Silicon-containing resin composition

Patent metadata

Field	Value
Publication number	US-10689514-B2
Application number	US-201615740227-A
Country	US
Kind code	B2
Filing date	Jul 8, 2016
Priority date	Jul 9, 2015
Publication date	Jun 23, 2020
Grant date	Jun 23, 2020

Abstract

A silicon-containing resin composition with which it is possible to form a silica-based coating film in which generation of cracks is minimized, a method for forming a silica-based coating film using the silicon-containing resin composition, and a crack-free silica-based coating film formed using the silicon-containing resin composition. The silicon-containing resin composition includes a silicon-containing resin and a solvent, in which one or more of siloxane resins and polysilanes is used as the silicon-containing resin, and the solvent contains a cycloalkyl acetate having a specific structure.

First claim

The invention claimed is:

1. A silicon-containing resin composition comprising a silicon-containing resin, a nitroxy compound, and a solvent,
wherein the silicon-containing resin is one or more selected from the group consisting of a siloxane resin and a polysilane, and
the solvent contains a cycloalkyl acetate represented by the following formula (S1):

wherein R s1 represents an alkyl group having 1 to 3 carbon atoms; p is an integer of 1 to 6; and q is an integer of 0 to (p+1) and
a content of the cycloalkyl acetate represented by the above formula (S1) in the solvent is 30 to 100% by mass.

2. The silicon-containing resin composition according to claim 1 , further comprising a curing agent.

3. The silicon-containing resin composition according to claim 2 , wherein the curing agent comprises at least one curing agent selected from the group consisting of curing agents that generate a base component by the action of light or heat, Brønsted acids, imidazoles, organic amines, organophosphorus compounds, organophosphorus compound complexes, complexes of a Lewis acid and an organic amine, and amidines.

4. A method for forming a silica-based coating film, comprising:
applying the silicon-containing resin composition according to claim 1 to a substrate to form a coating film; and
baking the coating film.

5. The method for forming a silica-based coating film according to claim 4 , wherein the silica-based coating film has a film thickness of 0.01 to 20 μm.

6. A method for forming a silica-based coating film, comprising:
applying the silicon-containing resin composition according to claim 2 to a substrate to form a coating film; and
baking the coating film.

7. The method for forming a silica-based coating film according to claim 6 , wherein the silica-based coating film has a film thickness of 0.01 to 20 μm.

Assignees

• Tokyo Ohka Kogyo Co Ltd

Inventors

• Chisaka Hiroki
• Kuroko Mayumi
• Noda Kunihiro
• Shiota Dai

Classifications

• C08L83/04 Primary

  Polysiloxanes · CPC title

• C08K5/32

  Compounds containing nitrogen bound to oxygen · CPC title

• C08K5/10

  Esters; Ether-esters · CPC title

• C08G77/04 Primary

  Polysiloxanes · CPC title

• C08G77/60

  in which all the silicon atoms are connected by linkages other than oxygen atoms · CPC title