LED module with a stabilized leadframe

Patent metadata

Field	Value
Publication number	US-10700251-B2
Application number	US-201816229627-A
Country	US
Kind code	B2
Filing date	Dec 21, 2018
Priority date	Dec 22, 2017
Publication date	Jun 30, 2020
Grant date	Jun 30, 2020

Abstract

A LED module for use in a LED light, preferably a LED retrofit lamp, has a leadframe and one or more LEDs which are electrically and mechanically connected to the leadframe. The LED module has one or more stabilizing sections made from an insulating material which are introduced locally, preferably in a punctiform and/or linear manner, into intermediate spaces of the leadframe in order to fasten sections of the leadframe to one another and, preferably, to space them apart from one another.

First claim

The invention claimed is:

1. A light-emitting diode (LED module for use in a LED light, the LED module comprising:
a leadframe having a plurality of sections, wherein the plurality of sections define intermediate spaces in the leadframe;
a plurality of LEDs that are electrically and mechanically connected to the leadframe; and
a plurality of stabilizing sections which are physically separate and individually distinguishable from one another and made from an insulating material, wherein the plurality of stabilizing sections is introduced locally into the intermediate spaces of the leadframe, and wherein the plurality of stabilizing sections fastens the plurality of sections of the leadframe to one another.

2. The LED module according to claim 1 , wherein the plurality of stabilizing sections is introduced locally in a punctiform manner.

3. The LED module according to claim 1 , wherein the insulating material is at least one material selected from the group consisting of a polymer, a glass, a ceramic, and a surface-mounted device (SMD) component with insulating properties.

4. The LED module according to claim 1 , wherein at least one surface of the leadframe substantially has no contact with the insulating material of the plurality of stabilizing sections.

5. The LED module according to claim 4 , wherein the at least one surface of the leadframe is substantially uncovered.

6. The LED module according to claim 1 , wherein the intermediate spaces of the leadframe are electrically insulating and are not filled, in that the intermediate spaces completely penetrate the leadframe in a direction of a thickness of the leadframe.

7. The LED module according to claim 1 , wherein the leadframe is at least partially bent.

8. The LED module according to claim 7 , wherein two of the sections of the plurality of sections of the leadframe are bent towards one another, wherein the two of the sections are spaced apart and connected by the plurality of the stabilizing sections.

9. The LED module according to claim 1 , wherein the leadframe is equipped with LEDs on a first side of the leadframe and on an opposing second side of the leadframe.

10. The LED module according to claim 1 , wherein the LEDs are arranged in at least one manner selected from the group consisting of lattice-like, linear, and circular.

11. The LED module according to claim 1 , wherein the LEDs are:
connected by the leadframe in series; or
connected by the leadframe in a combination of series and parallel connections.

12. A method for producing the LED module according to claim 1 , the method comprising:
producing the leadframe from a sheet using a process selected from the group consisting of stamping, cutting, and etching;
equipping the leadframe with the LEDs by connecting the LEDs electrically and mechanically to the leadframe; and
stabilizing the leadframe by local introduction of the insulating material into the intermediate spaces of the leadframe so that the stabilizing sections are formed.

13. The method according to claim 12 , wherein producing the leadframe involves keeping connection bars and transport sections attached to the leadframe, wherein the connection bars and transport sections are not part of a finished form of the LED module.

14. The method according to claim 12 , wherein the insulating material is at least one material selected from the group consisting of a polymer, a glass, a ceramic, a cement, and an insulating surface-mounted device (SMD) component with insulating properties.

15. The method according to claim 12 , wherein the leadframe is not encapsulated, partially or completely, by a substrate material.

16. The method according to claim 12 , further comprising roughening at least one surface of the leadframe.

17. The method according to claim 12 , further comprising coating at least one surface of the leadframe with a material selected from the group consisting of tin (Sn), gold (Au), silver (Ag), platinum (Pt), palladium (Pd), zinc (Zn), and nickel (Ni).

18. The method according to claim 12 , further comprising finishing at least one surface of the leadframe with at least one finish selected from the group consisting of a light-reflecting coating, an engraving, a laser engraving, and a photochemical etched structure.

19. The method according to claim 12 , further comprising bending the leadframe.

20. The LED module according to claim 1 , wherein the plurality of stabilizing sections is introduced locally in a linear manner.

21. The LED module according to claim 1 , wherein the plurality of stabilizing sections does not overlap to form a structure on an order of magnitude of the leadframe.

Assignees

• Ledvance Gmbh

Inventors

• Lang Heinz
• Rosenbauer Georg

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W70/048

  Mechanical treatments, e.g. punching, cutting, deforming or cold welding · CPC title

• H10W70/042

  Etching · CPC title

• H10H20/8585

  being an interconnection · CPC title

• H10H20/0364

  of interconnections · CPC title