03 to about 2% by weight of the acryl compound, and a balance of the solvent.

11. The method as claimed in claim 10 , wherein a weight average molecular weight of the acryl compound is about 5,000 to about 30,000.

12. The method as claimed in claim 11 , wherein the acryl compound represented by Chemical Formula 1 is represented by the following Chemical Formula 2, in which:
R6 is an alkyl group, the alkyl group having about 10 to about 70 carbon atoms and having a linear shape, and
n is an integer of about 10 to about 40,

13. The method as claimed in claim 9 , wherein the object layer includes a metal oxide.

14. The method as claimed in claim 13 , wherein the metal oxide includes at least one selected from the group of zinc oxide, zinc tin oxide, zinc indium oxide, indium oxide, titanium oxide, indium gallium zinc oxide, indium zinc tin oxide, indium tin oxide, gallium zinc oxide, zinc aluminum oxide, and indium gallium oxide.

15. A method of manufacturing a thin film transistor substrate, the method comprising:
forming a gate electrode on a base substrate;
forming a gate insulation layer covering the gate electrode;
forming an oxide semiconductor layer on the gate insulation layer;
forming a source metal layer on the oxide semiconductor layer such that the source metal layer includes a metal layer and a conductive oxide layer on the metal layer;
coating a photoresist composition on the conductive oxide layer to form a first photoresist pattern, the photoresist composition including a novolak resin, a photo-sensitizer, an acryl compound, and a solvent, the acryl compound being represented by the following Chemical Formula 1, wherein:
R1 is a hydrogen atom or a methyl group,
R2 is an aromatic group or an alkyl group, the alkyl group having 1 to about 1,000 carbon atoms and having a linear shape or a branched shape,
R3, R4, and R5 are each independently an alkoxyl group, the alkoxy group having 1 to about 1,000 carbon atoms and having a linear shape or a branched shape, and
X, Y and Z are each independently an integer of 1 to about 100;

etching the source metal layer by using the first photoresist pattern as a mask to form a source metal pattern;
partially removing the first photoresist pattern to form a second photoresist pattern; and
etching the source metal pattern by using the second photoresist pattern as a mask to form a source electrode and a drain electrode.

16. The method as claimed in claim 15 , wherein the photoresist composition includes:
about 5 to about 30% by weight of the novolak resin,
about 2 to about 10% by weight of the diazide-based photo-sensitizer,
about 0.03 to about 2% by weight of the acryl compound, and
a balance of the solvent.

17. The method as claimed in claim 16 , wherein a weight average molecular weight of the acryl compound is about 5,000 to about 30,000.

18. The method as claimed in claim 17 , wherein the acryl compound represented by Chemical Formula 1 is represented by the following Chemical Formula 2, in which:
R6 is an alkyl group, the alkyl group having about 10 to about 70 carbon atoms and having a linear shape, and
n is an integer of about 10 to about 40,

19. The method as claimed in claim 15 , wherein the conductive oxide layer includes at least one selected from the group of indium zinc oxide, indium tin oxide, gallium zinc oxide, and zinc aluminum oxide.

20. The method as cl

Assignees

• Samsung Display Co Ltd

Inventors

• Lee Jung-Soo
• Park Jeong-Min
• Park Sung-Kyun
• Chun Jun
• Cho Ki-Hyun
• Kim Ji-Hyun
• Kim Dong-Min
• Kim Seung-Ki
• Jeagal Eun

Classifications

• H10P50/73

  using masks for insulating materials · CPC title

• G03F7/0236

  Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins · CPC title

• G03F7/0757

  Macromolecular compounds containing Si-O, Si-C or Si-N bonds (G03F7/0752 takes precedence) · CPC title

• G03F7/0751

  used as adhesion-promoting additives or as means to improve adhesion · CPC title

• G03F7/0755

  Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds (G03F7/0752 takes precedence) · CPC title