Polishing pad and polishing apparatus

Patent metadata

Field	Value
Publication number	US-10702970-B2
Application number	US-201815863552-A
Country	US
Kind code	B2
Filing date	Jan 5, 2018
Priority date	Jan 6, 2017
Publication date	Jul 7, 2020
Grant date	Jul 7, 2020

Abstract

The present invention relates to a polishing having a polishing layer, an elastic base layer and a binder layer. The binder layer binds the elastic base layer to the polishing layer. A compressibility of the elastic base layer is greater than a compressibility of the polishing layer. The present invention further provides a polishing apparatus and a method for polishing a substrate.

First claim

What is claimed is:

1. A polishing pad comprising:
a polishing layer including a first polymeric elastomer and a plurality of first pores;
at least one elastic base layer including a second polymeric elastomer and a plurality of second pores, wherein the second pores are substantially in columnar shape, each of the second pores has a top portion and a bottom portion, the bottom portion is closed, the top portion is an opening on a surface of the elastic base layer, and a diameter of the bottom portion is greater than a diameter of the top portion; and
a binder layer binding the elastic base layer to the polishing layer;
wherein a compressibility of the elastic base layer is greater than a compressibility of the polishing layer; and
further includes a film with low permeability, wherein the elastic base layer has a first surface binding to the polishing layer and a second surface opposite the first surface, and the film with low permeability contacts the second surface of the elastic base layer.

2. The polishing pad according to claim 1 , wherein each of the first pores is independent and the first pores are not connected to each other.

3. The polishing pad according to claim 1 , wherein each of the second pores is independent and not connected to each other.

4. The polishing pad according to claim 1 , wherein the first pores are in a ball shape or an oval shape.

5. The polishing pad according to claim 1 , wherein the polishing layer further includes a non-woven fabric.

6. The polishing pad according to claim 1 , which includes a plurality of elastic base layers.

7. The polishing pad according to claim 1 , further includes an adhesive layer, wherein the film with low permeability has a first surface contacting the elastic base layer and a second surface opposite the first surface, and the adhesive layer contacts the second surface of the film with low permeability.

8. A method for polishing a substrate, comprising polishing a surface of the substrate by using the polishing pad according to claim 1 .

9. The method for polishing a substrate according to claim 8 , wherein the surface of the substrate is curved.

10. The method for polishing a substrate according to claim 8 , wherein the surface of the substrate includes 3D structure disposed thereon.

11. A polishing apparatus comprising:
a polishing plate;
a substrate;
the polishing pad according to claim 1 , which is adhered on the polishing plate and adapted for polishing the substrate; and
slurry contacting the substrate for polishing; and
further includes a film with low permeability, wherein the elastic base layer has a first surface binding to the polishing layer and a second surface opposite the first surface, and the film with low permeability contacts the second surface of the elastic base layer.

12. The polishing apparatus according to claim 11 , wherein the surface of the substrate is curved.

13. The polishing apparatus according to claim 11 , wherein the surface of the substrate includes a three-dimensional structure disposed thereon.

14. The polishing apparatus according to claim 11 , wherein each of the first pores or the second pores is independent and the first pores or the second pores are not connected to each other.

15. The polishing apparatus according to claim 11 , wherein the first pores are in a ball shape or an oval shape.

16. The polishing apparatus according to claim 11 , wherein the polishing layer further includes a non-woven fabric.

17. The polishing apparatus according to claim 11 , which includes a plurality of elastic base layers.

18. The polishing apparatus according to claim 11 , further includes an adhesive layer, wherein the film with low permeability has a first surface contacting the elastic base layer and a second surface opposite the first surface, and the adhesive layer contacts the second surface of the film with low permeability.

Assignees

• San Fang Chemical Ind Co Ltd

Inventors

• Feng Chung-Chih
• Yao I-Peng
• Wang Lyang-Gung
• Liu Wei-Te
• Wu Wen-Chieh
• Hung Yung-Chang

Classifications

• H10P52/402

  of semiconductor materials · CPC title

• B24B37/24

  characterised by the composition or properties of the pad materials · CPC title

• B24B37/107 Primary

  in a rotary movement only, about an axis being stationary during lapping · CPC title

• B24B37/22 Primary

  characterised by a multi-layered structure · CPC title

• B24D3/32

  for porous or cellular structure · CPC title