Warm water cooling

Patent metadata

Field	Value
Publication number	US-9970670-B2
Application number	US-201213617936-A
Country	US
Kind code	B2
Filing date	Sep 14, 2012
Priority date	Jun 1, 2006
Publication date	May 15, 2018
Grant date	May 15, 2018

Abstract

A method of providing cooled air to electronic equipment includes capturing heated air from a volume containing electronic equipment, cooling the heated air by more than fifteen degrees Celsius in an air-to-water heat exchanger, and supplying cooling water to the air-to-water heat exchanger at a temperature above a dew point temperature of the heated air.

First claim

What is claimed is:

1. A method of providing cooled air to electronic equipment, comprising:
capturing air from a human-occupiable workspace in a data center;
circulating the air through a volume containing electronic equipment so that the air rises in temperature by twenty degrees Celsius or more from an ambient temperature of the workspace as it passes through the volume;
cooling the heated air by twenty degrees Celsius or more in an air-to-water heat exchanger;
supplying cooling water to the air-to-water heat exchanger at a temperature above a dew point temperature of the heated air that enters the air-to-water heat exchanger;
controlling the water to maintain the temperature of the cooling water at the temperature above the dew point temperature of the heated air that enters the air-to-water heat exchanger; and
circulating the water from the air-to-water-heat exchanger to a compressorless and burner-less water cooler and transferring heat from the water to an ambient environment in the compressorless and burner-less water cooler.

2. The method of claim 1 , wherein the step of capturing the heated air comprises capturing substantially only the heated air, and capturing substantially no air that is not from the volume containing the electronic equipment.

3. The method of claim 1 , wherein the cooling water is returned from the air-to-water heat exchanger at a temperature above 40 degrees Celsius.

4. The method of claim 1 , further comprising returning water from the air-to-water heat exchanger, wherein the temperature of the supplied cooling water is more than 15 degrees Celsius cooler than the temperature of the returned water.

5. The method of claim 1 , wherein the compressorless water cooler comprises one or more cooling towers.

6. The method of claim 1 , wherein the temperature of the water circulated to the compressorless water cooler is more than 10 degrees Celsius warmer than the water supplied from the compressorless water cooler.

7. The method of claim 1 , wherein an approach temperature that is defined by a difference between an air temperature of the cooled air leaving the air-to-water heat exchanger and a water temperature of the cooling water entering the air-to-water heat exchanger is less than about 5 degrees Celsius.

8. The method of claim 1 , further comprising maintaining a cooling setpoint that is based on an expected wet bulb temperature occurring for one week or more.

9. The method of claim 8 , wherein the cooling setpoint changes over a time duration.

10. The method of claim 1 , further comprising maintaining a setpoint that maintains air around the electronic equipment at a temperature below an expected failure level for the electronic equipment.

11. The method of claim 10 , wherein the setpoint maintains a temperature in a human-occupied space around the electronic equipment above 75 deg. Fahrenheit.

12. The method of claim 1 , further comprising capturing the heated air in one or more common warm air plenums and cooling the heated air with the air-to-water heat exchanger before circulating the cooled air into an occupied workspace around the electronic equipment.

13. The method of claim 12 , further comprising drawing air directly from the workspace into open-front racks that hold the electronic equipment.

14. The method of claim 12 , further comprising routing the captured heated air from the one or more common warm air plenums into an attic space, and delivering the captured air to the workspace using an air handler and a conduit adjacent to the workspace.

15. The method of claim 1 , further comprising controlling flow rates of air through racks using fans located between the volume containing the electronic equipment and one or more common warm air plenums.

16. The method of claim 5 , wherein the cooling towers comprise hybrid cooling towers.

17. The method of claim 1 , wherein the heated air enters the air-to-water heat exchanger at a temperature over 110 deg. Fahrenheit.

18. A method of providing cooled air to electronic equipment, comprising:
heating air drawn from a human-occupiable workspace by a temperature differential of 20 degrees Celsius or more by passing the air over electronic equipment along the height of an equipment rack that houses the electronic equipment,
cooling, by one or more cooling coils, the heated air from the electronic equipment by approximately the same temperature as the temperature differential;
circulating a cooling fluid to the one or more cooling coils, the cooling fluid circulated at a temperature above a dew point temperature of the heated air that enters the one or more cooling coils;
returning the cooled air from the one or more cooling coils to the workspace;
circulating the cooling fluid from the one or more cooling coils to a compressorless and burner-less cooling system; and
transferring heat from the cooling fluid to an ambient environment in the compressorless and burner-less cooling system.

19. The method of claim 18 , further comprising cooling the air using evaporative cooling without using mechanical refrigeration or absorption refrigeration to cool the air.

20. The method of claim 19 , wherein heating the air from the workspace comprises heating the air from about 25 degrees Celsius to more than 45 degrees Celsius.

21. The method of claim 20 , wherein a controlled temperature is at or near a maximum failure preventative temperature for the electronic equipment.

22. The method of claim 18 , wherein the cooled air is returned directly to the workspace after it is cooled by the one or more cooling coils.

23. The method of claim 18 , wherein the electronic equipment comprises a large plurality of rack servers in a data center.

Assignees

• Carlson Andrew B
• Whitted William H
• Clidaras Jimmy
• Hamburgen William
• Aigner Gerald
• Beaty Donald L
• Google Llc

Inventors

• Carlson Andrew B
• Whitted William H
• Clidaras Jimmy
• Hamburgen William
• Aigner Gerald
• Beaty Donald L

Classifications

• H05K7/20836

  Thermal management, e.g. server temperature control · CPC title

• H05K7/20727

  within server blades for removing heat from heat source · CPC title

• F24F11/0001 Primary

  for ventilation (F24F11/30 takes precedence) · CPC title

• H05K7/2079

  within rooms for removing heat from cabinets · CPC title

• H05K5/0213

  Venting apertures; Constructional details thereof · CPC title