Computing devices with an adhered cover and methods of manufacturing thereof

Patent metadata

Field	Value
Publication number	US-10698443-B2
Application number	US-201715691965-A
Country	US
Kind code	B2
Filing date	Aug 31, 2017
Priority date	May 1, 2017
Publication date	Jun 30, 2020
Grant date	Jun 30, 2020

Abstract

A computing device is described. The computing device includes a support structure with an interface surface that has a cross-sectional width. The computing device includes a cover adhered to the interface surface of the support structure along an entirety of the cross-sectional width of the interface surface. A method of manufacturing a computing device is described. The method includes applying an adhesive to a cover. A support structure of a computing device is heated. The support structure is cooled. While the support structure is heated and cooled, pressure is applied to the cover.

First claim

What is claimed is:

1. A computing device, comprising:
a support structure having an interface surface with a cross-sectional width, the interface surface extending to a peripheral edge of the computing device;
a heat activated adhesive applied to the interface surface, wherein the heat activated adhesive is configured to be activated by heating the heat activated adhesive to above 100 degrees Celsius for at least 150 seconds; and
a cover adhered to the interface surface of the support structure along an entirety of the cross-sectional width of the interface surface to the peripheral edge by the heat activated adhesive, the heat activated adhesive being separate from the cover.

2. The computing device of claim 1 , wherein the cross-sectional width is between 0.8 mm and 1.5 mm.

3. The computing device of claim 1 , wherein the interface surface is flat.

4. The computing device of claim 1 , wherein the interface surface has a length of greater than 100 mm.

5. The computing device of claim 1 , wherein the interface surface extends around a majority of an edge of the computing device.

6. The computing device of claim 1 , wherein the cover is microfiber fabric.

7. The computing device of claim 1 , wherein the heat activated adhesive is a heat activated film.

8. The computing device of claim 1 , wherein the support structure includes a surface treatment.

9. A computing device, comprising:
a support structure having a flat interface surface with a cross-sectional width between 0.8 mm and 1.5 mm and a length of greater than 100 mm, the flat interface surface extending to a peripheral edge of the computing device;
a heat activated film applied to the interface surface, wherein the heat activated film is configured to be activated by heating the heat activated adhesive to above 100 degrees Celsius for at least 150 seconds; and
a microfiber fabric cover affixed to the interface surface of the support structure along an entirety of the cross-sectional width of the interface surface to the peripheral edge and around a majority of the peripheral edge of the computing device with the heat activated film, a modulus of elasticity of the cover is less than a modulus of elasticity of the interface surface, the cover being an outermost surface of the computing device in an open configuration.

10. A method of manufacturing a computing device, comprising:
applying an adhesive to a cover;
actively heating a first portion of a support structure of a computing device;
while actively heating the support structure of the computing device, applying pressure to the cover;
while actively heating the support structure of the computing device at a first location, actively cooling a second portion of the support structure of the computing device at a second location; and
while actively cooling the support structure of the computing device, applying pressure to the cover.

11. The method of claim 10 , wherein the adhesive is a heat activated adhesive and wherein heating the support structure of the computing device includes using a heating source of between 150 and 260 degrees Celsius.

12. The method of claim 10 , wherein the heating source includes heat sources on a top surface of the support structure.

13. The method of claim 10 , wherein the heating source includes heat sources on one or more of a bottom surface of the support structure and a side surface of the support structure.

14. The method of claim 10 , wherein actively cooling the support structure of the computing device includes using a plurality of cooling sources.

15. The method of claim 10 , wherein cooling the support structure of
the computing device includes using a cooling source of between 5 and 15 degrees Celsius.

16. The method of claim 10 , wherein applying pressure to the cover
further comprises applying pressure with a press and wherein the press is a closed loop load cell.

17. The method of claim 10 , further comprising, after
applying the adhesive to the cover, locating the computing device prior to heating and cooling the support structure of the computing device.

18. The method of claim 10 , wherein heating the support structure of a
computing device includes using closed loop feedback.

19. The method of claim 10 , further comprising, after
applying pressure to the cover, transferring the cover and the computing device to a cooling press.

20. The computing device of claim 1 , wherein at least a portion of the heat activated adhesive extends to the peripheral edge of the computing device.

Assignees

• Microsoft Technology Licensing Llc

Inventors

• Evans Ryan Travis
• Schultz Iii Bernard Maurice
• Tripard Jason Edward
• Shah Ketan R

Classifications

• H10W76/67

  characterised by their materials · CPC title

• H10W76/12

  characterised by their shape · CPC title

• H10W72/07252

  changes in structures or sizes · CPC title

• H10W72/221

  Structures or relative sizes · CPC title

• H10W76/60

  Seals · CPC title