Aluminum foil, electronic component wiring board manufactured using the same, and method of manufacturing aluminum foil

Patent metadata

Field	Value
Publication number	US-10706985-B2
Application number	US-201515109760-A
Country	US
Kind code	B2
Filing date	May 26, 2015
Priority date	May 30, 2014
Publication date	Jul 7, 2020
Grant date	Jul 7, 2020

Abstract

An aluminum foil having a high adhesiveness to solder and containing at least one of Sn and Bi, in which a ratio of a total mass of Sn and Bi to a total mass of the aluminum foil is 0.0075 mass % or more and 15 mass % or less.

First claim

The invention claimed is:

1. Aluminum foil consisting of pure aluminum and at least one of Sn and Bi,
a ratio of a total mass of Sn and Bi to a total mass of the aluminum foil being 0.0075 mass % or more and 15 mass % or less; a ratio of a total surface area of Sn and Bi to a total surface area of the aluminum foil is 0.01% or more and 65% or less, and the ratio of the total surface area is 5 times or more a ratio of a total volume of Sn and Bi to a volume of Al.

2. The aluminum foil according to claim 1 , wherein the aluminum foil is tempered in a range from O to 1/4H as defined in JIS-H0001.

3. The aluminum foil according to claim 1 , wherein the aluminum foil is aluminum foil for soldering.

4. An electronic component wiring board manufactured using the aluminum foil according to claim 1 .

5. A method of manufacturing the aluminum foil according to claim 1 , wherein, the method comprises the steps of:
preparing aluminum molten metal;
adding at least one of Sn and Bi to the aluminum molten metal to produce a molten metal mixture in which a ratio of a total mass of Sn and Bi is 0.0075 mass % or more and 15 mass % or less;
forming an ingot or a casting plate using the molten metal mixture;
rolling the ingot or the casting plate to manufacture aluminum foil in which the ratio of the total mass of Sn and Bi is 0.0075 mass % or more and 15 mass % or less, the aluminum foil being tempered in a range from 3/4H to H as defined in JIS-H0001; and
subjecting the aluminum foil to a heat treatment at a temperature of 230° C. or more so as to be tempered.

Assignees

• Toyo Aluminium Kk

Inventors

• Akiyama Sotaro
• Nishio Yoshitaka

Classifications

• B21B1/40 Primary

  for rolling foils which present special problems, e.g. because of thinness · CPC title

• B23K35/288

  with Sn or Zn · CPC title

• B23K35/286

  Al as the principal constituent · CPC title

• H05K2201/0355

  Metal foils · CPC title

• B23K35/0233

  Sheets or foils (B23K35/0244 takes precedence) · CPC title