Plasticity induced bonding

US10703048B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10703048-B2
Application numberUS-201816230403-A
CountryUS
Kind codeB2
Filing dateDec 21, 2018
Priority dateMay 20, 2014
Publication dateJul 7, 2020
Grant dateJul 7, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Methods and apparatuses for bonding polymeric parts are disclosed. Specifically, in one embodiment, the polymeric parts are bonded by plastically deforming them against each other while they are below the glass transition temperatures.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus comprising: a pressing element comprising a roller, the pressing element constructed and arranged to apply a compressive force to a first part in contact with a second part in order to apply a substantially plane strain plastic deformation to the first part and the second part; and a controller in electrical communication with the pressing element, wherein the controller controls the pressing element to apply a compressive stress to the first part and the second part that is greater than a yield strength and less than an ultimate compressive strength of both the first part and the second part, and wherein the controller controls the pressing element to plastically deform the first part and the second part to a compressive plastic strain between about 1% and a compressive strain limit of both the first part and the second part. 2. The apparatus of claim 1 , further comprising one or more sensors associated with the pressing element and in electrical communication with the controller, wherein the controller controls the applied compressive stress and/or compressive strain based on input from the one or more sensors. 3. The apparatus of claim 1 , wherein one or more parameters of the roller are selected such that the roller applies the substantially plane strain plastic deformation to the first part and the second part. 4. The apparatus of claim 1 , further comprising a heating element constructed and arranged to heat at least one of a bonding surface of the first part and the second part while leaving a bulk of the first part below a glass transition temperature of the first part and a bulk of the second part below a glass transition temperature of the second part. 5. The apparatus of claim 1 , wherein the controller controls the compressive stress to be between about 2 and 5 times a yield strength of both the first part and the second part. 6. The apparatus of claim 3 , wherein the one or more parameters of the roller comprise a radius of the roller and/or a rotational speed of the roller. 7. The apparatus of claim 6 , wherein the radius of the roller and/or rotational speed of the roller are selected based on a thickness of the first and second parts. 8. An apparatus comprising: a pressing element constructed and arranged to apply a compressive force to a first part in contact with a second part; and a controller in electrical communication with the pressing element, wherein the controller controls the pressing element to apply a compressive stress to the first part and the second part that is greater than a yield strength and less than an ultimate compressive strength of both the first part and the second part, wherein the controller controls the pressing element to plastically deform the first part and the second part to a compressive plastic strain between about 1% and a compressive strain limit of both the first part and the second part, and wherein the controller controls the pressing element to maintain a temperature of the first and second parts below their respective glass transition temperatures. 9. The apparatus of claim 8 , wherein the pressing element comprises a roller. 10. The apparatus of claim 9 , wherein the roller is constructed and arranged to apply a compressive force to the first part in contact with the second part in order to apply a substantially plane strain plastic deformation to the first part and the second part. 11. An apparatus comprising: a pressing element constructed and arranged to apply a compressive force to a first part in contact with a second part; a controller in electrical communication with the pressing element, wherein the controller controls the pressing element to apply a compressive stress to the first part and the second part that is greater than a yield strength and less than an ultimate compressive strength of both the first part and the second part, and wherein the controller controls the pressing element to plastically deform the first part and the second part to a compressive plastic strain between about 1% and a compressive strain limit of both the first part and the second part; and one or more sensors associated with the pressing element and in electrical communication with the controller, wherein the controller controls the applied compressive stress based on input from the one or more sensors. 12. The apparatus of claim 11 , wherein the pressing element comprises a roller. 13. The apparatus of claim 12 , wherein the roller is constructed and arranged to apply a compressive force to the first part in contact with the second part in order to apply a substantially plane strain plastic deformation to the first part and the second part.

Assignees

Inventors

Classifications

  • B32B37/06Primary

    characterised by the heating method · CPC title

  • the to-be-joined areas of both parts to be joined being semi-crystalline · CPC title

  • lower than said glass transition temperature · CPC title

  • Roller, cylinder or drum types (B29C66/83431 takes precedence; rollers, cylinders or drums moving relative to and tangentially to the parts to be joined B29C66/8362) · CPC title

  • Hardness · CPC title

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Frequently asked questions

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What does patent US10703048B2 cover?
Methods and apparatuses for bonding polymeric parts are disclosed. Specifically, in one embodiment, the polymeric parts are bonded by plastically deforming them against each other while they are below the glass transition temperatures.
Who is the assignee on this patent?
Massachusetts Inst Technology
What technology area does this patent fall under?
Primary CPC classification B32B37/06. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 07 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).