Semiconductor chip having a mask layer with openings

Patent metadata

Field	Value
Publication number	US-10727052-B2
Application number	US-201916240142-A
Country	US
Kind code	B2
Filing date	Jan 4, 2019
Priority date	Sep 29, 2014
Publication date	Jul 28, 2020
Grant date	Jul 28, 2020

Abstract

A semiconductor chip is disclosed. In an embodiment a semiconductor chip includes a multiply-connected mask layer comprising openings, the openings completely penetrate the mask layer and a semiconductor layer sequence, which, at least in places, is in direct contact with the mask layer, wherein the semiconductor layer sequence is disposed on the mask layer, wherein the mask layer comprises a light-transmissive material, and wherein the light-transmissive material comprises an optical refractive index for light which is smaller than a refractive index of the semiconductor layer sequence.

First claim

What is claimed is:

1. A semiconductor chip comprising:
a multiply-connected mask layer comprising openings, the openings completely penetrate the mask layer; and
a semiconductor layer sequence, which, at least in places is in direct contact with the mask layer,
wherein the semiconductor layer sequence is disposed on the mask layer,
wherein the mask layer comprises a light-transmissive material, and
wherein the light-transmissive material comprises an optical refractive index for light which is smaller than a refractive index of the semiconductor layer sequence;
wherein the semiconductor layer sequence includes an active region configured to generate light, and wherein light generated in the active region impinges, at least partially, on the mask layer.

2. The semiconductor chip according to claim 1 , wherein the mask layer includes four or more openings.

3. The semiconductor chip according to claim 1 , further comprising a growth substrate having a growth surface, wherein the growth surface comprises sapphire, and wherein the mask layer is arranged between the growth surface and the semiconductor layer sequence.

4. The semiconductor chip according to claim 3 , wherein the semiconductor layer sequence is in regions of the openings, at least in places in direct contact with the growth surface of the growth substrate.

5. The semiconductor chip according to claim 4 , wherein the optical refractive index of the light-transmissive material of the mask layer is smaller than a refractive index of the growth substrate.

6. The semiconductor chip according to claim 4 , wherein the mask layer is partially removed and hollow spaces are arranged between the semiconductor layer sequence and the growth substrate in the places where the mask layer had previously been arranged.

7. The semiconductor chip according to claim 6 , wherein the hollow spaces are filled with gas.

8. The semiconductor chip according to claim 1 , wherein the mask layer is partially removed.

9. The semiconductor chip according to claim 1 , wherein the mask layer contains a silicon oxide.

10. The semiconductor chip according to claim 1 , wherein a distance between nearest openings is between at least 0.5 μm and at most 15 μm for at least some openings.

11. The semiconductor chip according to claim 1 , wherein the openings are arranged at lattice points of a regular lattice.

12. The semiconductor chip according to claim 1 , wherein a maximum lateral opening dimension is between at least 0.6 μm and at most 2.0 μm for at least some of the openings.

13. The semiconductor chip according to claim 1 , wherein a thickness of the mask layer is between at least 0.2 μm and 10 μm at most.

14. The semiconductor chip according to claim 1 , wherein the semiconductor layer sequence is completely formed over the mask layer.

Assignees

• Osram Oled Gmbh

Inventors

• Gotschke Tobias
• Off Jürgen
• Perzlmaier Korbinian

Classifications

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P14/3416

  Nitrides · CPC title

• H10P14/2921

  being crystalline insulating materials · CPC title

• H10P14/271 Primary

  characterised by the preparation of substrate for selective deposition · CPC title

• H10H20/81

  Bodies · CPC title