Plating method

Patent metadata

Field	Value
Publication number	US-10689761-B2
Application number	US-201816024913-A
Country	US
Kind code	B2
Filing date	Jul 2, 2018
Priority date	Jul 14, 2017
Publication date	Jun 23, 2020
Grant date	Jun 23, 2020

Abstract

A plating method includes a first mask forming step of ejecting a UV-curable ink in the form of ink droplets from an inkjet head so as to have the ejected ink droplets land on a plating target object and to form a first plating mask on the plating target object, a catalyst applying step of applying a catalyst for deposition of plating material to the plating target object on which the first plating mask is formed, a second mask forming step of having the ink droplets land on the first plating mask so as to form a second plating mask on the first plating mask, a plating step of performing electroless plating to the plating target object subsequent to the second mask forming step, and a mask removing step of removing the first plating mask and the second plating mask from the plating target object subsequent to the plating step.

First claim

What is claimed is:

1. A plating method, comprising:
a first mask forming step of forming a first plating mask on a plating target object, the first plating mask being formed to prevent a catalyst for deposition of plating material from attaching to the plating target object;
a surface roughening step of subjecting the plating target object to a surface roughening treatment, wherein the surface roughening treatment is at least one of etching and sandblasting;
a catalyst applying step of applying the catalyst to the plating target object on which the first plating mask is formed;
a second mask forming step of having ink droplets of a UV-curable ink land on the first plating mask so as to form a second plating mask on the first plating mask;
a plating step of performing electroless plating to the plating target object subsequent to the second mask forming step; and
a mask removing step of removing the first plating mask and the second plating mask from the plating target object subsequent to the plating step,
wherein an aqueous plating solution is used in the plating step,
the first mask forming step is a step of ejecting the UV-curable ink in the form of ink droplets from an inkjet head so as to have the ejected ink droplets land on the plating target object, and the landed UV-curable ink is irradiated with ultraviolet light so as to cure,
the UV-curable ink is polymerizable by ultraviolet irradiation into a UV-curable resin, and the UV-curable ink is aqueous solution-insoluble and organic solvent-soluble after curing.

2. A plating method, comprising:
a surface roughening step of subjecting a plating target object to a surface roughening treatment, wherein the surface roughening treatment is at least one of etching and sandblasting;
a catalyst applying step of applying a catalyst for deposition of plating material to the plating target object;
a mask forming step of ejecting a UV-curable ink in the form of ink droplets from an inkjet head so as to have the ejected ink droplets land on the plating target object and to form a plating mask on the plating target object;
a plating step of performing plating to the plating target object subsequent to the mask forming step; and
a mask removing step of removing the plating mask from the plating target object subsequent to the plating step,
wherein an aqueous plating solution is used in the plating step,
the UV-curable ink is a UV-curable and solvent-soluble ink, the UV-curable and solvent-soluble ink comprising:
a UV-curable compound polymerizable by ultraviolet irradiation into a UV-curable resin; and
a solvent-soluble material soluble in a solvent, and
the UV-curable ink is aqueous solution-insoluble and organic solvent-soluble after curing.

3. The plating method according to claim 1 , wherein the UV-curable ink further comprises an organic solvent having compatibility with the UV-curable compound.

4. The plating method according to claim 1 , wherein the catalyst applying step is a wet process, and the plating step is a wet process.

5. The plating method according to claim 2 , wherein the UV-curable ink further comprises an organic solvent having compatibility with the UV-curable compound.

6. The plating method according to claim 2 , wherein the catalyst applying step is a wet process, and the plating step is a wet process.

Assignees

• Mimaki Eng Co Ltd

Inventors

• Ohnishi Masaru

Classifications

• C23C18/1893

  with use of organic or inorganic compounds other than metals, first · CPC title

• C23C18/22

  Roughening, e.g. by etching · CPC title

• C23C18/2086

  with use of organic or inorganic compounds other than metals, first · CPC title

• C23C18/1605 Primary

  by masking · CPC title

• C23C18/18

  Pretreatment of the material to be coated · CPC title