Chip card body, chip card and method for producing a chip card body

Patent metadata

Field	Value
Publication number	US-10685277-B2
Application number	US-201816226902-A
Country	US
Kind code	B2
Filing date	Dec 20, 2018
Priority date	Dec 21, 2017
Publication date	Jun 16, 2020
Grant date	Jun 16, 2020

Abstract

A chip card body including a metal plate, a reception region in the metal plate for receiving a chip and configured for inductive coupling of the metal plate to a chip received in the reception region; and at least one through-opening in the metal plate and configured such that at least a part of the metal plate acts as an antenna for delivering an electromagnetic signal to the reception region.

First claim

The invention claimed is:

1. A chip card body, comprising:
a metal plate;
a capacitor monolithically integrated in the metal plate;
a reception region in the metal plate for receiving a chip and configured for inductive coupling of the metal plate to a chip received in the reception region; and
at least one through-opening in the metal plate configured such that at least a part of the metal plate acts as an antenna for delivering an electromagnetic signal to the reception region.

2. The chip card body as claimed in claim 1 , wherein the capacitor has a capacitance in a range of from approximately 800 pF to approximately 3 nF.

3. The chip card body as claimed in claim 1 , wherein the at least one through-opening in the metal plate is configured as at least one slit in the metal plate.

4. The chip card body as claimed in claim 3 , wherein the at least one slit has a slit width in a range of from approximately 10 μm to approximately 1 mm.

5. The chip card body as claimed in claim 1 , further comprising:
an electromagnetic adaptation structure configured to form a target electromagnetic impedance.

6. The chip card body as claimed in claim 5 , wherein the electromagnetic adaptation structure is monolithically integrated in the metal plate.

7. The chip card body as claimed in claim 1 , wherein the chip card body is essentially formed by the metal plate.

8. The chip card body as claimed in claim 1 , wherein the at least one through-opening is filled with an electrically insulating material.

9. A chip card, comprising:
a chip card body as claimed in claim 1 .

10. The chip card as claimed in claim 9 , further comprising:
a chip provided in the reception region and mechanically coupled to the metal plate.

11. The chip card as claimed in claim 10 , further comprising:
an electrically insulating material mechanically coupling the chip to the metal plate.

12. The chip card body as claimed in claim 1 , wherein the monolithically integrated capacitor is formed from the at least one through-opening.

13. The chip card body as claimed in claim 12 , wherein the at least one through-opening is a meandering slit having a comb-like structure.

14. A chip card body, comprising:
a metal plate;
a reception region in the metal plate for receiving a chip and configured for inductive coupling of the metal plate to a chip received in the reception region; and
a plurality of slits in a same layer of the metal plate and configured such that at least a part of the metal plate acts as an antenna for delivering an electromagnetic signal to the reception region.

15. A method for producing a chip card body, the method comprising:
providing a metal plate;
forming in the metal plate a monolithically integrated capacitor;
forming in the metal plate a reception region for receiving a chip and configured for inductive coupling of the metal plate to a chip received in the reception region;
forming in the metal plate at least one through-opening configured such that at least a part of the metal plate acts as an antenna for delivering an electromagnetic signal to the reception region.

16. The method as claimed in claim 15 , wherein the at least one through-opening is formed in the metal plate by means of a laser.

17. The method as claimed in claim 15 , further comprising:
forming the monolithically integrated capacitor from the at least one through-opening.

18. The method as claimed in claim 17 , further comprising:
forming the at least one through-opening as a meandering slit having a comb-like structure.

Assignees

• Infineon Technologies Ag

Inventors

• Pachler Walther

Classifications

• B23K26/40 Primary

  taking account of the properties of the material involved · CPC title

• B23K26/386

  of blind holes · CPC title

• B23K26/362

  Laser etching · CPC title

• B23K2103/08

  Non-ferrous metals or alloys · CPC title

• B23K26/382

  by boring · CPC title