Impingement cooling device for a laser disk and associated laser disk module

Patent metadata

Field	Value
Publication number	US-10727639-B2
Application number	US-201816148269-A
Country	US
Kind code	B2
Filing date	Oct 1, 2018
Priority date	Apr 5, 2016
Publication date	Jul 28, 2020
Grant date	Jul 28, 2020

Abstract

Impingement cooling devices for a laser disk include a carrier plate on the front side of which the laser disk can be secured, and a supporting structure, on the front side of which the rear side of the carrier plate is secured. The supporting structure has a plurality of cooling liquid feed lines from which the cooling liquid emerges in the direction of the rear side of the carrier plate and a plurality of cooling liquid return lines. The feed and return lines run parallel to one another in the longitudinal direction of the supporting structure, and the supporting structure includes a plurality of cutouts or the rear side of the carrier plate that are open toward the supporting structure, and the cooling liquid feed lines lead into and the cooling liquid return lines lead away from the plurality of cutouts.

First claim

What is claimed is:

1. An impingement cooling device for a laser disk, the impingement cooling device comprising:
a carrier plate configured to secure the laser disk on a front side and having a rear side;
an impingement cooling area for indirectly cooling the carrier plate by a cooling liquid; and
a supporting structure secured on a front side thereof to the rear side of the carrier plate, wherein the supporting structure comprises a supporting body comprising:
a plurality of cooling liquid feed lines from which the cooling liquid emerges towards the rear side of the carrier plate, and
a plurality of cooling liquid return lines, wherein the feed and return lines run parallel to one another in a longitudinal direction of the supporting structure, and
a plurality of close-ended inner cutouts in a region adjoining the rear side of the carrier plate that are closed toward the rear side of the carrier plate and prevent fluid contact with the carrier plate,

wherein the cooling liquid feed lines lead into the plurality of cutouts and the cooling liquid return lines lead away from the plurality of cutouts and wherein the feed lines are each formed by a separate tube that is arranged in a through-channel of the supporting body, and the return lines in the supporting body are respectively formed by an annular gap between the through-channel and the tube, or vice versa.

2. The impingement cooling device of claim 1 , wherein the carrier plate is disk-shaped.

3. The impingement cooling device of claim 1 , wherein cooling liquid emerges towards the rear side of the carrier plate at right angles with respect to the rear side of the carrier plate.

4. The impingement cooling device of claim 1 , wherein the carrier plate is formed from diamond material and has a thickness of at most 5 mm.

5. The impingement cooling device of claim 1 , wherein the carrier plate is formed from diamond material and has a thickness of at most 3 mm.

6. The impingement cooling device of claim 1 , wherein the carrier plate is formed from diamond material and has a thickness of at most 2 mm.

7. The impingement cooling device of claim 1 , wherein the supporting body is formed from ceramic or hard metal and has a thickness of at least about 0.5 cm.

8. The impingement cooling device of claim 7 , wherein the supporting body is formed from ceramic or metal and has a thickness of between about 0.5 cm and about 10 cm.

9. The impingement cooling device of claim 1 , wherein the carrier plate and the supporting structure are respectively soldered, glued, sintered, or bonded to one another.

10. A laser disk module with an impingement cooling device of claim 1 and with a laser disk that is secured on the front side of the carrier plate of the impingement cooling device.

Assignees

• Trumpf Laser Gmbh

Inventors

• Killi Alexander
• Kuhn Vincent

Classifications

• H10W40/475

  using jet impingement (H10W40/776 takes precedence) · CPC title

• H01S3/0604

  in the form of a plate or disc · CPC title

• H01S3/0407 Primary

  Liquid cooling, e.g. by water · CPC title

• H01S3/0405

  Conductive cooling, e.g. by heat sinks or thermo-electric elements · CPC title

• H01S3/042

  for solid state lasers {(H01S3/0401 takes precedence)} · CPC title