Method for producing piezoelectric multi-layered components

Patent metadata

Field	Value
Publication number	US-10686121-B2
Application number	US-201615547055-A
Country	US
Kind code	B2
Filing date	Jan 13, 2016
Priority date	Jan 29, 2015
Publication date	Jun 16, 2020
Grant date	Jun 16, 2020

Abstract

The present invention relates to a method for producing piezoelectric multi-layered components (2), which comprises the following steps: applying an electrode material (5) to green sheets (3) containing a piezoelectric material, applying a layer of a first auxiliary material (9) to at least one green sheet (3) containing the piezoelectric material, forming a stack (1), in which the green sheets (3), to which electrode material (5) is applied, are arranged one on top of another, wherein at least one ply of the green sheet (3), to which the layer of the first auxiliary material (9) is applied, is arranged in the stack (1), sintering the stack (1), wherein the layer of the first auxiliary material (9) is thinned, and firing the stack (1), wherein the stack (1) is singulated along the at least one ply into at least two multi-layered components (2).

First claim

The invention claimed is:

1. A method for producing piezoelectric multi-layered components, comprising the following steps:
A. applying an electrode material to green sheets containing a piezoelectric material,
B. applying a layer of a first auxiliary material to at least one green sheet containing the piezoelectric material,
C. forming a stack, in which the green sheets, to which electrode material is applied, are arranged one on top of another, wherein at least one ply of the green sheet, to which the layer of the first auxiliary material is applied, is arranged in the stack,
D. sintering the stack, wherein the layer of the first auxiliary material is thinned, and
E. firing the stack, wherein the stack is singulated along the at least one ply during the firing into at least two multi-layered components.

2. The method according to claim 1 , wherein the firing of the stack is effected at a temperature which is increased by 10 to 30° C. per minute until a maximum firing temperature is reached.

3. The method according to claim 2 , wherein, during the firing of the stack, the temperature is reduced by 10 to 30° C. per minute after the maximum firing temperature has been reached.

4. The method according to claim 2 , wherein the maximum firing temperature is between 720° C. and 800° C., preferably between 750° C. and 770° C.

5. The method according to claim 1 ,
wherein the first auxiliary material contains at least a first component and a second component, which react chemically with one another in method step D).

6. The method according to claim 5 , wherein CuO is selected as the first component and Cu is selected as the second component.

7. The method according to claim 1 , wherein the first auxiliary material comprises an inert inorganic material.

8. The method according to claim 7 , wherein the inert inorganic material is zirconium(IV) oxide.

9. The method according to claim 7 , wherein the proportion of the inert inorganic material in the first auxiliary material is at least 40% by weight.

10. The method according to claim 1 ,
wherein, in method step C), furthermore at least one ply of a green sheet, which contains the piezoelectric material and to which a layer of a second auxiliary material is applied, is arranged in the stack,
wherein, in method step D), the at least one layer made of the second auxiliary material is thinned, such that a weakening layer is formed in the multi-layered component in the region of the layer made of the second auxiliary material.

11. The method according to claim 10 ,
wherein the first auxiliary material comprises an inert inorganic material,
wherein the first auxiliary material and the second auxiliary material comprise the same constituents, and
wherein the proportion of the inert inorganic material is higher in the first auxiliary material than in the second auxiliary material.

12. The method according to claim 1 , wherein, after method step D) and before the singulation into at least two multi-layered components in method step E), further processing steps are carried out, in which the multi-layered components are treated in the single-piece stack.

13. The method according to claim 1 , wherein, before the singulation into at least two multi-layered components, edges of the stack are ground, wherein a grinding pressure is set in such a manner that singulation does not occur during the grinding.

14. The method according to claim 1 , wherein the singulation during the firing is initiated by the previous weakening of the layer of the first auxiliary material during the sintering and by a temperature shock which is generated during the firing by rapid changes in temperature.

15. A method for producing piezoelectric multi-layered components, comprising the following steps:
A. applying an electrode material to green sheets containing a piezoelectric material,
B. applying a layer of a first auxiliary material to at least one green sheet containing the piezoelectric material,
C. forming a stack, in which the green sheets, to which electrode material is applied, are arranged one on top of another, wherein at least one ply of the green sheet, to which the layer of the first auxiliary material is applied, is arranged in the stack,
D. sintering the stack, wherein the layer of the first auxiliary material is thinned, and
E. firing the stack, wherein the stack is singulated along the at least one ply into at least two multi-layered components, wherein the singulation during the firing is initiated by the previous weakening of the layer of the first auxiliary material during the sintering and by a temperature shock which is generated during the firing by rapid changes in temperature.

16. A method for producing piezoelectric multi-layered components, comprising the following steps:
A. applying an electrode material to green sheets containing a piezoelectric material,
B. applying a layer of a first auxiliary material to at least one green sheet containing the piezoelectric material, wherein the first auxiliary material comprises an inert inorganic material and the proportion of the inert inorganic material in the first auxiliary material is at least 40% by weight,
C. forming a stack, in which the green sheets, to which electrode material is applied, are arranged one on top of another, wherein at least one ply of the green sheet, to which the layer of the first auxiliary material is applied, is arranged in the stack,
D. sintering the stack, wherein the layer of the first auxiliary material is thinned, and
E. firing the stack, wherein the stack is singulated along the at least one ply into at least two multi-layered components.

Assignees

• Epcos Ag

Inventors

• Ottlinger Marion
• Windisch Peter

Classifications

• H10N30/08

  Shaping or machining of piezoelectric or electrostrictive bodies · CPC title

• H10N30/067

  Forming single-layered electrodes of multilayered piezoelectric or electrostrictive parts · CPC title

• H10N30/053 Primary

  by integrally sintering piezoelectric or electrostrictive bodies and electrodes · CPC title

• H10N30/87

  Electrodes or interconnections, e.g. leads or terminals · CPC title

• H10N30/8554

  Lead-zirconium titanate [PZT] based · CPC title