Warm water cooling

Patent metadata

Field	Value
Publication number	US-10712031-B2
Application number	US-201816166418-A
Country	US
Kind code	B2
Filing date	Oct 22, 2018
Priority date	Jun 1, 2006
Publication date	Jul 14, 2020
Grant date	Jul 14, 2020

Abstract

A method of providing cooled air to electronic equipment includes capturing heated air from a volume containing electronic equipment, cooling the heated air by more than fifteen degrees Celsius in an air-to-water heat exchanger, and supplying cooling water to the air-to-water heat exchanger at a temperature above a dew point temperature of the heated air.

First claim

What is claimed is:

1. A data center cooling system comprising:
a plurality of evaporative cooling units sized to provide sufficient cooling for the data center on a worst-case expected design day, the plurality of evaporative cooling units configured to maintain a cooling setpoint that is based on an expected wet bulb temperature occurring for one week or more;
a plurality of heat exchangers for transferring heat from electronic equipment in the data center to the plurality of evaporative cooling units; and
a plant that excludes chillers or comprises a chiller sized to provide less than a total amount of the cooling provided by the data center cooling system.

2. The system of claim 1 , wherein the plurality of evaporative cooling units comprises a plurality of hybrid cooling towers.

3. The system of claim 1 , wherein the plurality of heat exchangers comprise a plurality of cooling coils located adjacent to one or more common hot air plenums that each receive heated air from a plurality of computers.

4. The system of claim 3 , further comprising a plurality of fans to circulate air through the plurality of cooling coils and to provide cooled air directly into an occupied workspace.

5. The system of claim 3 , wherein the one or more common hot air plenums are positioned between a front face of the cooling coils and a volume that contains the electronic equipment, and the one or more common hot air plenums are configured to capture substantially only air heated by the electronic equipment, and capture substantially no air that is not from the volume containing the electronic equipment.

6. The system of claim 1 , wherein a flow of cooling liquid is returned from the plurality of heat exchangers at a temperature above 40 degrees Celsius.

7. The system of claim 1 , further comprising one or more pumps to circulate cooling liquid from the plurality of heat exchangers to the plurality of evaporative cooling units at a temperature that is more than 15 degrees Celsius warmer than the temperature of the cooling liquid circulated to the plurality of heat exchangers.

8. The system of claim 2 , wherein each of the plurality of hybrid cooling towers comprises at least one fan and at least one water-to-water heat exchanger.

9. The system of claim 1 , wherein a temperature of cooling liquid circulated to the plurality of evaporative cooling units is more than 10 degrees Celsius warmer than the cooling liquid supplied from the plurality of evaporative cooling units.

10. The system of claim 1 , wherein an approach temperature that is defined by a difference between an air temperature of cooled air leaving the plurality of heat exchangers and a temperature of cooling liquid entering the plurality of heat exchangers is less than 5 degrees Celsius.

11. The system of claim 1 , wherein the chiller is sized to provide less than the total amount of the cooling provided by the data center cooling system on the worst-case expected design day.

12. The system of claim 1 , wherein the cooling setpoint changes over a time duration.

13. The system of claim 1 , wherein the plurality of evaporative cooling units maintain a setpoint that maintains air around the electronic equipment at a temperature below an expected failure level for the electronic equipment.

14. The system of claim 13 , wherein the setpoint maintains a temperature in a human-occupied space around the electronic equipment above 75 deg. Fahrenheit.

15. The system of claim 4 , wherein the one or more fans circulate captured air heated by the electronic equipment from the one or more common warm air plenums to the plurality of cooling coils, and the one or more fans circulate cooled air from the plurality of cooling coils into an occupied workspace around the electronic equipment.

16. The system of claim 15 , wherein one or more fans draw air directly from the occupied workspace into open-front racks that hold the electronic equipment.

17. The system of claim 16 , wherein the one or more fans circulate the captured air heated by the heat generating electronic equipment from the one or more common hot air plenums into an attic space, and the one or more fans deliver the captured air to the occupied workspace through a conduit adjacent to the occupied workspace.

18. The system of claim 4 , wherein the one or more fans control flow rates of air through racks containing the electronic equipment and the one or more common hot air plenums.

19. The system of claim 5 , wherein the cooling towers comprise hybrid cooling towers.

20. The system of claim 1 , wherein heated air enters the plurality of heat exchangers at a temperature over 110 deg. Fahrenheit.

Assignees

• Google Llc

Inventors

• Carlson Andrew B
• Whitted William H
• Clidaras Jimmy
• Hamburgen William
• Aigner Gerald
• Beaty Donald L

Classifications

• Y02B30/54

  Free-cooling systems · CPC title

• H05K7/20745

  within rooms for removing heat from cabinets, e.g. by air conditioning device · CPC title

• H05K7/20736

  within cabinets for removing heat from server blades · CPC title

• F24F11/0001 Primary

  for ventilation (F24F11/30 takes precedence) · CPC title

• H05K7/20836

  Thermal management, e.g. server temperature control · CPC title