Server

Patent metadata

Field	Value
Publication number	US-10716233-B2
Application number	US-201616066869-A
Country	US
Kind code	B2
Filing date	Jan 29, 2016
Priority date	Jan 29, 2016
Publication date	Jul 14, 2020
Grant date	Jul 14, 2020

Abstract

According to an example, a server may include a housing including a bottom portion, a first node defined by first and second printed circuit assemblies, and a second node defined by third and fourth printed circuit assemblies.

First claim

What is claimed is:

1. A server comprising:
a housing including a top side and a bottom portion;
a first node defined by first and second printed circuit assemblies respectively disposed adjacent to the top side and the bottom portion of the housing;
a second node defined by third and fourth printed circuit assemblies respectively disposed adjacent to the top side and the bottom portion of the housing;
two sets of memory components disposed on each of the second and fourth printed circuit assemblies;
a processor disposed between each set of the memory components;
a first connector attaching the first and second printed circuit assemblies to one another; and
a second connector attaching the third and fourth printed circuit assemblies to one another.

2. The server according to claim 1 , wherein the housing includes a thickness of approximately 1.75 inches.

3. The server according to claim 1 , wherein the housing includes a length of approximately 27 inches.

4. The server according to claim 1 , wherein
the bottom portion of the housing includes a first side and a second side opposite the first side, and
the first and second sides of the housing are approximately perpendicular to the bottom portion of the housing.

5. The server according to claim 1 , further comprising:
memory components mounted on the second and fourth printed circuit assemblies.

6. The server according to claim 5 , wherein the memory components are vertical memory components disposed in a plurality of rows.

7. The server according to claim 1 , further comprising:
two sets of memory components disposed on each of the second and fourth printed circuit assemblies; and
a heat sink disposed between each set of the memory components, each heat sink in respective contiguous engagement with circuits of the first and second printed circuit assemblies, and circuits of the third and fourth printed circuit assemblies.

8. The server according to claim 1 , further comprising:
mezzanine boards disposed on the first and third printed circuit assemblies opposite to processors disposed on the second and fourth printed circuit assemblies when the first and second nodes are positioned in the housing.

9. The server according to claim 1 , wherein the second node is substantially similar to the first node.

10. A server comprising:
a housing including a top side and a bottom portion;
a first node defined by first and second printed circuit assemblies respectively disposed adjacent to the top side and the bottom portion of the housing;
a second node defined by third and fourth printed circuit assemblies respectively disposed adjacent to the top side and the bottom portion of the housing;
a first connector attaching the first and second printed circuit assemblies to one another;
a second connector attaching the third and fourth printed circuit assemblies to one another;
two sets of memory components disposed on each of the second and fourth printed circuit assemblies; and
a heat sink disposed between each set of the memory components, each heat sink in respective contiguous engagement with circuits of the first and second printed circuit assemblies, and circuits of the third and fourth printed circuit assemblies.

11. The server according to claim 10 , further comprising:
memory components disposed on each of the second and fourth printed circuit assemblies; and
a processor disposed adjacent each of the memory components.

12. A method of implementing a server, the method comprising:
providing a housing having a top portion and a bottom portion;
attaching a first printed circuit assembly of a first node to the top portion of the housing;
attaching a second printed circuit assembly of the first node to the bottom portion of the housing;
attaching a third printed circuit assembly of a second node to the top portion of the housing;
attaching a fourth printed circuit assembly of the second node to the bottom portion of the housing;
attaching the first and second printed circuit assemblies to one another by a first connector;
attaching the third and further printed circuit assemblies to one another by a second connector;
attaching mezzanine boards to the first and third printed circuit assemblies; and
attaching processors to the second and fourth printed circuit assemblies opposite to the attached mezzanine boards.

13. The method of claim 12 , further comprising positioning the top portion of the housing on the bottom portion of the housing so that the first and second nodes are enclosed in the housing.

14. The method of claim 12 , further comprising:
placing the housing in a rack.

15. The server of claim 10 , wherein each of the first, second, third, and fourth printed circuit assemblies include circuits that are disposed in a meshing configuration when the first and second nodes are positioned in the housing.

16. The method of claim 13 , wherein positioning the top portion of the housing on the bottom portion of the housing so that the first and second nodes are enclosed in the housing further comprises:
positioning the top portion of the housing on the bottom portion of the housing so that the first and second nodes are enclosed in the housing, the first and second printed circuit assemblies are disposed opposite one another, and the third and fourth printed circuit assemblies are disposed opposite one another.

Assignees

• Hewlett Packard Entpr Dev Lp

Inventors

• Madanipour Zheila N
• Michna Vincent W
• Raymond Patrick
• Franz John

Classifications

• G06F1/185

  Mounting of expansion boards · CPC title

• H05K7/20709

  for server racks or cabinets; for data centers, e.g. 19-inch computer racks · CPC title

• G06F1/184

  Mounting of motherboards · CPC title

• G06F1/20

  Cooling means · CPC title

• H05K7/1487 Primary

  Blade assemblies, e.g. blade cases or inner arrangements within a blade · CPC title