Plasticity induced bonding

Patent metadata

Field	Value
Publication number	US-10213960-B2
Application number	US-201515312446-A
Country	US
Kind code	B2
Filing date	May 20, 2015
Priority date	May 20, 2014
Publication date	Feb 26, 2019
Grant date	Feb 26, 2019

Abstract

Methods and apparatuses for bonding polymeric parts are disclosed. Specifically, in one embodiment, the polymeric parts are bonded by plastically deforming them against each other while they are below the glass transition temperatures. A method includes: placing a first polymeric part in contact with a second polymeric part; and plastically deforming the first polymeric part and the second polymeric part against each other to bond the first polymeric part to the second polymeric part. Additionally, during the plastic deformation, a temperature of the first polymeric part is less than a glass transition temperature of the first polymeric part and a temperature of the second polymeric part is less than a glass transition temperature of the second polymeric part.

First claim

What is claimed is:

1. A method comprising:
placing a first polymeric part in contact with a second polymeric part; and
plastically deforming the first polymeric part and the second polymeric part against each other to bond the first polymeric part to the second polymeric part, wherein a temperature of the first polymeric part is less than a glass transition temperature of the first polymeric part and a temperature of the second polymeric part is less than a glass transition temperature of the second polymeric part during the plastic deformation.

2. The method of claim 1 , wherein plastically deforming the first polymeric part and the second polymeric part further comprises deforming a bulk of the first polymeric part and a bulk of the second polymeric part.

3. The method of claim 1 , wherein the first polymeric part is deformed between about 1% compressive strain and a compressive strain limit of the first polymeric part and the second polymeric part is deformed between about 1% compressive plastic strain and a compressive strain limit of the second polymeric part.

4. The method of claim 1 , wherein the first polymeric part and the second polymeric part are at least partially amorphous.

5. The method of claim 1 , wherein the first polymeric part and the second polymeric part comprise different polymers.

6. The method of claim 5 , wherein the different polymers of the first polymeric part and the second polymeric part form a di-block copolymer.

7. The method of claim 1 , wherein a cross-linking agent is located at an interface between the first polymeric part and a second polymeric part prior to plastic deformation.

8. The method of claim 1 , wherein a third polymeric part is disposed between the first polymeric part and the second polymeric part, wherein the first polymeric part, the second polymeric part, and the third polymeric part deform plastically.

9. The method of claim 1 , further comprising heating at least one of a first bonding surface of the first polymeric part and a second bonding surface of the second polymeric part prior to plastically deforming the first polymeric part and the second polymeric part, wherein a bulk of the first polymeric part remains below a glass transition temperature of the first polymeric part and a bulk of the second polymeric part remains below a glass transition temperature of the second polymeric part.

10. The method of claim 1 , wherein plastically deforming the first polymeric part and the second polymeric part includes applying a compressive stress between the first polymeric part and the second polymeric part, wherein the compressive stress is greater than a yield strength of the first polymeric part and a yield strength of the second polymeric part, wherein the applied compressive stress causes plastic deformation in both the first polymeric part and the second polymeric part, and wherein the compressive stress is less than an ultimate compressive strength of the first polymeric part and an ultimate compressive strength of the second polymeric part, wherein the compressive stress is applied for a sufficient period of time to form a bond between the first polymeric part and the second polymeric part.

11. The method of claim 10 , wherein the period is a sufficient amount of time to plastically deform the first polymeric part between about 1% compressive plastic strain and a compressive strain limit of the first polymeric part and the second polymeric part between about 1% compressive plastic strain and a compressive strain limit of the second polymeric part.

12. The method of claim 10 , wherein the period of time is less than about 1 min.

13. The method of claim 10 , wherein the first polymeric part and the second polymeric part are at least partially amorphous.

14. The method of claim 10 , wherein the first polymeric part and the second polymeric part comprise different polymers.

15. The method of claim 14 , wherein the different polymers of the first polymeric part and the second polymeric part form a di-block copolymer.

16. The method of claim 10 , wherein a cross-linking agent is located on an interface between the first polymeric part and a second polymeric part prior to plastic deformation.

17. The method of claim 10 , wherein a third polymeric part is disposed between the first polymeric part and the second polymeric part, wherein the first polymeric part, the second polymeric part, and the third polymeric part deform plastically.

18. The method of claim 10 , further comprising heating at least one of a first bonding surface of the first polymeric part and a second bonding surface of the second polymeric part prior to plastically deforming the first polymeric part and the second polymeric part, wherein a bulk of the first polymeric part remains below a glass transition temperature of the first polymeric part and a bulk of the second polymeric part remains below a glass transition temperature of the second polymeric part.

19. The method of claim 10 , wherein the compressive stress is between about 2 to 5 times the yield strength of both the first polymeric part and the second polymeric part.

Assignees

• Massachusetts Inst Technology

Inventors

• Padhye Nikhil
• Parks David Moore
• Trout Bernhardt Levy
• Slocum Alexander H

Classifications

• B29C65/8253

  by the use of waves or particle radiation, e.g. visual examination, scanning electron microscopy, or X-rays (B29C65/8292 takes precedence) · CPC title

• B29C65/1432

  direct heating of the surfaces to be joined · CPC title

• B29C66/9221

  by measuring the pressure, the force or the mechanical power · CPC title

• B32B37/10

  characterised by the pressing technique, e.g. using action of vacuum or fluid pressure · CPC title

• B29C66/73121

  Viscosity · CPC title